LZ4-04MDPB-0000

LuxiGen™ Multi-Color Emitter Series LZ4 RGBW Power High Current RGBW Flat Lens Emitter LZ4-04MDPB Key Features  Highest flux density surface mount ceramic RGBW LED with integrated flat glass lens  40W power dissipation in a small 7.0mm x 7.0mm emitter footprint  Compact 2.15mm x 2.15mm Light Emitting Area and low profile package maximize coupling efficiency into secondary optics  Thermal resistance of 0.9°C/W; up to 3.0A maximum drive current per die  Individually addressable Red, Green, Blue and Daylight White die  Electrically neutral thermal path  JEDEC Level 1 for Moisture Sensitivity Level  Lead (Pb) free and RoHS compliant Typical Applications  Stage and Studio Lighting  Effect Lighting  Accent Lighting  Display Lighting  Architectural Lighting Description The 40W LZ4 RGBW Power emitter produces a full spectrum of brilliant colors with the highest flux density by allowing each die to be driven at up to 3.0A. Through its compact 2.15mm x 2.15mm Light Emitting Area, it delivers more than double the light, doubling the punch from the same fixture utilizing previous generation 4-die RGBW emitters. Utilizing a lower profile substrate and a thinner flat glass lens than its predecessor, the emitter allows the secondary optics to be closer to the die, maximizing the coupling efficiency into the zoom optics, mixing rods, light pipes and other optics. The high quality materials used in the package are chosen to maximize light output and minimize stresses which results in monumental reliability and lumen maintenance. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-04MDPB (1.4 – 11/15/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Part number options Base part number Part number Description LZ4-04MDPB-0000 LZ4 RGBW Power LZ4-V4MDPB-0000 LZ4 RGBW Power on Standard Star 4 channel MCPCB Bin kit option codes MD, Red-Green-Blue-White (6500K) Kit number suffix Min flux Bin Color Bin Ranges 0000 09R R01 23G G04-G05 19B B05-B08 13W 1V2U COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. Description Red, full distribution flux; full distribution wavelength Green, full distribution flux; full distribution wavelength Blue, full distribution flux; full distribution wavelength White full distribution flux and CCT 2 LZ4-04MDPB (1.4 - 11/15/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Daylight White Chromaticity Groups 0.40 5630K 0.39 0.38 0.37 0.36 CIEy 0.35 0.34 1V2U 0.33 0.32 0.31 0.30 Planckian Locus 0.29 0.28 0.28 0.29 0.30 0.31 0.32 0.33 0.34 0.35 0.36 0.37 0.38 CIEx Standard Chromaticity Groups plotted on excerpt from the CIE 1931 (2°) x-y Chromaticity Diagram. Coordinates are listed below. Daylight White Bin Coordinates Bin Code 1V2U CIEx CIEy 0.3005 0.3415 0.329 0.369 0.329 0.318 0.3093 0.2993 0.3005 0.3415 COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 3 LZ4-04MDPB (1.4 - 11/15/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Flux Bins Table 1: Bin Code Minimum Flux (Φ) Maximum Flux (Φ) @ IF = 1000mA [1] @ IF = 1000mA [1] Luminous Flux (lm) Luminous Flux (lm) Radiant Flux (W) Luminous Flux (lm) Luminous Flux (lm) Luminous Flux (lm) Radiant Flux (W) Luminous Flux (lm) Red 90 Green Blue White Red 140 Green Blue White 09R 23G 160 19B 280 1.0 13W 1.5 235 360 Notes for Table 1: o 1. Flux performance is measured at 10ms pulse, Tc=25 C. LED Engin maintains a tolerance of ±10% on flux measurements. Dominant Wavelength Bins Table 2: Bin Code R01 G04 G05 B05 B08 Minimum Dominant Wavelength (λD) @ IF = 1000mA [1] (nm) Red Green Blue 617 519 525 449 453 Maximum Dominant Wavelength (λD) @ IF = 1000mA [1] (nm) Red Green Blue 630 525 531 453 458 Notes for Table 2: o 1. Dominant wavelength is measured at 10ms pulse, Tc=25 C. LED Engin maintains a tolerance of ± 1.0nm on dominant wavelength measurements. Forward Voltage Bin Table 3: Bin Code 0 Red 1.8 Minimum Forward Voltage (VF) @ IF = 1000mA [1] (V) Green Blue 3.0 2.7 White 2.7 Red 2.8 Maximum Forward Voltage (VF) @ IF = 1000mA [1] (V) Green Blue 4.1 3.4 White 3.4 Notes for Table 3: o 1. Forward voltage is measured at 10ms pulse, Tc=25 C. LED Engin maintains a tolerance of ± 0.04V on forward voltage measurements. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 4 LZ4-04MDPB (1.4 - 11/15/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Absolute Maximum Ratings Table 4: Parameter Symbol Value Unit DC Forward Current - Red[1] DC Forward Current – Green, Blue, White[1] Peak Pulsed Forward Current [2] Reverse Voltage Storage Temperature Junction Temperature Soldering Temperature [4] IF IF IFP VR Tstd TJ Tsol 2500 3000 3000 See Note 3 -40 ~ +150 125 Re 260 mA mA mA V °C °C °C Notes for Table 4: 1. Maximum DC forward current is determined by the overall thermal resistance and ambient temperature. Follow the curves in Figure 11 for current derating. 2: Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%. 3. LEDs are not designed to be reversing biased. 4. Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 4. 5. LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the emitter in an electrostatic protected area (EPA). An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1. Optical Characteristics @TC = 25°C Table 5: Parameter Symbol Luminous Flux (@ IF = 1000mA) Luminous Flux (@ IF = 2500mA) Luminous Flux (@ IF = 3000mA) Radiant Flux (@ IF = 1000mA) Radiant Flux (@ IF = 2500mA) Radiant Flux (@ IF = 3000mA) Dominant Wavelength Correlated Color Temperature Color Rendering Index (CRI) Viewing Angle [2] Total Included Angle [3] ΦV ΦV ΦV Φ Φ Φ λD CCT Ra 2Θ½ Θ0.9 Typical Unit Red Green Blue [1] White 105 240 - 200 350 380 280 560 630 lm lm lm W W W 623 523 35 70 82 1.2 2.4 2.8 451 6500 75 K 110 150 Degrees Notes for Table 5: 1. When operating the Blue LED, observe IEC 60825-1 class 2 rating. Do not stare into the beam. 2. Viewing Angle is the off axis angle from emitter centerline where the luminous intensity is ½ of the peak value. 3. Total Included Angle is the total angle that includes 90% of the total luminous flux. Electrical Characteristics @TC = 25°C Table 6: Typical Parameter Symbol Forward Voltage (@ IF = 1000mA) Temperature Coefficient of Forward Voltage Thermal Resistance (@ IF = 1000mA) (Junction to Case) RΘJ-C 0.9 °C/W Thermal Resistance (@ IF = 3000mA) (Junction to Case) RΘJ-C 1.5 °C/W COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. Unit Red Green Blue White VF 2.4 3.5 3.0 3.0 V ΔVF/ΔTJ -1.9 -4.2 -1.8 -1.8 mV/°C 5 LZ4-04MDPB (1.4 - 11/15/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin IPC/JEDEC Moisture Sensitivity Level Table 7 - IPC/JEDEC J-STD-20D.1 MSL Classification: Soak Requirements Floor Life Standard Accelerated Level Time Conditions Time (hrs) Conditions Time (hrs) Conditions 1 Unlimited ≤ 30°C/ 85% RH 168 +5/-0 85°C/ 85% RH n/a n/a Notes for Table 7: 1. The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and includes the maximum time allowed out of the bag at the distributor’s facility. Average Lumen Maintenance Projections Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original light output remaining at a defined time period. Based on long-term HTOL testing, LED Engin projects that LZ4-04MDPB will deliver, on average, 70% Lumen Maintenance at 20,000 hours of operation at a forward current of 2.5A for Red, 3.0A for Green, Blue and White. This projection is based on constant current operation with junction temperature maintained at or below 125°C. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 6 LZ4-04MDPB (1.4 - 11/15/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Mechanical Dimensions (mm) Pin Out Pad Die Color 1 A Red Anode 2 A Red Cathode 3 B White Anode 4 B White Cathode 5 C Green Cathode 6 C Green Anode 7 D Blue Cathode D Blue Anode n/a n/a Thermal 8 9 [2] Function Figure 1: Package Outline Drawing Notes for Figure 1: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. Nominal die spacing is 0.15mm. 3. Thermal contact, Pad 9, is electrically neutral. Recommended Solder Pad Layout (mm) Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad. Note for Figure 2a: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. Pedestal MCPCB allows the emitter thermal slug to be soldered directly to the metal core of the MCPCB. Such MCPCB eliminate t he high thermal resistance dielectric layer that standard MCPCB technologies use in between the emitter thermal slug and the metal core of the MCPCB, thus lowering the overall system thermal resistance. 3. LED Engin recommends x-ray sample monitoring for solder voids underneath the emitter thermal slug. The total area covered by solder voids should be less than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to higher failure rates due to thermal over stress. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 7 LZ4-04MDPB (1.4 - 11/15/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Recommended Solder Mask Layout (mm) Figure 2b: Recommended solder mask opening for anode, cathode, and thermal pad Note for Figure 2b: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. Recommended 8 mil Stencil Apertures Layout (mm) Figure 2c: Recommended 8mil stencil apertures layout for anode, cathode, and thermal pad Note for Figure 2c: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 8 LZ4-04MDPB (1.4 - 11/15/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Reflow Soldering Profile Figure 3: Reflow soldering profile for lead free soldering Typical Radiation Pattern 100% 90% 80% Relative Intensity 70% 60% 50% 40% 30% 20% 10% 0% -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Angular Displacement (Degrees) Figure 4: Typical representative spatial radiation pattern COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 9 LZ4-04MDPB (1.4 - 11/15/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Typical Relative Spectral Power Distribution 1.00 0.90 Relative Spectral Power 0.80 0.70 Red 0.60 Green 0.50 Blue 0.40 White 0.30 0.20 0.10 0.00 400 450 500 550 600 650 Wavelength (nm) 700 750 800 Figure 5: Typical relative spectral power vs. wavelength @ T C = 25°C. Typical Forward Current Characteristics 3000 IF - Forward Current (mA) 2500 2000 Red Green 1500 Blue/White 1000 500 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VF - Forward Voltage (V) Figure 6: Typical forward current vs. forward voltage @ TC = 25°C COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 10 LZ4-04MDPB (1.4 - 11/15/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Typical Relative Light Output over Current 250% Relative Light Output 200% 150% 100% Red Green 50% Blue White 0% 0 500 1000 1500 2000 2500 3000 IF - Forward Current (mA) Figure 7: Typical relative light output vs. forward current @ T C = 25°C Typical Relative Light Output over Temperature 140% Relative Light Output 120% 100% 80% 60% Red 40% Green 20% Blue White 0% 0 20 40 60 TC - Case 80 100 120 Temperature (oC) Figure 8: Typical relative light output vs. case temperature. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 11 LZ4-04MDPB (1.4 - 11/15/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Typical Dominant Wavelength/Chromaticity Coordinate Shift over Current Dominant Wavelength Shift (nm) 8.0 6.0 Red 4.0 Green Blue 2.0 0.0 -2.0 -4.0 0 500 1000 1500 2000 2500 3000 IF - Forward Current (mA) Figure 9a: Typical dominant wavelength shift vs. forward current @ TC = 25°C. 0.0100 0.0080 0.0060 Delta_Cx, Delta_Cy 0.0040 White - Delta_Cx 0.0020 White - Delta_Cy 0.0000 -0.0020 -0.0040 -0.0060 -0.0080 -0.0100 -0.0120 -0.0140 0 500 1000 1500 2000 2500 3000 IF - Forward Current (mA) Figure 9b: Typical chromaticity coordinate shift vs. forward current @ T C = 25°C. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 12 LZ4-04MDPB (1.4 - 11/15/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Typical Dominant Wavelength/Chromaticity Coordinate Shift over Temperature 7.0 Dominant Wavelength Shift (nm) 6.0 5.0 4.0 3.0 2.0 1.0 Red 0.0 Green -1.0 Blue -2.0 -3.0 0 20 40 60 80 100 120 TC - Case Temperature (°C) Figure 10a: Typical dominant wavelength shift vs. case temperature 0.0200 0.0150 Delta_Cx, Delat_Cy 0.0100 White - Delta_Cx 0.0050 White - Delta_Cy 0.0000 -0.0050 -0.0100 -0.0150 -0.0200 0 20 40 60 80 100 120 TC - Case Temperature (°C) Figure 10b: Typical chromaticity coordinate shift vs. case temperature COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 13 LZ4-04MDPB (1.4 - 11/15/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Current De-rating 3500 IF - Forward Current (mA) 3000 2500 (Red) IF(MAX) 2000 RΘJA = 2.0°C/W 1500 RΘJA = 2.5°C/W 1000 500 0 0 25 50 75 100 125 TA - Ambient Temperature (°C) Figure 11: Maximum forward current vs. ambient temperature Notes for Figure 11: 1. Maximum current assumes that all four LED dice are operating concurrently at the same current. 2. RΘJ-C [Junction to Case Thermal Resistance] for LZ4-04MDPB is 0.9°C/W at 1.0A, 1.5°C/W at 3.0A. 3. RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance]. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 14 LZ4-04MDPB (1.4 - 11/15/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Emitter Tape and Reel Specifications (mm) Figure 12: Emitter carrier tape specifications (mm). Ø 178mm (SMALL REEL) Ø 330mm (LARGE REEL) Figure 13: Emitter reel specifications (mm). Notes for Figure 13: 1. Small reel quantity: up to 250 emitters 2. Large reel quantity: 250-2000 emitters. 3. Single flux bin and single wavelength per reel. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 15 LZ4-04MDPB (1.4 - 11/15/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin LZ4 MCPCB Family Part number LZ4-Vxxxxx Type of MCPCB Emitter + MCPCB Diameter Thermal Resistance (mm) (oC/W) 4-channel COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. Typical VF (V) Typical IF (mA) 0.9 + 0.1 = 1.0 2.4 – 3.5 1000 1.5 + 0.1 = 1.6 2.8 – 4.0 2500 (R) 3000 (G,B,W) 19.9 16 LZ4-04MDPB (1.4 - 11/15/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin LZ4-Vxxxxx 4 channel, Standard Star MCPCB (4x1) Dimensions (mm) 2.66 2.45 Notes:  Unless otherwise noted, the tolerance = ± 0.2 mm.  Slots in MCPCB are for M3 or #4-40 mounting screws.  The thermal resistance of the MCPCB is: RΘC-B 0.1°C/W Components used MCPCB: ESD/ TVS Diodes: MHE-301 copper BZT52C5V1LP-7 VBUS05L1-DD1 (Rayben) (Diodes, Inc., for 1 LED die) (Vishay Semiconductors, for 1 LED die) Pad layout Ch. 1 2 3 4 MCPCB Pad 1 8 7 6 4 5 2 3 String/die 1/A 2/B 3/C 4/D Function Anode + Cathode Anode + Cathode Anode + Cathode Anode + Cathode - COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 17 LZ4-04MDPB (1.4 - 11/15/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Application Guidelines MCPCB Assembly Recommendations A good thermal design requires an efficient heat transfer from the MCPCB to the heat sink. In order to minimize air gaps in between the MCPCB and the heat sink, it is common practice to use thermal interface materials such as thermal pastes, thermal pads, phase change materials and thermal epoxies. Each material has its pros and cons depending on the design. Thermal interface materials are most efficient when the mating surfaces of the MCPCB and the heat sink are flat and smooth. Rough and uneven surfaces may cause gaps with higher thermal resistances, increasing the overall thermal resistance of this interface. It is critical that the thermal resistance of the interface is low, allowing for an efficient heat transfer to the heat sink and keeping MCPCB temperatures low. When optimizing the thermal performance, attention must also be paid to the amount of stress that is applied on the MCPCB. Too much stress can cause the ceramic emitter to crack. To relax some of the stress, it is advisable to use plastic washers between the screw head and the MCPCB and to follow the torque range listed below. For o applications where the heat sink temperature can be above 50 C, it is recommended to use high temperature and rigid plastic washers, such as polycarbonate or glass-filled nylon. LED Engin recommends the use of the following thermal interface materials: 1. Bergquist’s Gap Pad 5000S35, 0.020in thick  Part Number: Gap Pad® 5000S35 0.020in/0.508mm  Thickness: 0.020in/0.508mm  Thermal conductivity: 5 W/m-K  Continuous use max temperature: 200°C  Using M3 Screw (or #4 screw), with polycarbonate or glass-filled nylon washer (#4) the recommended torque range is: 20 to 25 oz-in (1.25 to 1.56 lbf-in or 0.14 to 0.18 N-m) 2. 3M’s Acrylic Interface Pad 5590H  Part number: 5590H @ 0.5mm  Thickness: 0.020in/0.508mm  Thermal conductivity: 3 W/m-K  Continuous use max temperature: 100°C  Using M3 Screw (or #4 screw), with polycarbonate or glass-filled nylon washer (#4) the recommended torque range is: 20 to 25 oz-in (1.25 to 1.56 lbf-in or 0.14 to 0.18 N-m) Mechanical Mounting Considerations The mounting of MCPCB assembly is a critical process step. Excessive mechanical stress build up in the MCPCB can cause the MCPCB to warp which can lead to emitter substrate cracking and subsequent cracking of the LED dies LED Engin recommends the following steps to avoid mechanical stress build up in the MCPCB: o Inspect MCPCB and heat sink for flatness and smoothness. o Select appropriate torque for mounting screws. Screw torque depends on the MCPCB mounting method (thermal interface materials, screws, and washer). o Always use three M3 or #4-40 screws with #4 washers. o When fastening the three screws, it is recommended to tighten the screws in multiple small steps. This method avoids building stress by tilting the MCPCB when one screw is tightened in a single step. o Always use plastic washers in combinations with the three screws. This avoids high point contact stress on the screw head to MCPCB interface, in case the screw is not seated perpendicular. o In designs with non-tapped holes using self-tapping screws, it is common practice to follow a method of three turns tapping a hole clockwise, followed by half a turn anti-clockwise, until the appropriate torque is reached. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 18 LZ4-04MDPB (1.4 - 11/15/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Wire Soldering   To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC. Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is recommended to use a solder iron of more than 60W. It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn: 24-7068-7601) COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 19 LZ4-04MDPB (1.4 - 11/15/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin About LED Engin LED Engin, an OSRAM business based in California’s Silicon Valley, develops, manufactures, and sells advanced LED emitters, optics and light engines to create uncompromised lighting experiences for a wide range of TM entertainment, architectural, general lighting and specialty applications. LuxiGen multi-die emitter and secondary lens combinations reliably deliver industry-leading flux density, upwards of 5000 quality lumens to a target, in a wide spectrum of colors including whites, tunable whites, multi-color and UV LEDs in a unique patented TM compact ceramic package. Our LuxiTune series of tunable white lighting modules leverage our LuxiGen emitters and lenses to deliver quality, control, freedom and high density tunable white light solutions for a broad range of new recessed and downlighting applications. The small size, yet remarkably powerful beam output and superior insource color mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional light is required. LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions; and reserves the right to make changes to improve performance without notice. For more information, please contact LEDE-Sales@osram.com or +1 408 922-7200. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 20 LZ4-04MDPB (1.4 - 11/15/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin