LZP-00MD00-0000

High Luminous Efficacy RGBW LED Emitter LZ4-00MD00 Key Features  High Luminous Efficacy 10W RGBW LED  Individually addressable Red, Green, Blue and Daylight White die  Electrically neutral thermal path  Ultra-small foot print – 7.0mm x 7.0mm  Surface mount ceramic package with integrated glass lens  Very low Thermal Resistance (1.1°C/W)  Very high Luminous Flux density  JEDEC Level 1 for Moisture Sensitivity Level  Autoclave compliant (JEDEC JESD22-A102-C)  Lead (Pb) free and RoHS compliant  Reflow solderable (up to 6 cycles)  Emitter available on Standard MCPCB (optional) Typical Applications  Architectural Lighting  Retail Spot and Display Lighting  Stage and Studio Lighting  Hospitality Lighting  Museum Lighting  Video Walls and Full Color Displays Description The LZ4-00MD00 RGBW LED emitter contains one red, green, blue and daylight white LED die which provides 10W power in an extremely small package. With a 7.0mm x 7.0mm ultra-small footprint, this package provides exceptional luminous flux density. LED Engin’s RGBW LED offers ultimate design flexibility with individually addressable die. The LZ4-00MD00 is capable of producing a continuous spectrum of white light plus millions of colors. The patented design has unparalleled thermal and optical performance. The high quality materials used in the package are chosen to optimize light output and minimize stresses which results in monumental reliability and lumen maintenance. The robust product design thrives in outdoor applications with high ambient temperatures and high humidity. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD00 (6.3 - 11/15/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Part number options Base part number Part number Description LZ4-00MD00-xxxx LZ4 emitter LZ4-20MD00-xxxx LZ4 emitter on Standard Star 4 channel MCPCB Bin kit option codes MD, Red-Green-Blue-White (5000K – 6500K) Kit number suffix Min flux Bin Color Bin Ranges 0000 09R R2 – R2 12G G2 – G3 01B B01 – B02 01W 0bd, 0uy, 1bd, 1uy, 2vx, 2bd Description Red, full distribution flux; full distribution wavelength Green, full distribution flux; full distribution wavelength Blue, full distribution flux; full distribution wavelength White full distribution flux and CCT COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD00 (6.3 - 11/15/2018) 2 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Daylight White Chromaticity Groups CIEy 0.38 0.36 2VX 0.34 2BD Planckian Locus 1BD 0.32 0BD 1UY 0.30 0UY 0.28 0.28 0.30 0.32 0.34 CIEx Standard Chromaticity Groups plotted on excerpt from the CIE 1931 (2°) x-y Chromaticity Diagram. Coordinates are listed below in Table 5. Cool White Bin Coordinates Bin Code 0BD 0UY CIEx CIEy 0.295 0.297 0.2895 0.3135 0.3028 0.3304 0.3068 Bin Code CIEx CIEy 0.3068 0.3113 CIEx CIEy 0.3207 0.3462 0.3028 0.3304 0.3205 0.3481 0.3196 0.3602 0.3381 0.3762 0.3113 0.3221 0.3261 0.3376 0.3616 0.295 0.297 0.3068 0.3113 0.3207 0.3462 0.298 0.288 0.3093 0.2993 0.3222 0.3243 0.295 0.297 0.3068 0.3113 0.3207 0.3462 0.3068 0.3113 0.3221 0.3261 0.3376 0.3616 0.3093 0.2993 0.3231 0.312 0.3366 0.3369 0.298 0.288 0.3093 0.2993 0.3222 0.3243 1BD 1UY COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. Bin Code 2VX 2BD LZ4-00MD00 (6.3 - 11/15/2018) 3 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Luminous Flux Bins Table 1: Bin Code Red 09R Minimum Maximum Luminous Flux (ΦV) Luminous Flux (ΦV) @ IF = 700mA [1,2] @ IF = 700mA [1,2] (lm) (lm) Green Blue White 90 Red Green Blue White 140 12G 125 195 01B 17 27 02B 27 43 01W 155 225 Notes for Table 1: 1. Luminous flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ±10% on flux measurements. 2. Future products will have even higher levels of radiant flux performance. Contact LED Engin Sales for updated information. Dominant Wavelength Bins Table 2: Bin Code R2 G2 G3 B01 B02 Minimum Dominant Wavelength (λD) @ IF = 700mA [1] (nm) Red Green Blue 618 520 525 452 457 Maximum Dominant Wavelength (λD) @ IF = 700mA [1] (nm) Red Green Blue 630 525 530 457 462 Notes for Table 2: 1. LED Engin maintains a tolerance of ± 1.0nm on dominant wavelength measurements. Forward Voltage Bin Table 3: Bin Code 0 Red 2.10 Minimum Forward Voltage (VF) @ IF = 700mA [1] (V) Green Blue 3.20 3.20 White 3.20 Red 3.20 Maximum Forward Voltage (VF) @ IF = 700mA [1] (V) Green Blue 4.20 4.00 White 4.00 Notes for Table 3: 1. LED Engin maintains a tolerance of ± 0.04V on forward voltage measurements. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD00 (6.3 - 11/15/2018) 4 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Absolute Maximum Ratings Table 4: Parameter Symbol Value Unit DC Forward Current Ti = 150C DC Forward Current [1] Ti = 130C Peak Pulsed Forward Current [2] Reverse Voltage Storage Temperature Junction Temperature Soldering Temperature [4] Allowable Reflow Cycles IF IF IFP VR Tstd TJ Tsol 1000 1200 1500 See Note 3 -40 ~ +150 150 260 6 121°C at 2 ATM, 100% RH for 168 hours > 8,000 V HBM Class 3B JESD22-A114-D mA mA mA V °C °C °C Autoclave Conditions [5] ESD Sensitivity [6] Notes for Table 4: 1. Maximum DC forward current is determined by the overall thermal resistance and ambient temperature. Follow the curves in Figure 12 for current derating. Max current for continues operation is 1.0A 2: Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%. 3. LEDs are not designed to be reversing biased. 4. Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 4. 5. Autoclave Conditions per JEDEC JESD22-A102-C. 6. LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the emitter in an electrostatic protected area (EPA). An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1. Optical Characteristics @TC = 25°C Table 5: Parameter Symbol Luminous Flux (@ IF = 700mA) Luminous Flux (@ IF = 1000mA) Dominant Wavelength Correlated Color Temperature Color Rendering Index (CRI) Viewing Angle [2] Total Included Angle [3] ΦV ΦV Typical Unit Red Green Blue [1] White 115 160 623 155 200 523 30 40 460 170 222 lm lm 6500 75 K CCT Ra 2Θ½ Θ0.9 95 115 Degrees Notes for Table 5: 1. When operating the Blue LED, observe IEC 60825-1 class 2 rating. Do not stare into the beam. 2. Viewing Angle is the off axis angle from emitter centerline where the luminous intensity is ½ of the peak value. 3. Total Included Angle is the total angle that includes 90% of the total luminous flux. Electrical Characteristics @TC = 25°C Table 6: Parameter Symbol Forward Voltage (@ IF = 700mA) Typical Unit Red Green Blue White VF 2.2 3.35 3.2 3.2 V Temperature Coefficient of Forward Voltage ΔVF/ΔTJ -1.9 -2.9 -3.0 -3.0 mV/°C Thermal Resistance (Junction to Case) RΘJ-C 1.1 COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. °C/W LZ4-00MD00 (6.3 - 11/15/2018) 5 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin IPC/JEDEC Moisture Sensitivity Level Table 7 - IPC/JEDEC J-STD-20D.1 MSL Classification: Soak Requirements Floor Life Standard Accelerated Level Time Conditions Time (hrs) Conditions Time (hrs) Conditions 1 Unlimited ≤ 30°C/ 85% RH 168 +5/-0 85°C/ 85% RH n/a n/a Notes for Table 7: 1. The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and includes the maximum time allowed out of the bag at the distributor’s facility. Average Lumen Maintenance Projections Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original light output remaining at a defined time period. Based on long-term WHTOL testing, LED Engin projects that the LZ Series will deliver, on average, 70% Lumen Maintenance at 65,000 hours of operation at a forward current of 700 mA. This projection is based on constant current operation with junction temperature maintained at or below 125°C. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD00 (6.3 - 11/15/2018) 6 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Mechanical Dimensions (mm) Pin Out Pad Die Color 1 A White Function Anode 2 A White Cathode 3 B Red Anode 4 B Red Cathode 5 C Green Anode 6 C Green Cathode 7 D Blue Anode 8 D Blue Cathode 9 [2] n/a n/a Thermal 1 2 3 8 4 7 6 5 Figure 1: Package Outline Drawing. Notes for Figure 1: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. Thermal contact, Pad 9, is electrically neutral. Recommended Solder Pad Layout (mm) Non-pedestal MCPCB Design Pedestal MCPCB Design Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad for non-pedestal and pedestal design Note for Figure 2a: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. Pedestal MCPCB allows the emitter thermal slug to be soldered directly to the metal core of the MCPCB. Such MCPCB eliminate t he high thermal resistance dielectric layer that standard MCPCB technologies use in between the emitter thermal slug and the metal core of the MCPCB, thus lowering the overall system thermal resistance. 3. LED Engin recommends x-ray sample monitoring for solder voids underneath the emitter thermal slug. The total area covered by solder voids should be less than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to higher failure rates due to thermal over stress. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD00 (6.3 - 11/15/2018) 7 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Recommended Solder Mask Layout (mm) Non-pedestal MCPCB Design Pedestal MCPCB Design Figure 2b: Recommended solder mask opening for anode, cathode, and thermal pad for non-pedestal and pedestal design Note for Figure 2b: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. Recommended 8 mil Stencil Apertures Layout (mm) Non-pedestal MCPCB Design Pedestal MCPCB Design Figure 2c: Recommended 8mil stencil apertures for anode, cathode, and thermal pad for non-pedestal and pedestal design Note for Figure 2c: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD00 (6.3 - 11/15/2018) 8 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Reflow Soldering Profile Figure 3: Reflow soldering profile for lead free soldering. Typical Radiation Pattern 100 90 Relative Intensity (%) 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Angular Displacement (Degrees) Figure 4: Typical representative spatial radiation pattern. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD00 (6.3 - 11/15/2018) 9 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Typical Relative Spectral Power Distribution 1 Relative Spectral Power 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 400 450 500 550 600 650 700 750 800 Wavelength (nm) Figure 5: Typical relative spectral power vs. wavelength @ TC = 25°C. Typical Dominant Wavelength Shift Relative Dominant Wavlength (nm) 4 3 Red Green Blue 2 1 0 -1 -2 300 400 500 600 700 800 900 1000 1100 IF - Forward Current (mA) Figure 6: Typical dominant wavelength shift vs. forward current @ T C = 25°C. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD00 (6.3 - 11/15/2018) 10 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Dominant Wavelength Shift over Temperature Dominant Wavelength Shift (nm) 4 3.5 3 2.5 2 1.5 Red Green Blue 1 0.5 0 0 20 40 60 80 100 120 Case Temperature (ºC) Figure 7: Typical dominant wavelength shift vs. case temperature. Typical Relative Light Output 200 Relative Light Output (%) 180 160 140 120 100 80 60 Red Green Blue White 40 20 0 0 200 400 600 800 1000 1200 1400 1600 IF - Forward Current (mA) Figure 8: Typical relative light output vs. forward current @ TC = 25°C. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD00 (6.3 - 11/15/2018) 11 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Typical Relative Light Output over Temperature 120 Relative Light Output (%) 100 80 60 40 Red Green Blue White 20 0 0 20 40 60 80 100 120 Case Temperature (ºC) Figure 9: Typical relative light output vs. case temperature. Typical Forward Current Characteristics 1200 IF - Forward Current (mA) 1000 800 600 400 Red Green Blue/White 200 0 1.5 2 2.5 3 3.5 4 4.5 5 VF - Forward Voltage (V) Figure 10: Typical forward current vs. forward voltage @ TC = 25°C. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD00 (6.3 - 11/15/2018) 12 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Current De-rating 1600 IF - Maximum Current (mA) 1400 1200 1000 800 700 (Rated) 600 400 RΘJ-A = 4.0°C/W RΘJ-A = 4.5°C/W RΘJ-A = 5.0°C/W 200 0 0 25 50 75 100 125 150 Maximum Ambient Temperature (°C) Figure 11: Maximum forward current vs. ambient temperature based on T J(MAX) = 150°C. Notes for Figure 11: 1. Maximum current assumes that all four LED dice are operating concurrently at the same current. 2. RΘJ-C [Junction to Case Thermal Resistance] for the LZ4-00MD00 is typically 1.1°C/W. 3. RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance]. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD00 (6.3 - 11/15/2018) 13 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Emitter Tape and Reel Specifications (mm) Figure 12: Emitter carrier tape specifications (mm). Figure 13: Emitter reel specifications (mm). COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD00 (6.3 - 11/15/2018) 14 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin LZ4 MCPCB Family Part number Type of MCPCB Diameter (mm) LZ4-2xxxxx 4-channel 19.9 Emitter + MCPCB Typical Vf Typical If Thermal Resistance (V) (mA) (oC/W) 1.1 + 1.1 = 2.2 2.2 – 3.4 700 Mechanical Mounting of MCPCB   MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to substrate cracking and subsequently LED dies cracking. To avoid MCPCB bending: o Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws. o Care must be taken when securing the board to the heat sink. This can be done by tightening three M3 screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will increase the likelihood of board bending. o It is recommended to always use plastics washers in combinations with the three screws. o If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after tightening (with controlled torque) and then re-tighten the screws again. Thermal interface material    To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when mounting the MCPCB on to the heat sink. There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal epoxies. An example of such material is Electrolube EHTC. It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating conditions. Wire soldering   To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC. Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is recommended to use a solder iron of more than 60W. It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn: 24-7068-7601) COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD00 (6.3 - 11/15/2018) 15 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin LZ4-2xxxxx 4 channel, Standard Star MCPCB (4x1) Dimensions (mm) Notes:  Unless otherwise noted, the tolerance = ± 0.2 mm.  Slots in MCPCB are for M3 or #4-40 mounting screws.  LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.  LED Engin recommends using thermal interface material when attaching the MCPCB to a heatsink.  The thermal resistance of the MCPCB is: RΘC-B 1.1°C/W Components used MCPCB: ESD chips: HT04503 BZT52C5-C10 (Bergquist) (NPX, for 1 LED die) Pad layout Ch. 1 2 3 4 MCPCB Pad 1 8 7 6 5 4 3 2 String/die 1/A 2/B 3/C 4/D Function Anode + Cathode Anode + Cathode Anode + Cathode Anode + Cathode - COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD00 (6.3 - 11/15/2018) 16 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin About LED Engin LED Engin, an OSRAM business based in California’s Silicon Valley, develops, manufactures, and sells advanced LED emitters, optics and light engines to create uncompromised lighting experiences for a wide range of TM entertainment, architectural, general lighting and specialty applications. LuxiGen multi-die emitter and secondary lens combinations reliably deliver industry-leading flux density, upwards of 5000 quality lumens to a target, in a wide spectrum of colors including whites, tunable whites, multi-color and UV LEDs in a unique patented TM compact ceramic package. Our LuxiTune series of tunable white lighting modules leverage our LuxiGen emitters and lenses to deliver quality, control, freedom and high density tunable white light solutions for a broad range of new recessed and downlighting applications. The small size, yet remarkably powerful beam output and superior insource color mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional light is required. LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions; and reserves the right to make changes to improve performance without notice. For more information, please contact LEDE-Sales@osram.com or +1 408 922-7200. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00MD00 (6.3 - 11/15/2018) 17 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin