LuxiGen™ Multi-Color Emitter Series
LZ7 Flat Lens Emitter
RGBW-PC Amber-Cyan-Violet
LZ7-04MU00
Key Features
7-color surface mount ceramic LED package with integrated flat glass lens
Red, Green, Blue, Cool White, PC Amber, Cyan and Violet enables richer and wider color combination for more
sophisticated color mixing
Compact 3.8mm Light Emitting Surface (LES) and low profile package maximize coupling efficiency into
secondary optics
20W max power dissipation in a small 7.0mm x 7.0mm emitter footprint
Thermal resistance of 1.4 °C/W; up to 1.5A maximum drive current for individual die
Electrically neutral thermal path
JEDEC Level 1 for Moisture Sensitivity Level
Lead (Pb) free and RoHS compliant
Typical Applications
Stage and Studio Lighting
Effect Lighting
Accent Lighting
Display Lighting
Architectural Lighting
Description
The LZ7 flat lens emitter contains 7 different colors LED dies closely packed in a low thermal resistance package
with integrated glass window. The addition of PC Amber, Cyan and Violet to the traditional RGBW colors enables
richer and wider color combination for more sophisticated color mixing. The compact 3.8mm LES, low profile
package and glass window, allows maximum coupling efficiency into the zoom optics, mixing rods, light pipes and
other secondary optics. The high quality materials used in the package are chosen to maximize light output and
minimize stresses which results in monumental reliability and lumen maintenance.
Notes
This product emits Violet and Blue light, which can be hazardous depending on total system configuration
(including, but not limited to optics, drive current and temperature). Do not stare directly into the beam and
observe safety precaution given in IEC 62471 when operating this product.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Part number options
Base part number
Part number
Description
LZ7-04MU00-0000
LZ7 RGBW-PC Amber-Cyan-Violet flat lens emitter
LZ7-N4MU00-0000
LZ7 RGBW-PC Amber-Cyan-Violet flat lens emitter on 7 channel MCPCB
Bin kit option codes
MU, Red-Green-Blue-White (6500K)-PC Amber-Cyan-UV
Kit number
suffix
Min
flux
Bin
Color Bin Ranges
0000
07R1
R01
10G1
G2 – G3
09B
B03
11W1
1V2U
KL
PCA
01C
C14
01U
U56
Description
Red, full distribution flux; full distribution
wavelength
Green, full distribution flux; full
distribution wavelength
Blue, full distribution flux; full
distribution wavelength
White full distribution flux and CCT
PC Amber, full distribution flux; full
distribution wavelength
Cyan, full distribution flux; full
distribution wavelength
Violet, full distribution flux; full
distribution wavelength
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Daylight White Chromaticity Group
0.40
5630K
0.39
0.38
0.37
0.36
CIEy
0.35
0.34
1V2U
0.33
0.32
0.31
0.30
Planckian Locus
0.29
0.28
0.28
0.29
0.30
0.31
0.32
0.33
0.34
0.35
0.36
0.37
0.38
CIEx
Standard Chromaticity Group plotted on excerpt from the CIE 1931 (2°) x-y Chromaticity Diagram.
Coordinates are listed below.
Daylight White Bin Coordinates
Bin Code
1V2U
CIEx
CIEy
0.3005
0.3415
0.3290
0.3690
0.3290
0.3180
0.3093
0.2993
0.3005
0.3415
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PC Amber Chromaticity Group
Standard Chromaticity Group plotted on excerpt from the CIE 1931 (2°) x-y Chromaticity Diagram.
Coordinates are listed below.
PC Amber Bin Coordinates
Bin Code
PCA
CIEx
CIEy
0.5752
0.4242
0.5664
0.4140
0.5955
0.3895
0.6029
0.3965
0.5752
0.4242
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Flux Bins
Table 1:
[1]
Bin
Code
Red
07R1
07R2
10G1
10G2
09B
Minimum Flux @ IF = 700mA
Luminous
Radiant
(lm)
(mW)
PC
Green Blue White
Cyan Violet
Amber
60
79
[1]
Maximum Flux @ IF = 700mA
Luminous
Radiant
(lm)
(mW)
PC
Green Blue White
Cyan Violet
Amber
Red
79
105
100
128
128
166
13
10B
11W1
11W2
KL
01C
01U
22
22
35
160
200
200
255
75
117
71
130
700
1100
Notes for Table 1:
1.
Flux performance is measured at 10ms pulse, TC = 25°C. LED Engin maintains a tolerance of ±10% on flux measurements.
Wavelength Bins
Table 2:
[1,2]
Bin
Code
R01
G2
[1,2]
Minimum Wavelength @ IF = 700mA
Dominant (λD)
Peak (λP)
(nm)
(nm)
Red
Green
Blue
Cyan Violet
617
520
G3
B03
C14
U56
Maximum Wavelength @ IF = 700mA
Dominant (λD)
Peak (λP)
(nm)
(nm)
Red
Green
Blue
Cyan
Violet
630
525
525
530
453
460
490
510
390
400
Notes for Table 2:
1.
Wavelength is measured at 10ms pulse, TC = 25oC.
2.
LED Engin maintains a tolerance of ± 1.0nm on dominant wavelength measurements and ± 2.0nm on peak wavelength measurements.
Forward Voltage Bin
Table 3:
Bin
Code
0
Red
Green
2.1
3.2
Minimum
Forward Voltage (VF)
@ IF = 700mA [1]
(V)
PC
Blue White
Cyan
Amber
2.8
2.8
2.8
2.9
Violet
Red
Green
3.2
2.9
4.2
Maximum
Forward Voltage (VF)
@ IF = 700mA [1]
(V)
PC
Blue White
Cyan
Amber
3.8
3.8
3.8
4.0
Violet
4.2
Notes for Table 3:
1.
Forward voltage is measured at 10ms pulse, TC = 25oC. LED Engin maintains a tolerance of ± 0.04V for forward voltage measurements.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Absolute Maximum Ratings
Table 4:
Symbol
Value
Unit
DC Forward Current (@TJ = 125 C) – R, G, B, or W single die on
o
DC Forward Current (@TJ = 125 C) – PC-A, C or V single die on
o
DC Forward Current (@TJ = 125 C) – all 7 die on[1]
Parameter
IF(MAX)
IF(MAX)
IF(MAX)
1500
1000
850
mA
mA
mA
Peak Pulsed Forward Current [2]
IFP
2000
mA
Power Dissipation
Reverse Voltage
Storage Temperature
Junction Temperature
Soldering Temperature [4]
Pd
VR
Tstd
20
See Note 3
-40 ~ +150
125
260
W
V
°C
°C
°C
o
TJ(MAX)
Tsol
Notes for Table 4:
1.
Maximum DC forward current is determined by the overall thermal resistance and ambient temperature. Follow the curves in Figure 11 for current derating.
2:
Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%.
3.
LEDs are not designed to be reverse biased.
4.
Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 3.
5.
LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the emitter in an electrostatic protected area (EPA). An
EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.
Optical Characteristics @TC = 25°C
Table 5:
Parameter
Symbol
Luminous Flux (@ IF = 700mA)
Luminous Flux (@ IF = 1000mA)
Luminous Flux (@ IF = 1500mA)
Radiant Flux (@ IF = 700mA)
Radiant Flux (@ IF = 1000mA)
Dominant Wavelength
Peak Wavelength
ΦV
ΦV
ΦV
Φ
Φ
λD
λP
Correlated Color Temperature
Color Rendering Index (CRI)
Viewing Angle [3]
Total Included Angle [4]
CCT
Ra
2Θ½
Θ0.9
Red
80
110
160
Green
140
180
220
Blue [1]
33
45
60
Typical
White PC Amber
200
100
270
130
350
Cyan
95
120
Violet [2]
0.80
1.10
623
523
457
592
500
395
6500
75
120
160
Unit
lm
lm
lm
W
W
nm
nm
K
Degrees
Degrees
Notes for Table 5:
1.
When operating the Blue LED, observe IEC 62471 Risk Group 2 rating. Do not stare into the beam.
2.
When operating the UV LED, observe IEC 62471 Risk Group 3 rating. Do not stare into the beam.
3.
Viewing Angle is the off axis angle from emitter centerline where the luminous intensity is ½ of the peak value.
4.
Total Included Angle is the total angle that includes 90% of the total luminous flux.
Electrical Characteristics @TC = 25°C
Table 6:
Typical
Unit
Parameter
Symbol
Red
Green
Blue
Cyan
Violet
Forward Voltage (@ IF = 700mA)
Temperature Coefficient
of Forward Voltage
Thermal Resistance
(Junction to Case)
VF
2.5
3.6
3.2
3.2
3.2
3.6
3.7
V
ΔVF/ΔTJ
-1.9
-2.9
-2.0
-2.0
-2.0
-2.6
-2.2
mV/°C
RΘJ-C
White PC Amber
1.4
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IPC/JEDEC Moisture Sensitivity Level
Table 7 - IPC/JEDEC J-STD-20D.1 MSL Classification:
Soak Requirements
Floor Life
Standard
Accelerated
Level
Time
Conditions
Time (hrs)
Conditions
Time (hrs)
Conditions
1
Unlimited
≤ 30°C/
85% RH
168
+5/-0
85°C/
85% RH
n/a
n/a
Notes for Table 7:
1.
The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and
includes the maximum time allowed out of the bag at the distributor’s facility.
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Mechanical Dimensions (mm)
Pin Out
Pin
Die
Color
Polarity
2
B
Red
+
3
A
Green
+
5
C
Blue
+
6
F
PC Amber
+
8
E
Cool White
+
9
G
Cyan
-
11
D
Violet
+
14
D
Violet
-
15
G
Cyan
+
17
E
Cool White
-
20
F
PC Amber
-
21
C
Blue
-
23
A
Green
-
24
B
Red
-
NC pins: 1, 4, 7, 10, 12, 13, 16, 18, 19, 22
DNC pins: none
Note:
NC = Not Internally Connected (Electrically Isolated)
DNC = Do Not Connect (Electrically Non Isolated)
Figure 1: Package Outline Drawing
Notes for Figure 1:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
2.
Thermal contact, Pad 25, is electrically neutral.
3.
Temperature measurement point: side ceramic closest to the Ts point
Recommended Solder Pad Layout (mm)
Non-pedestal MCPCB Design
Pedestal MCPCB Design
Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad for non-pedestal and pedestal design
Note for Figure 2a:
1. Unless otherwise noted, the tolerance = ± 0.20 mm.
2. Pedestal MCPCB allows the emitter thermal slug to be soldered directly to the metal core of the MCPCB. Such MCPCB eliminate the high thermal resistance
dielectric layer that standard MCPCB technologies use in between the emitter thermal slug and the metal core of the MCPCB, thus lowering the overall system
thermal resistance.
3. LED Engin recommends x-ray sample monitoring for solder voids underneath the emitter thermal slug. The total area covered by solder voids should be less
than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to higher failure
rates due to thermal over stress.
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Recommended Solder Mask Layout (mm)
Non-pedestal MCPCB Design
Pedestal MCPCB Design
Figure 2b: Recommended solder mask opening for anode, cathode, and thermal pad for non-pedestal and pedestal design
Note for Figure 2b:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
Recommended 8 mil Stencil Apertures Layout (mm)
Non-pedestal MCPCB Design
Pedestal MCPCB Design
Figure 2c: Recommended 8mil stencil apertures layout for anode, cathode, and thermal pad for non-pedestal and pedestal design
Note for Figure 2c:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
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Reflow Soldering Profile
Figure 3: Reflow soldering profile for lead free soldering
Typical Radiation Pattern
100%
90%
80%
Relatiive Intensity
70%
60%
50%
40%
30%
20%
10%
0%
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10
20
30
40
50
60
70
80
90
Angular Displacement (Degrees)
Figure 4: Typical representative spatial radiation pattern – all dies on
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Relative Spectral Power Distribution
1.00
0.90
0.80
Relative Spectral Power
Red
0.70
Green
0.60
Blue
White
0.50
PC Amber
0.40
Cyan
Violet
0.30
0.20
0.10
0.00
350
400
450
500
550
600
650
700
750
800
Wavelength (nm)
Figure 5: Typical relative spectral power vs. wavelength @ TC = 25°C.
Typical Forward Current Characteristics
1,600
IF - Forward Current (mA)
1,400
1,200
1,000
800
600
Red
Green
400
Blue/PC Amber/White
Cyan
200
Violet
0
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
4.0
4.2
VF - Forward Voltage (V)
Figure 6: Typical forward current vs. forward voltage @ TC = 25°C
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Typical Relative Flux over Current
200
180
160
Relative Flux (%)
140
120
Red
100
Green
80
Blue
60
White
40
20
0
0
200
400
600
800
1000
1200
1400
1600
IF - Forward Current (mA)
Figure 7a: Typical relative luminous (radiant for Violet) flux vs. forward current @ TC = 25°C – R, G, B, W
160
140
Relative Flux (%)
120
100
80
PC Amber
60
Cyan
40
Violet *
20
* Radiant Flux
0
0
200
400
600
800
1000
1200
IF - Forward Current (mA)
Figure 7b: Typical relative luminous (radiant for Violet) flux vs. forward current @ T C = 25°C – PC-A, C, V
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Relative Flux over Temperature
140
120
Relative Flux (%)
100
80
Red
Green
60
Blue
White
40
20
0
0
20
40
60
80
100
120
100
120
TC - Case Temperature (°C)
Figure 8a: Typical relative luminous flux vs. case temperature – R, G, B, W
120
Relative Flux (%)
100
80
60
PC Amber
Cyan
40
Violet *
* Radiant Flux
20
0
0
20
40
60
80
TC - Case Temperature (°C)
Figure 8b: Typical relative luminous (radiant for Violet) flux vs. case temperature – PC-A, C, V
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Typical Wavelength Shift over Current
15.0
Red
Wavelength Shift (nm)
10.0
Green
Blue
5.0
0.0
-5.0
-10.0
-15.0
0
200
400
600
800
1000
1200
1400
1600
IF - Forward Current (mA)
Figure 9a: Typical dominant wavelength shift vs. forward current @ TC = 25°C – R, G, B
15.0
Wavelength Shift (nm)
10.0
Cyan
Violet *
5.0
* Peak Wavelength
0.0
-5.0
-10.0
-15.0
0
200
400
600
800
1000
1200
IF - Forward Current (mA)
Figure 9b: Typical dominant (peak for Violet) wavelength shift vs. forward current @ T C = 25°C – C, V
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Typical Chromaticity Coordinate Shift over Current
0.010
0.008
0.006
Delta_Cx, Delta_Cy
PC Amber - Delta Cx
0.004
PC Amber - Delta_Cy
0.002
0.000
-0.002
-0.004
-0.006
-0.008
-0.010
0
200
400
600
800
1000
1200
1400
1600
IF - Forward Current (mA)
Figure 9c: Typical chromaticity coordinate shift vs. forward current @ TC = 25°C – PC Amber
0.0100
0.0080
0.0060
Delta_Cx, Delta_Cy
White - Delta_Cx
0.0040
White - Delta_Cy
0.0020
0.0000
-0.0020
-0.0040
-0.0060
-0.0080
-0.0100
0
200
400
600
800
1000
1200
1400
1600
IF - Forward Current (mA)
Figure 9d: Typical chromaticity coordinate shift vs. forward current @ T C = 25°C - White
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Typical Wavelength Shift over Temperature
10.0
8.0
Wavelength Shift (nm)
6.0
4.0
2.0
0.0
Red
-2.0
Green
-4.0
Blue
-6.0
-8.0
-10.0
0
20
40
60
80
100
120
TC - Case Temperature (°C)
Figure 10a: Typical dominant wavelength shift vs. case temperature – R, G, B
10.0
8.0
Wavelength Shift (nm)
6.0
4.0
2.0
0.0
Cyan
-2.0
Violet *
-4.0
* Peak Wavelength
-6.0
-8.0
-10.0
0
20
40
60
80
100
120
TC - Case Temperature (°C)
Figure 10b: Typical dominant (peak for Violet) wavelength shift vs. case temperature – C, V
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Typical Chromaticity Coordinate Shift over Temperature
0.010
Δ Cx, Δ Cy Chromaticity Coordinate Shift
0.008
PC Amber - Delta_Cx
0.006
PC Amber - Delta_Cy
0.004
0.002
0.000
-0.002
-0.004
-0.006
-0.008
-0.010
0
20
40
60
80
100
120
TC - Case Temperature (oC)
Figure 10c: Typical chromaticity coordinate shift vs. case temperature – PC Amber
Δ Cx, Δ Cy Chromaticity Coordinate Shift
0.020
0.015
0.010
White - Delta_Cx
0.005
White - Delta_Cy
0.000
-0.005
-0.010
-0.015
-0.020
0
20
40
60
TC - Case Temperature
80
100
120
(oC)
Figure 10d: Typical chromaticity coordinate shift vs. case temperature - White
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Current De-rating
900
850
800
700
IF - Forward Current (mA)
(Rated)
600
500
RΘJA = 2°C/W
400
RΘJA = 3°C/W
RΘJA = 4°C/W
300
200
100
0
0
25
50
75
100
125
TA - Ambient Temperature (°C)
Figure 11: Maximum forward current vs. ambient temperature
Notes for Figure 11:
1.
Maximum current assumes that all 7 LED die are operating concurrently at the same current.
2.
RΘJ-C [Junction to Case Thermal Resistance] for LZ7-04MU00 is 1.4°C/W.
3.
RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance].
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Emitter Tape and Reel Specifications (mm)
Figure 12: Emitter carrier tape specifications (mm).
Ø 178mm (SMALL REEL)
Ø 330mm (LARGE REEL)
Figure 13: Emitter reel specifications (mm).
Notes for Figure 13:
1.
Small reel quantity: up to 250 emitters
2.
Large reel quantity: 250-1200 emitters.
3.
Single flux bin and single wavelength bin per reel.
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LZ7 MCPCB Family
Part number
LZ7-Nxxxxx
Type of MCPCB
7-channel
Dimension
(mm)
38.3 x 31.2
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Emitter + MCPCB
Thermal
Resistance (oC/W)
Typical Vf
(V)
Typical If
(mA)
1.4 + 0.1 = 1.5
Red: 2.5V
Green: 3.6V
Blue: 3.2V
White: 3.2V
PC-A: 3.2V
Cyan: 3.6V
Violet: 3.7V
700
LZ7-04MU00 (1.1 - 03/10/16)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
LZ7-Nxxxxx
7 channel, MCPCB (7x1) Dimensions (mm)
Notes:
Unless otherwise noted, the tolerance = ± 0.2 mm.
Standard screw refers to M3 or #4-40 screw.
The thermal resistance of the MCPCB is: RΘC-B 0.1°C/W
Components used
MCPCB:
Thermistor:
MHE-301 copper
NCP15XH103F03RC
(Rayben)
(Murata)
Pad layout
Ch.
1
2
3
4
5
6
7
T
MCPCB
Pad
1
14
2
13
3
12
4
11
5
10
6
9
7
8
1-RT
2-RT
Die/ Color
B/ Red
A/ Green
C/ Blue
F/ PC Amber
E/ CW
G/ Cyan
D/ UV
NTC
Function
Anode +
Cathode Anode +
Cathode Anode +
Cathode Anode +
Cathode Anode +
Cathode Cathode Anode +
Anode +
Cathode 10kOhm NTC
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Application Guidelines
MCPCB Assembly Recommendations
A good thermal design requires an efficient heat transfer from the MCPCB to the heat sink. In order to minimize air
gaps in between the MCPCB and the heat sink, it is common practice to use thermal interface materials such as
thermal pastes, thermal pads, phase change materials and thermal epoxies. Each material has its pros and cons
depending on the design. Thermal interface materials are most efficient when the mating surfaces of the MCPCB
and the heat sink are flat and smooth. Rough and uneven surfaces may cause gaps with higher thermal resistances,
increasing the overall thermal resistance of this interface. It is critical that the thermal resistance of the interface is
low, allowing for an efficient heat transfer to the heat sink and keeping MCPCB temperatures low.
When optimizing the thermal performance, attention must also be paid to the amount of stress that is applied on
the MCPCB. Too much stress can cause the ceramic emitter to crack. To relax some of the stress, it is advisable to
use plastic washers between the screw head and the MCPCB and to follow the torque range listed below. For
o
applications where the heat sink temperature can be above 50 C, it is recommended to use high temperature and
rigid plastic washers, such as polycarbonate or glass-filled nylon.
LED Engin recommends the use of the following thermal interface materials:
1.
Bergquist’s Gap Pad 5000S35, 0.020in thick
Part Number: Gap Pad® 5000S35 0.020in/0.508mm
Thickness: 0.020in/0.508mm
Thermal conductivity: 5 W/m-K
Continuous use max temperature: 200°C
Using M3 Screw (or #4 screw), with polycarbonate or glass-filled nylon washer (#4) the
recommended torque range is: 50 to 60 in-oz (3.13 to 3.75 in-lbs or 0.35 to 0.42 N-m)
2.
3M’s Acrylic Interface Pad 5590H
Part number: 5590H @ 0.5mm
Thickness: 0.020in/0.508mm
Thermal conductivity: 3 W/m-K
Continuous use max temperature: 100°C
Using M3 Screw (or #4 screw), with polycarbonate or glass-filled nylon washer (#4) the
recommended torque range is: 50 to 60 in-oz (3.13 to 3.75 in-lbs or 0.35 to 0.42 N-m)
Mechanical Mounting Considerations
The mounting of MCPCB assembly is a critical process step. Excessive mechanical stress build up in the MCPCB can
cause the MCPCB to warp which can lead to emitter substrate cracking and subsequent cracking of the LED dies
LED Engin recommends the following steps to avoid mechanical stress build up in the MCPCB:
o Inspect MCPCB and heat sink for flatness and smoothness.
o Select appropriate torque for mounting screws. Screw torque depends on the MCPCB mounting
method (thermal interface materials, screws, and washer).
o Always use three M3 or #4-40 screws with #4 washers.
o When fastening the three screws, it is recommended to tighten the screws in multiple small
steps. This method avoids building stress by tilting the MCPCB when one screw is tightened in a
single step.
o Always use plastic washers in combinations with the three screws. This avoids high point contact
stress on the screw head to MCPCB interface, in case the screw is not seated perpendicular.
o In designs with non-tapped holes using self-tapping screws, it is common practice to follow a
method of three turns tapping a hole clockwise, followed by half a turn anti-clockwise, until the
appropriate torque is reached.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Wire Soldering
o
To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150 C.
Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is
recommended to use a solder iron of more than 60W.
It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:
24-7068-7601)
COPYRIGHT © 2016 LED ENGIN. ALL RIGHTS RESERVED.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Company Information
LED Engin, Inc., based in California’s Silicon Valley, specializes in ultra-bright, ultra compact solid state lighting
solutions allowing lighting designers & engineers the freedom to create uncompromised yet energy efficient
lighting experiences. The LuxiGen™ Platform — an emitter and lens combination or integrated module
solution, delivers superior flexibility in light output, ranging from 3W to 90W, a wide spectrum of available colors,
including whites, multi-color and UV, and the ability to deliver upwards of 5,000 high quality lumens to a target.
The small size combined with powerful output allows for a previously unobtainable freedom of design wherever
high-flux density, directional light is required. LED Engin’s packaging technologies lead the industry with products
that feature lowest thermal resistance, highest flux density and consummate reliability, enabling compact and
efficient solid state lighting solutions.
LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions.
LED Engin reserves the right to make changes to improve performance without notice.
Please contact sales@ledengin.com or (408) 922-7200 for more information.
COPYRIGHT © 2016 LED ENGIN. ALL RIGHTS RESERVED.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
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