www.osram.us/ledengin
LuxiGen Multi-Color Emitter Series
LZP RGBW Dome Lens LED Emitter
LZP-00MD00
Key Features
— Highest flux output surface mount ceramic package RGBW LED with integrated glass lens
— 80W power dissipation in a compact 12.0mm x 12.0mm emitter footprint
— Industry lowest thermal resistance per package footprint (0.5°C/W)
— Individually addressable Red, Green, Blue and Daylight White channels
— In-source mixing based on smart die positioning for optimum color uniformity
— Electrically neutral thermal path
— JEDEC Level 1 for Moisture Sensitivity Level
— Lead (Pb) free and RoHS compliant
— Emitter available on 4-channel MCPCB (optional)
— Full suite of TIR secondary optics family available
Typical Applications
— Architectural lighting
— Stage and Studio lighting
— Entertainment lighting
— Accent lighting
— Effect lighting
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Part number options
Base part number
Part number
Description
LZP-00MD00-xxxx
LZP RGBW emitter
LZP-L0MD00-xxxx
LZP RGBW emitter on 4 channel Star MCPCB
LZP-W0MD00-xxxx
LZP RGBW emitter on 4 channel Connectorized MCPCB
Bin kit option codes
MD, Red-Green-Blue-White (6500K)
Kit number suffix
Min flus bin
Color bin range
Description
0000
18R
R01
Red, full distribution flux; full distribution wavelength
20G
G2 – G3
Green, full distribution flux; full distribution wavelength
20B
B03
Blue, full distribution flux; full distribution wavelength
09W
1V2U
White full distribution flux and CCT
Notes:
1.
Default bin kit option is -0000
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Daylight White Chromaticity Groups
0.40
5630K
0.39
0.38
0.37
0.36
CIEy
0.35
0.34
1V2U
0.33
0.32
0.31
0.30
Planckian Locus
0.29
0.28
0.28
0.29
0.30
0.31
0.32
0.33
CIEx
0.34
0.35
0.36
0.37
0.38
Standard Chromaticity Groups plotted on excerpt from the CIE 1931 (2°) x-y Chromaticity Diagram.
Coordinates are listed below
Daylight White Bin Coordinates
Bin Code
1V2U
CIEx
CIEy
0.3005
0.3415
0.329
0.369
0.329
0.318
0.3093
0.2993
0.3005
0.3415
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Luminous Flux Bins
Table 1:
Bin Code
6 Red
18R
Minimum
Maximum
Luminous Flux (ΦV)
Luminous Flux (ΦV)
@ IF = 700mA [1]
@ IF = 700mA [1]
(lm)
(lm)
6 Green
6 Blue
7 White
600
6 Red
6 Green
6 Blue
7 White
940
20G
720
1130
20B
172
32B
270
09W
270
420
1250
1960
Notes for Table 1:
1.
Luminous flux performance is measured at 10ms pulse, T c = 25°C; with all LED dice with the same color connected in series. LED Engin maintains a tolerance
of ±10% on flux measurements.
Dominant Wavelength Bins
Table 2:
Minimum
Dominant Wavelength (λD)
Maximum
Dominant Wavelength (λD)
@ IF = 700mA [1]
@ IF = 700mA [1]
Bin Code
(nm)
Red
R01
Green
(nm)
Blue
617
Red
Green
Blue
630
G2
520
525
G3
525
530
B03
453
460
Notes for Table 2:
1.
Dominant wavelength is measured at 10ms pulse, T C = 25°C. LED Engin maintains a tolerance of ± 1.0nm on dominant wavelength measurements .
Forward Voltage Bins
Table 3:
Bin Code
0
Minimum
Forward Voltage (VF)
@ IF = 700mA [1,2]
(V)
6 Red 6 Green 6 Blue 7 White
12.6
19.2
16.8
19.6
Maximum
Forward Voltage (VF)
@ IF = 700mA [1,2]
(V)
6 Red 6 Green 6 Blue 7 White
17.4
25.2
22.8
26.6
Notes for Table 3:
1.
Forward voltage is measured at 10ms pulse, TC = 25°C with all LED dice with the same color connected in series.
2.
LED Engin maintains a tolerance of ± 0.24V for forward voltage measurements for 6 LEDs and ± 0.28V for 7 LEDs.
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Absolute Maximum Ratings
Table 4:
Parameter
DC Forward Current
Symbol
Value
Unit
[1]
IF
1000
mA
IFP
1500
mA
Reverse Voltage
VR
See Note 3
V
Storage Temperature
Tstg
-40 ~ +150
°C
Junction Temperature [Blue, Green, White]
TJ
150
°C
Junction Temperature [Red]
TJ
125
°C
Soldering Temperature [4]
Tsol
260
°C
Peak Pulsed Forward Current
[2]
Notes for Table 4:
1.
Maximum DC forward current is determined by the overall thermal resistance and ambient temperature. Follow the curves in Figure 11 for current derating.
2.
Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%.
3.
LEDs are not designed to be reverse biased.
4.
Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 5.
5.
LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZP-00MD00 in an electrostatic protected area
(EPA). An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.
Optical Characteristics @ TC = 25°C
Table 5:
Parameter
Symbol
Luminous Flux (@ IF = 700mA)
Luminous Flux (@ IF = 1000mA)
ΦV
ΦV
Dominant Wavelength
Correlated Color Temperature
Color Rendering Index (CRI)
λD
CCT
Ra
[2]
Viewing Angle
Total Included Angle [3]
Typical
6 Red
765
1060
6 Green
920
1190
6 Blue [1]
230
300
623
523
457
7 White
1550
2000
6500
75
2Θ½
Θ0.9
125
140
Unit
lm
lm
nm
K
Degrees
Degrees
Notes for Table 5:
1.
When operating the Blue LED, observe IEC 62471 Risk Group 2 rating. Do not stare into the beam.
2.
Viewing Angle is the off axis angle from emitter centerline where the luminous intensity is ½ of the peak value.
3.
Total Included Angle is the total angle that includes 90% of the total luminous flux.
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Electrical Characteristics @ TC = 25°C
Table 6:
Parameter
Typical
Symbol
6 Green
6 Blue
7 White
VF
15.0
20.9
19.2
22.4
V
VF
16.2
21.6
19.9
23.3
V
ΔVF/ΔTJ
-13.3
-17.4
-12.0
-12.0
mV/°C
[1]
Forward Voltage (@ IF = 700mA)
Forward Voltage (@ IF = 1000mA)
[1]
Temperature Coefficient
of Forward Voltage
Unit
6 Red
Thermal Resistance
RΘJ-C
(Junction to Case)
0.5
°C/W
Notes for Table 6:
1.
Forward Voltage typical value is for all LED dice from the same color dice connected in series.
IPC/JEDEC Moisture Sensitivity Level
Table 7 - IPC/JEDEC J-STD-20 MSL Classification :
Soak Requirements
Floor Life
Standard
Accelerated
Level
Time
Conditions
Time (hrs)
Conditions
Time (hrs)
Conditions
1
Unlimited
≤ 30°C/
60% RH
168
85°C/
60% RH
n/a
n/a
+5/-0
Notes for Table 7:
1.
The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and includes the
maximum time allowed out of the bag at the distributor’s facility.
Average Lumen Maintenance Projections
Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for
solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the
original light output remaining at a defined time period.
Based on long-term HTOL testing, LED Engin projects that the LZP Series will deliver, on average, above 70%
Lumen Maintenance at 20,000 hours of operation at a forward current of 700mA. This projection is based on
constant current operation with junction temperature maintained at or below 120°C for LZP product.
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Mechanical Dimensions (mm)
Pin Out
Ch. Pad Die
Color
Function
18
B
Red
Anode
I
Red
na
K
Red
na
R
Red
na
T
Red
na
2
U
Red
Cathode
17
E
Green
Anode
F
Green
na
H
Green
na
O
Green
na
Q
Green
na
3
X
Green
Cathode
15
A
Blue
Anode
C
Blue
na
J
Blue
na
L
Blue
na
S
Blue
na
5
V
Blue
Cathode
14
D
CW
Anode
G
CW
na
M
CW
na
N
CW
na
P
CW
na
W
CW
na
Y
CW
Cathode
1
2
Figure 1: Package outline drawing
3
Notes for Figure 1:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
2.
Thermal slug is electrically isolated.
3.
Ts is a thermal reference point.
4
6
DNC pins:
1,4,7,8,9,10,11,12,13,16,19,20,21,22,23,24.
Note:
DNC = Do Not Connect (Electrically Non Isolated)
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Recommended Solder Pad Layout (mm)
Figure 2a: Recommended solder mask opening (hatched area) for anode, cathode, and thermal pad
Notes for Figure 2a:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
2.
LED Engin recommends the use of copper core MCPCB’s which allow for the emitter thermal slug to be soldered directly to the copper core (so called pedestal
design). Such MCPCB technologies eliminate the high thermal resistance dielectric layer that standard MCPCB technologies use in between the emitter
thermal slug and the metal core of the MCPCB, thus lowering the overall system thermal resistance.
3.
LED Engin recommends x-ray sample monitoring for solder voids underneath the emitter thermal slug. The total area covered by solder voids should be less
than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to higher failure
rates due to thermal over stress..
Recommended Solder Mask Layout (mm)
Figure 2b: Recommended solder mask opening for anode, cathode, and thermal pad
Note for Figure 2b:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
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Recommended 8 mil Stencil Apertures Layout (mm)
Figure 2c: Recommended 8mil stencil apertures layout for anode, cathode, and thermal pad
Note for Figure 2c:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
Reflow Soldering Profile
Figure 3: Reflow soldering profile for lead free soldering
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Typical Radiation Pattern
100%
90%
80%
Relative Intensity
70%
60%
50%
40%
30%
20%
10%
0%
-90
-80
-70
-60
-50
-40
-30 -20 -10
0
10 20 30
Angular Displacement (Degrees)
40
50
60
70
80
90
Figure 4: Typical representative spatial radiation pattern
Typical Relative Spectral Power Distribution
1.00
0.90
Relative Spectral Power
0.80
0.70
Red
0.60
Green
0.50
Blue
0.40
White
0.30
0.20
0.10
0.00
400
450
500
550
600
650
Wavelength (nm)
700
750
800
Figure 5: Typical relative spectral power vs. wavelength @ TC = 25°C
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Typical Forward Current Characteristics
1200
1000
IF - Forward Current (mA)
Red
Green
800
Blue
White
600
400
200
0
10.0
11.0
12.0
13.0
14.0
15.0
16.0
17.0
Vf (V)
18.0
19.0
20.0
21.0
22.0
23.0
24.0
Figure 6: Typical forward current vs. forward voltage @ TC = 25°C
Typical Relative Light Output over Current
160%
140%
Relative Light Output
120%
100%
80%
Red
60%
Green
40%
Blue/White
20%
0%
0
200
400
600
800
1000
1200
IF - Forward Current (mA)
Figure 7: Typical relative light output vs. forward current @ TC = 25°C
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Typical Relative Light Output over Temperature
140%
120%
Relative Light Output
100%
80%
60%
40%
Red
Green
20%
Blue
White
0%
0
20
40
60
Case Temperature (oC)
80
100
120
Figure 8: Typical relative light output vs. case temperature
Typical Dominant Wavelength/Chromaticity Coordinate Shift over Current
8.00
Dominant Wavelength Shift (nm)
6.00
Red
Green
4.00
Blue
2.00
0.00
-2.00
-4.00
0
200
400
600
800
1000
1200
IF - Forward Current (mA)
Figure 9a: Typical dominant wavelength shift vs. forward current @ TC = 25°C
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0.0100
0.0080
Delta_Cx, Delta_Cy
0.0060
0.0040
White - Delta_Cx
White - Delta_Cy
0.0020
0.0000
-0.0020
-0.0040
-0.0060
-0.0080
-0.0100
0
200
400
600
800
IF - Forward Current (mA)
1000
1200
Figure 9b: Typical chromaticity coordinate shift vs. forward current @ TC = 25°C
Typical Dominant Wavelength/Chromaticity Coordinate Shift over Temperature
6.00
Dominant Wavelength Shift (nm)
5.00
4.00
3.00
2.00
1.00
Red
0.00
Green
Blue
-1.00
-2.00
-3.00
0
20
40
60
80
100
120
Case Temperature (oC)
Figure 10a: Typical dominant wavelength shift vs. case temperature
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0.0020
0.0000
White - Delta_Cx
Delta_Cx, Delta_Cy
-0.0020
White - Delta_Cy
-0.0040
-0.0060
-0.0080
-0.0100
-0.0120
0
20
40
60
Case Temperature (oC)
80
100
120
Figure 10b: Typical chromaticity coordinate shift vs. case temperature
Current De-rating
1200
IF - Forward Current (mA)
1000
800
600
RΘ JA = 0.8°C/W
RΘ JA = 1.0°C/W
400
RΘ JA = 1.2°C/W
200
0
0
25
50
75
100
125
TA - Ambient Temperature (°C)
Figure 11: Maximum forward current vs. ambient temperature based on TJ(MAX) = 125°C
Notes for Figure 11:
1.
Maximum current assumes that all 25 LED dies are operating concurrently at the same current.
2.
RΘJ-C [Junction to Case Thermal Resistance] for LZP-00MD00 is typically 0.5°C/W .
3.
RΘJ-A [Junction to Ambient Thermal Resistance] = RΘ J-C + RΘC-A [Case to Ambient Thermal Resistance].
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LZP MCPCB Option
Part number
Type of MCPCB
Dimension
Emitter + MCPCB
Typical VF
Typical IF
(mm)
Thermal Resistance
(V)
(mA)
(°C/W)
LZP-Lxxxxx
4-channel
28.3
0.5 + 0.1 = 0.6
15.0-22.4
4 x 700
LZP-Wxxxxx
4-channel
50.0
0.5 + 0.1 = 0.6
15.0-22.4
4 x 700
(Connectorized)
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LZP-Lxxxxx
4-Channel MCPCB Mechanical Dimensions (mm)
Notes:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
2.
Slots in MCPCB are for M3 or #4-40 mounting screws.
3.
The thermal resistance of the MCPCB is: RΘC-B 0.1°C/W.
Components used
MCPCB:
MHE-301 copper
(Rayben)
ESD chips:
BZX884-B39
(NXP, for 6-7 LED dies in series)
NTC:
NCP15XH103F03RC
(Murata)
Pad layout
Ch.
MCPCB
Pad
String/die
Function
1
8
1/
Anode +
(Red)
1
BIKRTU
Cathode -
2
7
2/
Anode +
(Green)
2
EFHOQX
Cathode -
3
6
3/
Anode +
(Blue)
3
ACJLSV
Cathode -
4
5
4/
Anode +
(White)
4
DGMNPWY
Cathode -
1-RT
10kohm
NTCA
2-RT
NTC
NTCB
NTC
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LZP-Wxxxxx
4-Channel 50mm Connectorized MCPCB Mechanical Dimensions (mm)
MCPCB Pin-Out (at J1 connector)
Connector
Ch.
String/die
Function
Pin
1
Anode +
1
1/
Cathode (Red)
BIKRTU
2
Anode +
3
2
2/
(Green) 4
EFHOQX
Cathode 6
Anode +
3
3/
(Blue)
ACJLSV
5
Cathode Anode +
8
4
4/
(White)
DGMNPWY Cathode 7
Ch.
NTC
MCPCB Pin-Out (at J2 connector)
Connector
String
Function
Pin
NTCA
1
10kohm
NTC
2
NTCB
Note:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
2.
Mating connector: ZHR-8 (JST) for the 8-pin connector and ZHR-2 (JST) for the 2-pin
connector. It is recommended to strain relief the mating connector.
3.
LED Engin standard screw refers to M3 or #4-40 screw.
4.
The thermal resistance of the MCPCB is: RΘC-B 0.1°C/W
Components used
MCPCB:
MHE-301 copper
(Rayben)
S8B-ZR-SM4A-TF
(JST)
S2B-ZR-SM4A-TF
(JST)
Jumper:
RC1206JR-070RL
(Yageo)
ESD/TVS diode:
SPHV36-01ETG
(Littelfuse)
Thermistor:
NCP15XH103F03RC
(Murata)
1
Connectors :
Note:
1.
Max connector temp is 105°C.
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Application Guidelines
MCPCB Assembly Recommendations
A good thermal design requires an efficient heat transfer from the MCPCB to the heat sink. In order to minimize air
gaps in between the MCPCB and the heat sink, it is common practice to use thermal interface materials such as
thermal pastes, thermal pads, phase change materials and thermal epoxies. Each material has its pros and cons
depending on the design. Thermal interface materials are most efficient when the mating surfaces of the MCPCB
and the heat sink are flat and smooth. Rough and uneven surfaces may cause gaps with higher thermal
resistances, increasing the overall thermal resistance of this interface. It is critical that the thermal resistance of the
interface is low, allowing for an efficient heat transfer to the heat sink and keeping MCPCB temperatures low.
When optimizing the thermal performance, attention must also be paid to the amount of stress that is applied on
the MCPCB. Too much stress can cause the ceramic emitter to crack. To relax some of the stress, it is advisable to
use plastic washers between the screw head and the MCPCB and to follow the torque range listed below. For
applications where the heat sink temperature can be above 50°C, it is recommended to use high temperature and
rigid plastic washers, such as polycarbonate or glass-filled nylon.
LED Engin recommends the use of the following thermal interface materials:
— Bergquist’s Gap Pad 5000S35, 0.020in thick
— Part Number: Gap Pad® 5000S35
0.020in/0.508mm
— Thickness: 0.020in/0.508mm
— Thermal conductivity: 5 W/m-K
— Continuous use max temperature: 200°C
— Using M3 Screw (or #4 screw), with polycarbonate or glass-filled nylon washer (#4) the recommended
torque range is: 20 to 25 oz-in (1.25 to 1.56 lbf-in or 0.14 to 0.18 N-m)
— 3M’s Acrylic Interface Pad 5590H
— Part number: 5590H
@ 0.5mm
— Thickness: 0.020in/0.508mm
— Thermal conductivity: 3 W/m-K
— Continuous use max temperature: 100°C
— Using M3 Screw (or #4 screw), with polycarbonate or glass-filled nylon washer (#4) the recommended
torque range is: 20 to 25 oz-in (1.25 to 1.56 lbf-in or 0.14 to 0.18 N-m)
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Mechanical Mounting Considerations
The mounting of MCPCB assembly is a critical process step. Excessive mechanical stress build up in the MCPCB
can cause the MCPCB to warp which can lead to emitter substrate cracking and subsequent cracking of the LED
dies.
LED Engin recommends the following steps to avoid mechanical stress build up in the MCPCB:
—
Inspect MCPCB and heat sink for flatness and smoothness.
—
Select appropriate torque for mounting screws. Screw torque depends on the MCPCB mounting method
(thermal interface materials, screws, and washer).
—
Always use three M3 or #4-40 screws with #4 washers.
—
When fastening the three screws, it is recommended to tighten the screws in multiple small steps. This method
avoids building stress by tilting the MCPCB when one screw is tightened in a single step.
—
Always use plastic washers in combinations with the three screws. This avoids high point contact stress on the
screw head to MCPCB interface, in case the screw is not seated perpendicular.
—
In designs with non-tapped holes using self-tapping screws, it is common practice to follow a method of three
turns tapping a hole clockwise, followed by half a turn anti-clockwise, until the appropriate torque is reached.
Wire Soldering
— To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150°C.
Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is
recommended to use a solder iron of more than 60W.
— It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:
24-7068-7601)
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About LED Engin
LED Engin, an OSRAM brand based in California’s Silicon Valley, develops, manufactures, and sells advanced
LED emitters, optics and light engines to create uncompromised lighting experiences for a wide range of
entertainment, architectural, general lighting and specialty applications. LuxiGenTM multi-die emitter and secondary
lens combinations reliably deliver industry-leading flux density, upwards of 5000 quality lumens to a target, in a
wide spectrum of colors including whites, tunable whites, multi-color and UV LEDs in a unique patented compact
TM
ceramic package. Our LuxiTune
series of tunable white lighting modules leverage our LuxiGen emitters and
lenses to deliver quality, control, freedom and high density tunable white light solutions for a broad range of new
recessed and downlighting applications. The small size, yet remarkably powerful beam output and superior insource color mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional
light is required. LED Engin is committed to providing products that conserve natural resources and reduce
greenhouse emissions; and reserves the right to make changes to improve performance without notice.
For more information, please contact LEDE-Sales@osram.com or +1 408 922-7200.
LED Engin office:
651 River Oaks Parkway
San Jose, CA 95134
USA
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