High Luminous Efficacy
RGBA LED Emitter
LZ4-00MA00
Key Features
High Luminous Efficacy 10W RGBA LED
Individually addressable Red, Green, Blue and Amber die
White point tunable to any CCT or hue with enhanced CRI
Ultra-small foot print – 7.0mm x 7.0mm
Surface mount ceramic package with integrated glass lens
Very low Thermal Resistance (1.1°C/W)
Very high Luminous Flux density
JEDEC Level 1 for Moisture Sensitivity Level
Autoclave compliant (JEDEC JESD22-A102-C)
Lead (Pb) free and RoHS compliant
Reflow solderable (up to 6 cycles)
Emitter available on Standard MCPCB (optional)
Typical Applications
Architectural Lighting
Retail Spot and Display Lighting
Stage and Studio Lighting
Hospitality Lighting
Museum Lighting
Dental and Medical Illumination
Microscope Illumination
Video Walls and Full Color Displays
Description
The LZ4-00MA00 RGBA LED emitter contains one red, green, blue and amber LED die which provides 10W power in
an extremely small package. With a 7.0mm x 7.0mm ultra-small footprint, this package provides exceptional
luminous flux density. LED Engin’s RGBA LED offers ultimate design flexibility with individually addressable die.
The LZ4-00MA00 is capable of producing any white color temperature with CRI values on the order of 90+ and
millions of colors. The patent-pending design has unparalleled thermal and optical performance. The high quality
materials used in the package are chosen to optimize light output and minimize stresses which results in
monumental reliability and lumen maintenance. The robust product design thrives in outdoor applications with
high ambient temperatures and high humidity.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Part number options
Base part number
Part number
Description
LZ4-00MA00-xxxx
LZ4 emitter
LZ4-20MA00-xxxx
LZ4 emitter on 4 channel Standard Star MCPCB
Bin kit option codes
MA, Red-Green-Blue-Amber (RGBA)
Kit number
suffix
Min
flux
Bin
Color Bin Range
0000
09R
R2 – R2
12G
G2 – G3
01B
B01– B02
01A
A9 – A9
Description
Red full distribution flux; full distribution
wavelength
Green full distribution flux; full
distribution wavelength
Blue full distribution flux; full distribution
wavelength
Amber full distribution flux; full
distribution wavelength
Notes:
1.
Default bin kit option is -0000
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Luminous Flux Bins
Table 1:
Minimum
Maximum
Luminous Flux (ΦV)
Luminous Flux (ΦV)
@ IF = 700mA [1,2]
@ IF = 700mA [1,2]
(lm)
(lm)
Bin Code
Red
09R
Green
Blue
Amber
90
Red
Green
Blue
Amber
140
12G
125
01B
02B
195
17
27
01A
27
43
60
95
Notes for Table 1:
1.
Luminous flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ±10% on flux measurements.
2.
Future products will have even higher levels of radiant flux performance. Contact LED Engin Sales for updated information.
Dominant Wavelength Bins
Table 2:
Bin Code
R2
G2
G3
B01
B02
A9
Minimum
Dominant Wavelength (λD)
@ IF = 700mA [1,2]
(nm)
Red
Green [2]
Blue
Amber
618
520
525
452
457
590
Maximum
Dominant Wavelength (λD)
@ IF = 700mA [1,2]
(nm)
Red
Green [2]
Blue
Amber
630
525
530
457
462
595
Notes for Table 2:
1.
LED Engin maintains a tolerance of ± 1.0nm on dominant wavelength measurements.
2.
Green LEDs are binned for dominant wavelength @ IF = 350mA. Refer to Figure 6 for typical dominant wavelength shift over forward current.
Forward Voltage Bin
Table 3:
Bin Code
0
Red
2.00
Minimum
Forward Voltage (VF)
@ IF = 700mA [1]
(V)
Green
Blue
Amber
3.20
3.20
2.24
Red
2.96
Maximum
Forward Voltage (VF)
@ IF = 700mA [1]
(V)
Green
Blue
Amber
4.40
4.48
3.44
Notes for Table 3:
1.
LED Engin maintains a tolerance of ± 0.04V on forward voltage measurements.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Absolute Maximum Ratings
Table 4:
Parameter
DC Forward Current (@ TJ = 135°C) [1]
DC Forward Current (@ TJ = 150°C)
Peak Pulsed Forward Current [2]
Reverse Voltage
Storage Temperature
Junction Temperature [blue, green]
Junction Temperature [red, amber]
Soldering Temperature [4]
Allowable Reflow Cycles
Symbol
IF
IF
IFP
VR
Tstg
TJ
TJ
Tsol
Value
1200
1000
1500
See Note 3
-40 ~ +150
150
125
260
6
Unit
mA
mA
mA
V
°C
°C
°C
°C
Autoclave Conditions [5]
121°C at 2 ATM,
100% RH for 168 hours
ESD Sensitivity [6]
> 8,000 V HBM
Class 3B JESD22-A114-D
Notes for Table 4:
1.
Maximum DC forward current is determined by the overall thermal resistance and ambient temperature. Follow the curves in Figure 11 for current derating.
2:
Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%.
3.
LEDs are not designed to be reverse biased.
4.
Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 3.
5.
Autoclave Conditions per JEDEC JESD22-A102-C.
6.
LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ4-00MA00
in an electrostatic protected area (EPA). An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.
Optical Characteristics @TC = 25°C
Table 5:
Parameter
Symbol
Luminous Flux (@ IF = 700mA)
Luminous Flux (@ IF = 1000mA)
Dominant Wavelength [2,3,4]
Viewing Angle [5]
Total Included Angle [6]
ΦV
ΦV
λD
2Θ½
Θ0.9
Red
115
160
623
Typical
Green
Blue [1]
155
30
200
40
523
460
95
115
Amber
75
95
590
Unit
lm
lm
nm
Degrees
Degrees
Notes for Table 5:
1.
When operating the Blue LED, observe IEC 60825-1 class 2 rating. Do not stare into the beam.
2.
Red, Blue and Amber dominant wavelength @ IF = 700mA. Green dominant wavelength @ IF = 350mA.
3.
Refer to Figure 6 for typical dominant wavelength shift over forward current.
4.
Refer to Figure 7 for typical dominant wavelength shift over temperature.
5.
Viewing Angle is the off axis angle from emitter centerline where the luminous intensity is ½ of the peak value.
6.
Total Included Angle is the total angle that includes 90% of the total luminous flux.
Electrical Characteristics @TC = 25°C
Table 6:
Parameter
Symbol
Forward Voltage (@ IF = 700mA)
Forward Voltage (@ IF = 1000mA)
Temperature Coefficient
of Forward Voltage
Thermal Resistance
(Junction to Case)
VF
VF
Red
2.2
2.4
ΔVF/ΔTJ
-1.9
RΘJ-C
Typical
Green
Blue
3.5
3.5
3.7
3.7
-2.9
-3.0
1.1
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Amber
2.5
2.7
-2.8
Unit
V
V
mV/°C
°C/W
LZ4-00MA00 (6.3 - 11/15/2018)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
IPC/JEDEC Moisture Sensitivity Level
Table 7 - IPC/JEDEC J-STD-20 MSL Classification:
Soak Requirements
Floor Life
Standard
Accelerated
Level
Time
Conditions
Time (hrs)
Conditions
Time (hrs)
Conditions
1
Unlimited
≤ 30°C/
85% RH
168
+5/-0
85°C/
85% RH
n/a
n/a
Notes for Table 7:
1.
The standard soak time is the sum of the default value of 24 hours for the semiconductor manufacturer’s exposure time (MET) between bake and bag
and the floor life of maximum time allowed out of the bag at the end user of distributor’s facility.
Average Lumen Maintenance Projections
Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for
solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original
light output remaining at a defined time period.
Based on long-term WHTOL testing, LED Engin projects that the LZ Series will deliver, on average, 70% Lumen
Maintenance at 65,000 hours of operation at a forward current of 700 mA. This projection is based on constant
current operation with junction temperature maintained at or below 125°C.
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Mechanical Dimensions (mm)
Pin Out
Pad
Die
Color
1
A
Blue
Anode
2
A
Blue
Cathode
3
B
Red
Anode
4
B
Red
Cathode
5
C
Green
Anode
6
C
Green
Cathode
7
D
Amber
Anode
8
D
Amber
Cathode
9 [2]
n/a
n/a
Thermal
1
2
Function
3
8
4
Figure 1: Package Outline Drawing.
7
6
5
Notes for Figure 1:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
2.
Thermal contact, Pad 9, is electrically neutral.
Recommended Solder Pad Layout (mm)
Non-pedestal MCPCB Design
Pedestal MCPCB Design
Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad for
non-pedestal and pedestal design
Note for Figure 2a:
1. Unless otherwise noted, the tolerance = ± 0.20 mm.
2. Pedestal MCPCB allows the emitter thermal slug to be soldered directly to the metal core of the MCPCB. Such MCPCB eliminate t he high thermal resistance
dielectric layer that standard MCPCB technologies use in between the emitter thermal slug and the metal core of the MCPCB, thus lowering the overall system
thermal resistance.
3. LED Engin recommends x-ray sample monitoring for solder voids underneath the emitter thermal slug. The total area covered by solder voids should be less
than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to higher failure
rates due to thermal over stress.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Recommended Solder Mask Layout (mm)
Non-pedestal MCPCB Design
Pedestal MCPCB Design
Figure 2b: Recommended solder mask opening for anode, cathode, and thermal pad for non-pedestal and pedestal design
Note for Figure 2b:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
Recommended 8 mil Stencil Apertures Layout (mm)
Non-pedestal MCPCB Design
Pedestal MCPCB Design
Figure 2c: Recommended 8mil stencil apertures for anode, cathode, and
thermal pad for non-pedestal and pedestal design
Note for Figure 2c:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Reflow Soldering Profile
Figure 3: Reflow soldering profile for lead free soldering.
Typical Radiation Pattern
100
90
Relative Intensity (%)
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
Angular Displacement (Degrees)
Figure 4: Typical representative spatial radiation pattern.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Typical Relative Spectral Power Distribution
1
0.9
Relative Spectral Power
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
400
450
500
550
600
650
700
Wavelength (nm)
Figure 5: Typical relative spectral power vs. wavelength @ TC = 25°C.
Typical Dominant Wavelength Shift
Relative Dominant Wavlength (nm)
2
1
0
-1
-2
-3
-4
-5
Red
Green
Blue
Amber
-6
-7
-8
300
400
500
600
700
800
900
1000
1100
IF - Forward Current (mA)
Figure 6: Typical dominant wavelength shift vs. forward current @ T C = 25°C.
Notes for Figure 6:
1.
Red, Blue and Amber dominant wavelength relative to I F = 700mA.
2.
Green dominant wavelength relative to IF = 350mA.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Dominant Wavelength Shift over Temperature
Dominant Wavelength Shift (nm)
9
8
7
6
5
4
3
2
1
0
0
20
40
60
80
100
120
Case Temperature (ºC)
Figure 7: Typical dominant wavelength shift vs. case temperature.
Typical Relative Light Output
140
Relative Light Output (%)
120
100
80
60
Red
Green
Blue
Amber
40
20
0
0
200
400
600
800
1000
IF - Forward Current (mA)
Figure 8: Typical relative light output vs. forward current @ T C = 25°C.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Typical Relative Light Output over Temperature
160
Relative Light Output (%)
140
120
100
80
60
Red
Green
Blue
Amber
40
20
0
0
20
40
60
80
100
120
Case Temperature (ºC)
Figure 9: Typical relative light output vs. case temperature.
Typical Forward Current Characteristics
1200
IF - Forward Current (mA)
1000
800
600
Red
Green
Blue
Amber
400
200
0
1.5
2
2.5
3
3.5
4
VF - Forward Voltage (V)
Figure 10: Typical forward current vs. forward voltage @ T C = 25°C.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Current Derating
IF - Maximum Current (mA)
1200
1000
800
600
RΘJ-A = 4.0°C/W
RΘJ-A = 5.0°C/W
RΘJ-A = 6.0°C/W
400
200
0
0
25
50
75
100
125
150
Maximum Ambient Temperature (°C)
Figure 11: Maximum forward current vs. ambient temperature based on T J(MAX) = 150°C.
Notes for Figure 11:
1.
Maximum current assumes that all four LED dice are operating concurrently at the same current.
2.
RΘJ-C [Junction to Case Thermal Resistance] for the LZ4-00MA00 is typically 1.1°C/W.
3.
RΘJ-A [Junction to Ambient Thermal Resistance] = RΘ J-C + RΘC-A [Case to Ambient Thermal Resistance].
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Emitter Tape and Reel Specifications (mm)
Figure 12: Emitter carrier tape specifications (mm).
Figure 13: Emitter reel specifications (mm).
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
LZ4 MCPCB Family
Part number
Type of MCPCB
Diameter
(mm)
LZ4-2xxxxx
4-channel
19.9
Emitter + MCPCB
Typical Vf
Thermal Resistance
(V)
(°C /W)
Typical If
(mA)
1.1 + 1.1 = 2.2
700
2.2 – 3.5
Mechanical Mounting of MCPCB (Also save to MCPCB main file)
MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to
substrate cracking and subsequently LED dies cracking.
To avoid MCPCB bending:
o Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws.
o Care must be taken when securing the board to the heat sink. This can be done by tightening three M3
screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will
increase the likelihood of board bending.
o It is recommended to always use plastics washers in combinations with the three screws.
o If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after
tightening (with controlled torque) and then re-tighten the screws again.
Thermal interface material
To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when
mounting the MCPCB on to the heat sink.
There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal
epoxies. An example of such material is Electrolube EHTC.
It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating
conditions.
Wire soldering
To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC.
Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is
recommended to use a solder iron of more than 60W.
It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:
24-7068-7601)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
LZ4-2xxxxx
4 channel, Standard Star MCPCB (4x1) Dimensions (mm)
Notes:
Unless otherwise noted, the tolerance = ± 0.2 mm.
Slots in MCPCB are for M3 or #4-40 mounting screws.
LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.
LED Engin recommends using thermal interface material when attaching the MCPCB to a heatsink.
The thermal resistance of the MCPCB is: RΘC-B 1.1°C/W
Components used
MCPCB:
ESD chips:
HT04503
BZT52C5-C10
(Bergquist)
(NPX, for 1 LED die)
Pad layout
Ch.
1
2
3
4
MCPCB
Pad
1
8
7
6
5
4
3
2
String/die
1/A
2/B
3/C
4/D
Function
Anode +
Cathode Anode +
Cathode Anode +
Cathode Anode +
Cathode -
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About LED Engin
LED Engin, an OSRAM business based in California’s Silicon Valley, develops, manufactures, and sells advanced LED
emitters, optics and light engines to create uncompromised lighting experiences for a wide range of
TM
entertainment, architectural, general lighting and specialty applications. LuxiGen multi-die emitter and
secondary lens combinations reliably deliver industry-leading flux density, upwards of 5000 quality lumens to a
target, in a wide spectrum of colors including whites, tunable whites, multi-color and UV LEDs in a unique patented
TM
compact ceramic package. Our LuxiTune series of tunable white lighting modules leverage our LuxiGen emitters
and lenses to deliver quality, control, freedom and high density tunable white light solutions for a broad range of
new recessed and downlighting applications. The small size, yet remarkably powerful beam output and superior insource color mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional
light is required. LED Engin is committed to providing products that conserve natural resources and reduce
greenhouse emissions; and reserves the right to make changes to improve performance without notice.
For more information, please contact LEDE-Sales@osram.com or +1 408 922-7200.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin