LZ4-00MD0C-0000

LuxiGen Multi-Color Emitter Series LZ4-Plus RGBW Emitter LZ4-00MD0C Key Features  RGBW multi-channel surface mount ceramic LED package with integrated glass lens  Individually addressable Red, Green, Blue and Daylight White die  Thermal resistance of 1.1°C/W; 1.2A maximum current  Small foot print – 7.0mm x 7.0mm  Electrically neutral thermal path  JEDEC Level 1 for Moisture Sensitivity Level  Lead (Pb) free and RoHS compliant  Reflow solderable (up to 6 cycles) Typical Applications  Stage and Studio Lighting  Effect Lighting  Accent Lighting  Display Lighting  Architectural Lighting Description The LZ4-Plus RGBW emitter contains one red, green, blue and daylight white LED dies closely packed in a low thermal resistance package with integrated glass dome lens. LED Engin’s RGBW LED offers ultimate design flexibility with individually addressable die. It is capable of producing a continuous spectrum of white light plus millions of colors. The patented design has unparalleled thermal and optical performance. The high quality materials used in the package are chosen to optimize light output and minimize stresses which results in monumental reliability and lumen maintenance. The robust product design thrives in outdoor applications with high ambient temperatures and high humidity. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD0C (1.3 – 11/15/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Part number options Base part number Part number Description LZ4-00MD0C-xxxx LZ4-Plus RGBW emitter LZ4-V0MD0C-xxxx LZ4-Plus RGBW emitter on Star 4 channel Cu MCPCB Bin kit option codes MD, Red-Green-Blue-White (6500K) Kit number suffix Min flux Bin Color Bin Ranges 0000 17R R2 12G G2 – G3 17B B06 PQ 1V2U Description Red, full distribution flux; full distribution wavelength Green, full distribution flux; full distribution wavelength Blue, full distribution flux; full distribution wavelength White full distribution flux and CCT COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD0C (1.3 – 11/15/2018) 2 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Daylight White Chromaticity Groups 0.40 5630K 0.39 0.38 0.37 0.36 CIEy 0.35 0.34 1V2U 0.33 0.32 0.31 0.30 Planckian Locus 0.29 0.28 0.28 0.29 0.30 0.31 0.32 0.33 0.34 0.35 0.36 0.37 0.38 CIEx Standard Chromaticity Groups plotted on excerpt from the CIE 1931 (2°) x-y Chromaticity Diagram. Coordinates are listed below. Daylight White Bin Coordinates Bin Code 1V2U CIEx CIEy 0.3005 0.3415 0.329 0.369 0.329 0.318 0.3093 0.2993 0.3005 0.3415 COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD0C (1.3 – 11/15/2018) 3 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Luminous Flux Bins Table 1: Bin Code Red 17R Minimum Maximum Luminous Flux (ΦV) Luminous Flux (ΦV) @ IF = 700mA [1,2] @ IF = 700mA [1,2] (lm) (lm) Green Blue White 105 Red Green Blue White 160 12G 125 195 17B 19 30 18B 30 47 PQ 182 285 Notes for Table 1: 1. Luminous flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ±10% on flux measurements. 2. Future products will have even higher levels of radiant flux performance. Contact LED Engin Sales for update d information. Dominant Wavelength Bins Table 2: Bin Code R2 G2 G3 B03 Minimum Dominant Wavelength (λD) @ IF = 700mA [1] (nm) Red Green Blue 618 520 525 453 Maximum Dominant Wavelength (λD) @ IF = 700mA [1] (nm) Red Green Blue 630 525 530 460 Notes for Table 2: 1. LED Engin maintains a tolerance of ± 1.0nm on dominant wavelength measurements. Forward Voltage Bin Table 3: Bin Code 0 Red 2.10 Minimum Forward Voltage (VF) @ IF = 700mA [1] (V) Green Blue 3.20 2.80 White 2.80 Red 2.90 Maximum Forward Voltage (VF) @ IF = 700mA [1] (V) Green Blue 4.20 3.80 White 3.80 Notes for Table 3: 1. LED Engin maintains a tolerance of ± 0.04V on forward voltage measurements. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD0C (1.3 – 11/15/2018) 4 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Absolute Maximum Ratings Table 4: Parameter Symbol Value Unit IF IF IFP VR Tstd TJ Tsol 1200 1000 2000 See Note 3 -40 ~ +150 150 Re 260 mA mA mA V °C °C °C o DC Forward Current (@TJ = 130 C)[1] o DC Forward Current (@TJ = 150 C)[1] Peak Pulsed Forward Current [2] Reverse Voltage Storage Temperature Junction Temperature Soldering Temperature [4] Allowable Reflow Cycles 6 Notes for Table 4: 1. Maximum DC forward current is determined by the overall thermal resistance and ambient temperature. Follow the curves in Figure 11 for current derating. 2: Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%. 3. LEDs are not designed to be reversing biased. 4. Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 4. 5. LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the emitter in an electrostatic protected area (EPA). An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1. Optical Characteristics @TC = 25°C Table 5: Parameter Symbol Luminous Flux (@ IF = 700mA) Luminous Flux (@ IF = 1000mA) Luminous Flux (@ IF = 1200mA) Dominant Wavelength Correlated Color Temperature Color Rendering Index (CRI) Viewing Angle [2] Total Included Angle [3] ΦV ΦV ΦV Typical Unit Red Green Blue [1] White 130 180 215 623 165 215 235 523 39 50 56 457 240 315 360 lm lm lm 6500 75 K CCT Ra 2Θ½ Θ0.9 95 125 Degrees Notes for Table 5: 1. When operating the Blue LED, observe IEC 60825-1 class 2 rating. Do not stare into the beam. 2. Viewing Angle is the off axis angle from emitter centerline where the luminous intensity is ½ of the peak value. 3. Total Included Angle is the total angle that includes 90% of the total luminous flux. Electrical Characteristics @TC = 25°C Table 6: Parameter Symbol Forward Voltage (@ IF = 700mA) Temperature Coefficient of Forward Voltage Thermal Resistance (Junction to Case) RΘJ-C Typical Unit Red Green Blue White VF 2.5 3.6 3.2 3.2 V ΔVF/ΔTJ -1.9 -2.9 -2.0 -2.0 mV/°C 1.1 COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. °C/W LZ4-00MD0C (1.3 – 11/15/2018) 5 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin IPC/JEDEC Moisture Sensitivity Level Table 7 - IPC/JEDEC J-STD-20D.1 MSL Classification: Soak Requirements Floor Life Standard Accelerated Level Time Conditions Time (hrs) Conditions Time (hrs) Conditions 1 Unlimited ≤ 30°C/ 85% RH 168 +5/-0 85°C/ 85% RH n/a n/a Notes for Table 7: 1. The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and includes the maximum time allowed out of the bag at the distributor’s facility. Average Lumen Maintenance Projections Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original light output remaining at a defined time period. Based on long-term WHTOL testing, LED Engin projects that the LZ Series will deliver, on average, 70% Lumen Maintenance at 65,000 hours of operation at a forward current of 700mA. This projection is based on constant current operation with junction temperature maintained at or below 125°C for LZ4 product. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD0C (1.3 – 11/15/2018) 6 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Mechanical Dimensions (mm) Pin Out Pad # Die Color Function 1 A White Cathode 2 A White Anode 3 B Red Anode 4 B Red Cathode 5 C Green Cathode 6 C Green Anode 7 D Blue Cathode 8 D Blue Anode 9 [2] n/a n/a Thermal Figure 1: Package Outline Drawing Notes for Figure 1: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. Thermal contact, Pad 9, is electrically neutral. Recommended Solder Pad Layout (mm) Non-pedestal MCPCB Design Pedestal MCPCB Design Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad for non-pedestal and pedestal design Note for Figure 2a: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. Pedestal MCPCB allows the emitter thermal slug to be soldered directly to the metal core of the MCPCB. Such MCPCB eliminate t he high thermal resistance dielectric layer that standard MCPCB technologies use in between the emitter thermal slug and the metal core of the MCPCB, thus lowering the overall system thermal resistance. 3. LED Engin recommends x-ray sample monitoring for solder voids underneath the emitter thermal slug. The total area covered by solder voids should be less than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to higher failure rates due to thermal over stress. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD0C (1.3 – 11/15/2018) 7 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Recommended Solder Mask Layout (mm) Non-pedestal MCPCB Design Pedestal MCPCB Design Figure 2b: Recommended solder mask opening for anode, cathode, and thermal pad for non-pedestal and pedestal design Note for Figure 2b: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. Recommended 8 mil Stencil Apertures Layout (mm) Non-pedestal MCPCB Design Pedestal MCPCB Design Figure 2c: Recommended 8mil stencil apertures for anode, cathode, and thermal pad for non-pedestal and pedestal design Note for Figure 2c: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD0C (1.3 – 11/15/2018) 8 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Reflow Soldering Profile Figure 3: Reflow soldering profile for lead free soldering Typical Radiation Pattern 100% 90% 80% Relative Intensity 70% 60% 50% 40% 30% 20% 10% 0% -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 Angular Displacement (Degrees) 40 50 60 70 80 90 Figure 4: Typical representative spatial radiation pattern COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD0C (1.3 – 11/15/2018) 9 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Typical Relative Spectral Power Distribution 1.00 0.90 0.80 Relative Spectral Power 0.70 0.60 Red 0.50 Green Blue 0.40 White 0.30 0.20 0.10 0.00 400 450 500 550 600 650 Wavelength (nm) 700 750 800 Figure 5: Typical relative spectral power vs. wavelength @ T C = 25°C. Typical Forward Current Characteristics 1400 1200 Red IF - Forward Current (mA) 1000 Green Blue/White 800 600 400 200 0 1.80 2.00 2.20 2.40 2.60 2.80 3.00 Vf (V) 3.20 3.40 3.60 3.80 4.00 4.20 Figure 6: Typical forward current vs. forward voltage @ T C = 25°C COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD0C (1.3 – 11/15/2018) 10 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Typical Relative Light Output over Current 180% 160% Relative Light Output 140% 120% 100% 80% Red 60% Green 40% Blue White 20% 0% 0 200 400 600 800 IF - Forward Current (mA) 1000 1200 1400 Figure 7: Typical relative light output vs. forward current @ TC = 25°C Typical Relative Light Output over Temperature 140% 120% Relative Light Output 100% 80% 60% 40% Red Green 20% Blue White 0% 0 20 40 60 Case Temperature (oC) 80 100 120 Figure 8: Typical relative light output vs. case temperature. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD0C (1.3 – 11/15/2018) 11 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Typical Dominant Wavelength/Chromaticity Coordinate Shift over Current Dominant Wavelength Shift (nm) 8.00 6.00 Red Green 4.00 Blue 2.00 0.00 -2.00 -4.00 0 200 400 600 800 IF - Forward Current (mA) 1000 1200 1400 Figure 9a: Typical dominant wavelength shift vs. forward current @ T C = 25°C. 0.0100 0.0080 0.0060 White - Delta_Cx Delta_Cx, Delta_Cy 0.0040 White - Delta_Cy 0.0020 0.0000 -0.0020 -0.0040 -0.0060 -0.0080 -0.0100 0 200 400 600 800 IF - Forward Current (mA) 1000 1200 1400 Figure 9b: Typical chromaticity coordinate shift vs. forward current @ TC = 25°C. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD0C (1.3 – 11/15/2018) 12 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Typical Dominant Wavelength/Chromaticity Coordinate Shift over Temperature 6.00 Dominant Wavelength Shift (nm) 5.00 4.00 3.00 2.00 1.00 Red 0.00 Green Blue -1.00 -2.00 -3.00 0 20 40 60 Case 80 100 120 Temperature (oC) Figure 10a: Typical dominant wavelength shift vs. case temperature 0.0020 0.0000 White - Delta_Cx Delta_Cx, Delta_Cy -0.0020 White - Delta_Cy -0.0040 -0.0060 -0.0080 -0.0100 -0.0120 0 20 40 60 Case Temperature (oC) 80 100 120 Figure 10b: Typical chromaticity coordinate shift vs. case temperature COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD0C (1.3 – 11/15/2018) 13 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Current De-rating IF - Maximum Forward Current (mA) 1400 1200 1000 800 RΘ_J-A 2.5 °C/W RΘ_J-A 3.0 °C/W 600 RΘ_J-A 3.5 °C/W RΘ_J-A 4.0 °C/W 400 RΘ_J-A 4.5 °C/W 200 RΘ_J-A 5.0 °C/W 0 0 25 50 75 100 Maximum Ambient Temperature (oC) 125 150 Figure 11: Maximum forward current vs. ambient temperature Notes for Figure 11: 1. Maximum current assumes that all four LED dice are operating concurrently at the same current. 2. RΘJ-C [Junction to Case Thermal Resistance] for LZ4-00MD0C is 1.1°C/W. 3. RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance]. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD0C (1.3 – 11/15/2018) 14 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Emitter Tape and Reel Specifications (mm) Figure 12: Emitter carrier tape specifications (mm). Ø 178mm (SMALL REEL) Ø 330mm (LARGE REEL) Figure 13: Emitter reel specifications (mm). Notes for Figure 13: 1. Small reel quantity: up to 250 emitters 2. Large reel quantity: 250-1200 emitters. 3. Single flux bin and single wavelength bin per reel. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD0C (1.3 – 11/15/2018) 15 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin LZ4 MCPCB Family Part number Type of MCPCB Diameter (mm) LZ4-Vxxxxx 4-channel 19.9 Emitter + MCPCB Typical Vf Typical If Thermal Resistance (V) (mA) (oC/W) 1.1 + 0.1 = 1.2 2.5 – 3.6 700 Mechanical Mounting of MCPCB   MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to substrate cracking and subsequently LED dies cracking. To avoid MCPCB bending: o Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws. o Care must be taken when securing the board to the heat sink. This can be done by tightening three M3 screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will increase the likelihood of board bending. o It is recommended to always use plastics washers in combinations with the three screws. o If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after tightening (with controlled torque) and then re-tighten the screws again. Thermal interface material    To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when mounting the MCPCB on to the heat sink. There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal epoxies. An example of such material is Electrolube EHTC. It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating conditions. Wire soldering   To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC. Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is recommended to use a solder iron of more than 60W. It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn: 24-7068-7601) COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD0C (1.3 – 11/15/2018) 16 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin LZ4-Vxxxxx 4 channel, Star Cu MCPCB (4x1) Dimensions (mm) Notes:  Unless otherwise noted, the tolerance = ± 0.2 mm.  Slots in MCPCB are for M3 or #4-40 mounting screws.  LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.  LED Engin recommends using thermal interface material when attaching the MCPCB to a heatsink.  The thermal resistance of the MCPCB is: RΘC-B 0.1°C/W Components used MCPCB: ESD/ TVS Diodes: MHE-301 copper BZT52C5V1LP-7 VBUS05L1-DD1 (Rayben) (Diodes, Inc., for 1 LED die) (Vishay Semiconductors, for 1 LED die) Pad layout Ch. 1 2 3 4 MCPCB Pad 8 1 7 6 4 5 2 3 String/die Function 1/A (White) 2/B (Red) 3/C (Green) 4/D (Blue) Anode + Cathode Anode + Cathode Anode + Cathode Anode + Cathode - COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD0C (1.3 – 11/15/2018) 17 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin About LED Engin LED Engin, an OSRAM business based in California’s Silicon Valley, develops, manufactures, and sells advanced LED emitters, optics and light engines to create uncompromised lighting experiences for a wide range of TM entertainment, architectural, general lighting and specialty applications. LuxiGen multi-die emitter and secondary lens combinations reliably deliver industry-leading flux density, upwards of 5000 quality lumens to a target, in a wide spectrum of colors including whites, tunable whites, multi-color and UV LEDs in a unique patented TM compact ceramic package. Our LuxiTune series of tunable white lighting modules leverage our LuxiGen emitters and lenses to deliver quality, control, freedom and high density tunable white light solutions for a broad range of new recessed and downlighting applications. The small size, yet remarkably powerful beam output and superior insource color mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional light is required. LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions; and reserves the right to make changes to improve performance without notice. For more information, please contact LEDE-Sales@osram.com or +1 408 922-7200. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD0C (1.3 – 11/15/2018) 18 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin