Blue LED Emitter
LZ4-00B208
Key Features
High flux output Blue 457nm LED
3.9W or 14.5 umol/ at 9W power dissipation
Ultra-small foot print – 7.0mm x 7.0mm
Surface mount ceramic package with integrated glass lens
Low Thermal Resistance (2.8°C/W)
Individually addressable die
Very high Luminous Flux density
JEDEC Level 1 for Moisture Sensitivity Level
Autoclave complaint (JEDEC JESD22-A102-C)
Lead (Pb) free and RoHS compliant
Reflow solderable (up to 6 cycles)
Emitter available on Standard MCPCB (optional)
Typical Applications
Architectural lighting
Automotive and Marine lighting
Stage and Studio lighting
Horticulture
Emergency lighting
Buoys
Beacons
Airfield lighting and signs
Description
The LZ4-00B208 Blue LED emitter provides 9W power in an extremely small package. With a 7.0mm x 7.0mm
ultra-small footprint, this package provides exceptional luminous flux density. LED Engin’s LZ4-00B208 LED offers
ultimate design flexibility with individually addressable die. The patent-pending design has unparalleled thermal
and optical performance and excellent UV resistance. The high quality materials used in the package are chosen to
optimize light output and minimize stresses which results in monumental reliability and lumen maintenance. The
robust product design thrives in outdoor applications with high ambient temperatures and high humidity.
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LZ4-00B208 (1.5 - 11/19/2018)
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Part number options
Base part number
Part number
Description
LZ4-00B208-xxxx
LZ4 emitter
LZ4-40B208-xxxx
LZ4 emitter on Standard Star 1 channel MCPCB
Bin kit option codes
B2, Blue (460nm)
Kit number
suffix
Min
flux
Bin
Color Bin Range
Description
0000
L
B3 – B4
full distribution flux; full distribution
wavelength
Notes:
1.
Default bin kit option is -0000
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Luminous Flux Bins
Table 1:
Bin Code
Minimum
Luminous Flux (ΦV)
@ IF = 700mA [1]
(lm)
Maximum
Luminous Flux (ΦV)
@ IF = 700mA [1]
(lm)
L
93
117
M
117
146
N
146
182
P
182
228
Notes for Table 1:
1.
Luminous flux performance is measured at 10ms pulse, T C = 25°C. LED Engin maintains a tolerance of ± 10% on flux measurements.
Dominant Wavelength Bins
Table 2:
Bin Code
Minimum
Dominant Wavelength (λD)
@ IF = 700mA [1,2]
(nm)
Maximum
Dominant Wavelength (λD)
@ IF = 700mA [1,2]
(nm)
B3
450
455
B4
455
460
Notes for Table 2:
o
1.
Dominant wavelength is measured at 10ms pulse, TC = 25 C. LED Engin maintains a tolerance of ± 1.0nm on peak wavelength measurements.
2.
Dominant wavelength is derived from the CIE 1931 Chromaticity Diagram and represents the perceived hue.
Forward Voltage Bins
Table 3:
Bin Code
Minimum
Forward Voltage (VF)
@ IF = 700mA [1,2]
(V)
Maximum
Forward Voltage (VF)
@ IF = 700mA [1,2]
(V)
0
11.2
15.2
Notes for Table 3:
1.
Forward Voltage is binned with all four LED dice connected in series.
o
2.
Forward voltage is measured at 10ms pulse, T C = 25 C. LED Engin maintains a tolerance of ± 0.16V for forward voltage measurements for the four LEDs.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Absolute Maximum Ratings
Table 4:
Parameter
Symbol
Value
Unit
IF
IFP
VR
Tstg
TJ
Tsol
1000
1500
See Note 3
-40 ~ +150
150
260
6
mA
mA
V
°C
°C
°C
[1]
DC Forward Current
Peak Pulsed Forward Current [2]
Reverse Voltage
Storage Temperature
Junction Temperature
Soldering Temperature [4]
Allowable Reflow Cycles
121°C at 2 ATM,
100% RH for 168 hours
Autoclave Conditions [5]
Notes for Table 4:
1.
Maximum DC forward current (per die) is determined by the overall thermal resistance and ambient temperature. Follow the curv es in Figure 10 for current
de-rating.
2:
Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%.
3.
LEDs are not designed to be reverse biased.
4.
Solder conditions per JEDEC 020c. See Reflow Soldering Profile Figure 3.
5.
Autoclave Conditions per JEDEC JESD22-A102-C.
6.
LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ4-00B208 in an electrostatic protected area (EPA).
An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.
Optical Characteristics @ TC = 25°C
Table 5:
Parameter
Symbol
Typical
Unit
Luminous Flux (@ IF = 700mA/ 1000mA) [1]
Radiant Flux (@ IF = 700mA/ 1000mA) [1]
[2]
PPF 400-700nm (@ IF = 700mA/ 1000mA)
Wall Plug Efficiency (@ IF = 350mA)
Dominant Wavelength [3]
Peak Wavelength
Viewing Angle [4]
Total Included Angle [5]
ΦV
Φ
145/195
3.9/ 5.3
14.5/ 19.5
52
457
453
100
120
lm
W
umol/s
%
nm
nm
Degrees
Degrees
Ƞ
λD
λP
2Θ½
Θ0.9
Notes for Table 5:
1.
Luminous flux typical value is for all four LED dice operating concurrently at rated current.
2.
PPF is Photosynthetic Photon Flux
3.
Observe IEC 60825-1 class 2 rating for eye safety. Do not stare into the beam.
4.
Viewing Angle is the off axis angle from emitter centerline where the luminous intensity is ½ of the peak value.
5.
Total Included Angle is the total angle that includes 90% of the total luminous flux.
Electrical Characteristics @ TC = 25°C
Table 6:
Parameter
Symbol
Typical
Unit
Forward Voltage (@ IF = 700mA) [1]
Forward Voltage (@ IF = 1000mA) [1]
VF
VF
12.8
13.2
V
V
Temperature Coefficient
of Forward Voltage [1]
ΔVF/ΔTJ
-9.6
mV/°C
Thermal Resistance
(Junction to Case)
RΘJ-C
2.8
°C/W
Notes for Table 6:
1.
Forward Voltage typical value is for all four LED dice connected in series.
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IPC/JEDEC Moisture Sensitivity Level
Table 7 - IPC/JEDEC J-STD-20 MSL Classification:
Soak Requirements
Floor Life
Standard
Accelerated
Level
Time
Conditions
Time (hrs)
Conditions
Time (hrs)
Conditions
1
Unlimited
≤ 30°C/
85% RH
168
+5/-0
85°C/
85% RH
n/a
n/a
Notes for Table 7:
1.
The standard soak time is the sum of the default value of 24 hours for the semiconductor manufacturer’s exposure time (MET) between bake and bag
and the floor life of maximum time allowed out of the bag at the end user of distributor’s facility.
Average Lumen Maintenance Projections
Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for
solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original
light output remaining at a defined time period.
Based on long-term WHTOL testing, LED Engin projects that the LZ Series will deliver, on average, 70% Lumen
Maintenance at 65,000 hours of operation at a forward current of 700 mA per die. This projection is based on
constant current operation with junction temperature maintained at or below 125°C.
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Mechanical Dimensions (mm)
Pin Out
Pad
Die
1
A
Anode
2
A
Cathode
3
B
Anode
4
B
Cathode
5
C
Anode
6
C
Cathode
7
D
Anode
8
D
Cathode
9 [2]
n/a
Thermal
1
2
Function
3
8
4
Figure 1: Package outline drawing.
Notes for Figure 1:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
2.
Thermal contact, Pad 9, is electrically neutral.
7
6
5
Recommended Solder Pad Layout (mm)
Non-pedestal MCPCB Design
Pedestal MCPCB Design
Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad for non-pedestal and pedestal design
Note for Figure 2a:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
2.
Pedestal MCPCB allows the emitter thermal slug to be soldered directly to the metal core of the MCPCB. Such MCPCB eliminate t he high thermal
resistance dielectric layer that standard MCPCB technologies use in between the emitter thermal slug and the metal core of the MCPCB, thus lowering
the overall system thermal resistance.
3.
LED Engin recommends x-ray sample monitoring for solder voids underneath the emitter thermal slug. The total area covered by solder voids should be
less than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to
higher failure rates due to thermal over stress.
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Recommended Solder Mask Layout (mm)
Non-pedestal MCPCB Design
Pedestal MCPCB Design
Figure 2b: Recommended solder mask opening for anode, cathode, and thermal pad for non-pedestal and pedestal design
Note for Figure 2b:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
Recommended 8 mil Stencil Apertures Layout (mm)
Non-pedestal MCPCB Design
Pedestal MCPCB Design
Figure 2c: Recommended 8mil stencil apertures for anode, cathode, and thermal pad for non-pedestal and pedestal design
Note for Figure 2c:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
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Reflow Soldering Profile
Figure 3: Reflow soldering profile for lead free soldering.
Typical Radiation Pattern
100%
90%
80%
Relatiive Intensity
70%
60%
50%
40%
30%
20%
10%
0%
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10
20
30
40
50
60
70
80
90
Angular Displacement (Degrees)
Figure 4: Typical representative spatial radiation pattern @ TC = 25°C.
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Typical Relative Spectral Power Distribution
1.0
0.9
Relative Spectral Power
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
400
450
500
550
600
650
700
Wavelength (nm)
Figure 5: Typical relative spectral power vs. wavelength @ T C = 25°C.
Typical Forward Current Characteristics
1,200
IF - Forward Current (mA)
1,000
800
600
400
200
0
10.0
11.0
12.0
13.0
14.0
15.0
VF - Forward Voltage (V)
Figure 6: Typical forward current vs. forward voltage @ T C = 25°C.
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Typical Relative Light Output over Current
160
Relative Light Output (%)
140
120
100
80
60
40
20
0
0
200
400
600
800
1000
1200
IF - Forward Current (mA)
Figure 7: Typical relative light output vs. forward current @ T C = 25°C.
Typical Relative Light Output over Temperature
140%
Relative Light Output
120%
100%
80%
60%
40%
20%
0%
0
20
40
60
80
100
120
TC - Case Temperature (oC)
Figure 8: Typical relative light output vs. case temperature.
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Typical Dominant Wavelength Shift over Current
Dominant Wavelength Shift (nm)
3.0
2.0
1.0
0.0
-1.0
-2.0
-3.0
0
200
400
600
800
1000
1200
100
120
IF - Forward Current (mA)
Figure 9: Typical dominant wavelength shift vs. forward current @ T C = 25°C.
Typical Dominant Wavelength Shift over Temperature
8.0
Dominant Wavelength Shift (nm)
6.0
4.0
2.0
0.0
-2.0
-4.0
-6.0
-8.0
0
20
40
60
80
TC - Case Temperature (°C)
Figure 10: Typical dominant wavelength shift vs. case temperature.
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Current De-rating
1200
IF - Forward Current (mA)
1000
800
700
(Rated)
600
RΘJA = 4°C/W
400
RΘJA = 5°C/W
RΘJA = 6°C/W
200
0
0
25
50
75
100
125
150
TA - Ambient Temperature (°C)
Figure 11: Maximum forward current vs. ambient temperature.
Notes for Figure 11:
1.
Maximum current assumes that all four LED dice are operating concurrently at the same current.
2.
RΘJ-C [Junction to Case Thermal Resistance] for the LZ4-00B208 is typically 2.8°C/W.
3.
RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance].
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Emitter Tape and Reel Specifications (mm)
Figure 12: Emitter carrier tape specifications (mm).
Figure 13: Emitter Reel specifications (mm).
Notes for Figure 13:
1.
Small reel quantity: up to 250 emitters
2.
Large reel quantity: 250-1200 emitters
3.
Single flux bin and single wavelength per reel.
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LZ4 MCPCB Family
Part number
Type of MCPCB
Diameter
(mm)
LZ4-4xxxxx
1-channel
19.9
Emitter + MCPCB
Typical Vf Typical If
Thermal Resistance
(V)
(mA)
(oC/W)
2.8 + 1.1 = 3.9
14.0
700
Mechanical Mounting of MCPCB
MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to
substrate cracking and subsequently LED dies cracking.
To avoid MCPCB bending:
o Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws.
o Care must be taken when securing the board to the heat sink. This can be done by tightening three M3
screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will
increase the likelihood of board bending.
o It is recommended to always use plastics washers in combinations with the three screws.
o If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after
tightening (with controlled torque) and then re-tighten the screws again.
Thermal interface material
To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when
mounting the MCPCB on to the heat sink.
There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal
epoxies. An example of such material is Electrolube EHTC.
It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating
conditions.
Wire soldering
To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC.
Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is
recommended to use a solder iron of more than 60W.
It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:
24-7068-7601)
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LZ4-4xxxxx
1 channel, Standard Star MCPCB (1x4) Dimensions (mm)
Notes:
Unless otherwise noted, the tolerance = ± 0.2 mm.
Slots in MCPCB are for M3 or #4-40 mounting screws.
LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.
LED Engin recommends thermal interface material when attaching the MCPCB to a heatsink
The thermal resistance of the MCPCB is: RΘC-B 1.1°C/W
Components used
MCPCB:
ESD chips:
HT04503
BZX585-C30
(Bergquist)
(NXP, for 4 LED dies in series)
Pad layout
Ch.
1
MCPCB
Pad
1, 2, 3
4, 5
String/die
Function
1/ABCD
Cathode Anode +
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About LED Engin
LED Engin, an OSRAM business based in California’s Silicon Valley, develops, manufactures, and sells advanced LED
emitters, optics and light engines to create uncompromised lighting experiences for a wide range of
TM
entertainment, architectural, general lighting and specialty applications. LuxiGen multi-die emitter and
secondary lens combinations reliably deliver industry-leading flux density, upwards of 5000 quality lumens to a
target, in a wide spectrum of colors including whites, tunable whites, multi-color and UV LEDs in a unique patented
TM
compact ceramic package. Our LuxiTune series of tunable white lighting modules leverage our LuxiGen emitters
and lenses to deliver quality, control, freedom and high density tunable white light solutions for a broad range of
new recessed and downlighting applications. The small size, yet remarkably powerful beam output and superior insource color mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional
light is required. LED Engin is committed to providing products that conserve natural resources and reduce
greenhouse emissions; and reserves the right to make changes to improve performance without notice.
For more information, please contact LEDE-Sales@osram.com or +1 408 922-7200.
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