LZP-Series
Highest Lumen Density
Cool White Emitter
LZP-00CW00
Key Features
Highest luminous flux / area single LED emitter
o
5000lm Cool White
o
40mm² light emitting area
Up to 90 Watt power dissipation on compact 12.0mm x 12.0mm footprint
Industry lowest thermal resistance per package size (0.6°C/W)
Industry leading lumen maintenance
Color Point Stability 7x improvement over Energy Star requirements
Surface mount ceramic package with integrated glass lens
JEDEC Level 1 for Moisture Sensitivity Level
Lead (Pb) free and RoHS compliant
Reflow solderable (up to 6 cycles)
Copper core MCPCB option with emitter thermal slug directly soldered to the copper core
Full suite of TIR secondary optics family available
Typical Applications
High Bay and Low Bay
General lighting
Stage and Studio lighting
Architectural lighting
Street lighting
Description
The LZP-00CW00 Cool White LED emitter can dissipate up to 90W of power in an extremely small package. With a
small 12.0mm x 12.0mm footprint, this package provides unmatched luminous flux density. LED Engin’s patentpending thermally insulated phosphor layer provides spatial color uniformity across the radiation pattern and a
consistent CCT, CRI over time and temperature. The high quality materials used in the package are chosen to
optimize light output and minimize stresses which results in superior reliability and lumen maintenance. The
robust product design thrives in outdoor applications with high ambient temperatures and high humidity.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Part number options
Base part number
Part number
Description
LZP-00CW00-xxxx
LZP Cool White emitter
LZP-D0CW00-xxxx
LZP Cool White emitter on 5 channel 4x6+1 Star MCPCB
LZP-G0CWT1-xxxx
LZP Cool White emitter on 2 channel 2x12+1 Connectorized MCPCB
LZP-H0CWT1-xxxx
LZP Cool White emitter on 2 channel 4x6+1 Connectorized MCPCB
Bin kit option codes
CW, Cool White (5000K – 6500K)
Kit number
suffix
Min
flux
Bin
Chromaticity bins
Description
0000
G2
1U, 1A, 1B, 1V, 1Y, 1D, 1C, 1X, 2U, 2A, 2B, 2V,
2Y, 2D, 2C, 2X, 3U, 3A, 3B, 3V, 3Y, 3D, 3C, 3X
full distribution flux; full distribution CCT
H000
H2
1U, 1A, 1B, 1V, 1Y, 1D, 1C, 1X, 2U, 2A, 2B, 2V,
2Y, 2D, 2C, 2X, 3U, 3A, 3B, 3V, 3Y, 3D, 3C, 3X
H2= minimum flux bin; full distribution CCT
0050
G2
2Y, 2D, 2C, 2X, 3U, 3A, 3B, 3V, 3Y, 3D, 3C, 3X
full distribution flux; 5000K bin
H050
H2
2Y, 2D, 2C, 2X, 3U, 3A, 3B, 3V, 3Y, 3D, 3C, 3X
H2=minimum flux bin; 5000K bin
0055
G2
2U, 2Y, 3U, 2A, 2D, 3A, 2B, 2C, 3B, 2V, 2X, 3V
full distribution flux; 5500K bin
H055
H2
2U, 2Y, 3U, 2A, 2D, 3A, 2B, 2C, 3B, 2V, 2X, 3V
H2=minimum flux bin; 5500K bin
0056
G2
1Y, 1D, 1C, 1X, 2U, 2A, 2B, 2V, 2Y, 2D, 2C, 2X
full distribution flux; 5600K bin
H056
H2
1Y, 1D, 1C, 1X, 2U, 2A, 2B, 2V, 2Y, 2D, 2C, 2X
H2=minimum flux bin; 5600K bin
0065
G2
1U, 1A, 1B, 1V, 1Y, 1D, 1C, 1X, 2U, 2A, 2B, 2V
full distribution flux; 6500K bin
H065
H2
1U, 1A, 1B, 1V, 1Y, 1D, 1C, 1X, 2U, 2A, 2B, 2V
H2=minimum flux bin; 6500K bin
Notes:
1.
Default bin kit option is -0000
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Cool White Chromaticity Groups
0.40
0.38
3X
3V
3C
2X
0.36
3B
2V
2C
CIEy
1X
2B
0.34
1V
1A
3Y
2D
3U
2A
1D
Planckian Locus
3A
1C
1B
0.32
3D
2Y
2U
1Y
1U
0.30
0.28
0.28
0.30
0.32
0.34
0.36
0.38
CIEx
Standard Chromaticity Groups plotted on excerpt from the CIE 1931 (2°) x-y Chromaticity Diagram.
Coordinates are listed below in the table.
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Cool White Bin Coordinates
Bin code
1U
1Y
2U
2Y
3U
3Y
CIEx
0.3068
0.3144
0.3161
0.3093
0.3068
0.3144
0.3221
0.3231
0.3161
0.3144
0.3222
0.329
0.329
0.3231
0.3222
0.329
0.3366
0.3361
0.329
0.329
0.3366
0.344
0.3429
0.3361
0.3366
0.344
0.3515
0.3495
0.3429
0.344
CIEy
0.3113
0.3186
0.3059
0.2993
0.3113
0.3186
0.3261
0.312
0.3059
0.3186
0.3243
0.33
0.318
0.312
0.3243
0.33
0.3369
0.3245
0.318
0.33
0.3369
0.3428
0.3299
0.3245
0.3369
0.3428
0.3487
0.3339
0.3299
0.3428
Bin code
1A
1D
2A
2D
3A
3D
CIEx
0.3048
0.313
0.3144
0.3068
0.3048
0.313
0.3213
0.3221
0.3144
0.313
0.3215
0.329
0.329
0.3222
0.3215
0.329
0.3371
0.3366
0.329
0.329
0.3371
0.3451
0.344
0.3366
0.3371
0.3451
0.3533
0.3515
0.344
0.3451
CIEy
0.3207
0.329
0.3186
0.3113
0.3207
0.329
0.3373
0.3261
0.3186
0.329
0.335
0.3417
0.33
0.3243
0.335
0.3417
0.349
0.3369
0.33
0.3417
0.349
0.3554
0.3427
0.3369
0.349
0.3554
0.362
0.3487
0.3427
0.3554
Bin code
1B
1C
2B
2C
3B
3C
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CIEx
0.3028
0.3115
0.313
0.3048
0.3028
0.3115
0.3205
0.3213
0.313
0.3115
0.3207
0.329
0.329
0.3215
0.3207
0.329
0.3376
0.3371
0.329
0.329
0.3376
0.3463
0.3451
0.3371
0.3376
0.3463
0.3551
0.3533
0.3451
0.3463
CIEy
0.3304
0.3391
0.329
0.3207
0.3304
0.3391
0.3481
0.3373
0.329
0.3391
0.3462
0.3538
0.3417
0.335
0.3462
0.3538
0.3616
0.349
0.3417
0.3538
0.3616
0.3687
0.3554
0.349
0.3616
0.3687
0.376
0.362
0.3554
0.3687
Bin code
1V
1X
2V
2X
3V
3X
CIEx
0.3005
0.3099
0.3115
0.3028
0.3005
0.3099
0.3196
0.3205
0.3115
0.3099
0.3196
0.329
0.329
0.3207
0.3196
0.329
0.3381
0.3376
0.329
0.329
0.3381
0.348
0.3463
0.3376
0.3381
0.348
0.3571
0.3551
0.3463
0.348
CIEy
0.3415
0.3509
0.3391
0.3304
0.3415
0.3509
0.3602
0.3481
0.3391
0.3509
0.3602
0.369
0.3538
0.3462
0.3602
0.369
0.3762
0.3616
0.3538
0.369
0.3762
0.384
0.3687
0.3616
0.3762
0.384
0.3907
0.376
0.3687
0.384
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Luminous Flux Bins
Table 1:
Bin Code
G2
H2
J2
K2
Minimum
Luminous Flux (ΦV)
@ IF = 700mA
/Channel [1,2]
(lm)
3,200
3,500
3,800
4,200
Maximum
Luminous Flux (ΦV)
@ IF = 700mA
/Channel [1,2]
(lm)
3,500
3,800
4,200
4,600
Notes:
1.
Luminous flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ± 10% on flux measurements.
2.
Luminous Flux typical value is for all 24 LED dies operating at rated current. The LED is configured with 4 Channels of 6 dies in series.
Forward Voltage Bin
Table 2:
Bin Code
0
Minimum
Forward Voltage (VF)
@ IF = 700mA
/Channel [1]
(V)
19.20[2,3]
Maximum
Forward Voltage (VF)
@ IF = 700mA
/Channel [1]
(V)
23.52[2,3]
Notes:
1.
LED Engin maintains a tolerance of ± 0.24V for forward voltage measurements.
2.
All 4 white Channels have matched Vf for parallel operation
3.
Forward Voltage is binned with 6 LED dies connected in series. The LED is configured with 4 Channels of 6 dies in series each.
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Absolute Maximum Ratings
Table 3:
Parameter
Symbol
Value
Unit
DC Forward Current at Tjmax=135°C [1]
DC Forward Current at Tjmax=150°C [1]
Peak Pulsed Forward Current [2]
Reverse Voltage
Storage Temperature
Junction Temperature
Soldering Temperature [4]
Allowable Reflow Cycles
IF
IF
IFP
VR
Tstg
TJ
Tsol
1200
1000
1500 /Channel
See Note 3
-40 ~ +150
150
260
6
mA
mA
mA
V
°C
°C
°C
> 8,000 V HBM
Class 3B JESD22-A114-D
ESD Sensitivity [5]
Notes:
1.
Maximum DC forward current (per die) is determined by the overall thermal resistance and ambient temperature.
Follow the curves in Figure 10 for current de-rating.
2:
Pulse forward current conditions: Pulse Width ≤ 10msec and Duty cycle ≤ 10%.
3.
LEDs are not designed to be reverse biased.
4.
Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 5.
5.
LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZP-00CW00 in an electrostatic protected area (EPA).
An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.
Optical Characteristics @ TC = 25°C
Table 4:
Parameter
Symbol
Typical
Unit
ΦV
ΦV
3900
5000
86
5500
75
110
lm
lm
lm/W
K
[1]
Luminous Flux (@ IF = 700mA)
Luminous Flux (@ IF = 1000mA) [1]
Luminous Efficacy (@ IF = 350mA)
Correlated Color Temperature
Color Rendering Index (CRI)
Viewing Angle [2]
CCT
Ra
2Θ1/2
Degrees
Notes:
1.
Luminous flux typical value is for all 24 LED dies operating at rated current.
2.
Viewing Angle is the off-axis angle from emitter centerline where the luminous intensity is ½ of the peak value.
Electrical Characteristics @ TC = 25°C
Table 5:
Parameter
Symbol
Typical
Unit
Forward Voltage (@ IF = 700mA)
Forward Voltage (@ IF = 1000mA) [1]
VF
VF
21.0 /Channel
21.9 /Channel
V
V
Temperature Coefficient
of Forward Voltage [1]
ΔVF/ΔTJ
-16.8
mV/°C
Thermal Resistance
(Junction to Case)
RΘJ-C
0.6
°C/W
[1]
Notes:
1.
Forward Voltage is measured for a single string of 6 dies connected in series. The LED is configured with 4 Channels of 6 dies in series each.
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IPC/JEDEC Moisture Sensitivity Level
Table 6 - IPC/JEDEC J-STD-20D.1 MSL Classification:
Soak Requirements
Floor Life
Standard
Accelerated
Level
Time
Conditions
Time (hrs)
Conditions
Time (hrs)
Conditions
1
unlimited
≤ 30°C/
85% RH
168
+5/-0
85°C/
85% RH
n/a
n/a
Notes:
1.
The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and includes the maximum time
allowed out of the bag at the distributor’s facility.
Average Lumen Maintenance Projections
Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for
solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original
light output remaining at a defined time period. L70 defines the amount of operating hours at which the light
output has reached 70% of its original output.
Figure 1: De-rating curve for operation of all dies at 700mA
Notes:
1.
Ts is a thermal reference point on the emitter case
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Mechanical Dimensions (mm)
Pin Out
Ch.
Pad
Die
Color
Function
18
E
CW
Anode
D
CW
C
CW
na
na
na
1
B
CW
A
CW
na
24
F
Cathode
17
J
CW
CW
I
CW
Anode
na
H
CW
na
G
CW
na
L
CW
na
3
K
CW
Cathode
15
O
CW
N
CW
Anode
na
2
S
CW
na
R
CW
na
Q
CW
na
5
P
CW
Cathode
14
T
CW
Y
CW
Anode
na
3
X
CW
na
W
CW
na
V
CW
na
8
U
CW
2
M
-
Cathode
na
23
M
-
na
4
Figure 2: Package outline drawing.
Notes:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
2.
Thermal slug is electrically isolated
3.
Ts is a thermal reference point
5
Recommended Solder Pad Layout (mm)
+18
-24
-3
+17
+15
-5
-8
+14
+2
-23
Figure 3: Recommended solder mask opening (hatched area) for anode, cathode, and thermal pad.
Notes:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
2.
LED Engin recommends the use of copper core MCPCB’s which allow for the emitter thermal slug to be soldered directly to the copper core (so called
pedestal design). Such MCPCB technologies eliminate the high thermal resistance dielectric layer that standard MCPCB technologies use in between the
emitter thermal slug and the metal core of the MCPCB, thus lowering the overall system thermal resistance.
3.
LED Engin recommends x-ray sample monitoring for solder voids underneath the emitter thermal slug. The total area covered by solder voids should be
less than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to
higher failure rates due to thermal over stress.
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Reflow Soldering Profile
Figure 4: Reflow soldering profile for lead free soldering.
Typical Radiation Pattern
Figure 5: Typical representative spatial radiation pattern.
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Typical Relative Spectral Power Distribution
1
Relative Spectral Power
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
350
400
450
500
550
600
650
700
750
800
Wavelength (nm)
Figure 6: Typical relative spectral power vs. wavelength @ TC = 25°C.
Typical Relative Light Output
140
Relative Light Output (%)
120
100
80
60
40
20
0
0
200
400
600
800
1000
IF - Forward Current (mA)
Figure 7: Typical relative light output vs. forward current @ TC = 25°C.
Notes:
1.
Luminous Flux typical value is for all 24 LED dies operating concurrently at rated current pro Channel.
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Typical Relative Light Output over Temperature
120
Relative Light Output (%)
110
100
90
80
70
60
0
20
40
60
80
100
Case Temperature (°C)
Figure 8: Typical relative light output vs. case temperature.
Notes:
1. Luminous Flux typical value is for all 24 LED dies operating concurrently at rated current pro Channel.
Typical Forward Current Characteristics
1200
IF - Forward Current (mA)
1000
800
600
400
200
0
36
18
37
18.5
38
19
39
40
41
42
19.5
20
20.5
21
VF - Forward Voltage (V)
43
21.5
44
22
45
22.5
Figure 9: Typical forward current vs. forward voltage @ TC = at 25°C.
Note:
1.
Forward Voltage is measured for a single string of 6 dies connected in series. The LED is configured with 4 Channels of 6 dies in series each.
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Color over Angle Pattern
500
Relative color temperature (K)
400
300
200
100
0
-100
-200
-300
-400
-500
-60
-50
-40
-30
-20
-10
0
10
20
30
40
50
60
Angular Displacment (Degrees)
Figure 10: Typical representative color over angle pattern (includes 95% of the luminous flux).
Current De-rating
IF - Maximum Current (mA)
1200
1000
800
700
(Rated)
600
400
RΘJ-A
2.0°C/W
J-A==1.0˚
R=Θ
C/W
RΘ
=
3.0°C/W
J-A
R=ΘJ-A= 1.5˚ C/W
RΘJ-A==2.0˚
4.0°C/W
R=Θ
C/W
J-A
200
0
0
25
50
75
100
125
150
Maximum Ambient Temperature (°C)
Figure 11: Maximum forward current vs. ambient temperature based on TJ(MAX) = 150°C.
Notes:
1.
Maximum current assumes that all LED dies are operating at rated current.
2.
RΘJ-C [Junction to Case Thermal Resistance] for the LZP-series is typically 0.6°C/W.
3.
RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance].
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Emitter Tape and Reel Specifications (mm)
Figure 12: Emitter carrier tape specifications (mm).
Figure 13: Emitter Reel specifications (mm).
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LZP MCPCB Family
Part number
LZP-Dxxxxx
LZP-GxxxT1
LZP-HxxxT1
Type of MCPCB
5-channel
(4x6+1 strings)
2-channel
(2 x 12 + 1 string)
2-channel
(4 x 6 + 1 string)
Diameter
(mm)
Emitter + MCPCB
Typical Vf Typical If
Thermal Resistance
(V)
(mA)
(oC/W)
28.3
0.6 + 0.1 = 0.7
21.0
4 x 700
49.5
0.6 + 0.1 = 0.7
42.0
1400
49.5
0.6 + 0.1 = 0.7
21.0
2800
Mechanical Mounting of MCPCB
MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to
substrate cracking and subsequently LED dies cracking.
To avoid MCPCB bending:
o Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws.
o Care must be taken when securing the board to the heat sink. This can be done by tightening three M3
screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will
increase the likelihood of board bending.
o It is recommended to always use plastics washers in combinations with the three screws.
o If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after
tightening (with controlled torque) and then re-tighten the screws again.
Thermal interface material
To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when
mounting the MCPCB on to the heat sink.
There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal
epoxies. An example of such material is Electrolube EHTC.
It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating
conditions.
Wire soldering
o
To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150 C.
Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is
recommended to use a solder iron of more than 60W.
It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:
24-7068-7601)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
LZP-Dxxxxx
5-Channel, Standard Star MCPCB (4x6+1) Dimensions (mm)
Notes:
Unless otherwise noted, the tolerance = ± 0.20 mm.
Slots in MCPCB are for M3 or #4 mounting screws.
LED Engin recommends using plastic washers to electrically insulate screws from solder pads and electrical traces.
LED Engin recommends using thermal interface material when attaching the MCPCB to a heat sink.
LED Engin uses a copper core MCPCB with pedestal design, allowing direct solder connect between the MCPCB copper core and the emitter thermal slug. The
thermal resistance of this copper core MCPCB is: RΘC-B 0.1°C/W
Components used
MCPCB:
ESD chips:
SuperMCPCB
BZT52C36LP
(Bridge Semiconductor, copper core with pedestal design)
(NXP, for 6 LED dies in series)
Pad layout
Ch.
1
2
3
4
5
MCPCB
Pad
1
10
2
9
3
8
4
7
5
6
String/die
1/EDCBAF
2/JIHGLK
3/ONSRQP
4/TYXWVU
5/M
Function
Cathode Anode +
Cathode Anode +
Cathode Anode +
Cathode Anode +
N/A
N/A
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LZP-00CW00 (5.3-07/01/13)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
LZP-GxxxT1
2-Channel, Connectorized MCPCB with Thermistor (2x12+1) Dimensions (mm)
Notes:
Unless otherwise noted, the tolerance = ± 0.2 mm. angle = ± 1°
Slots in MCPCB are for M3 or #4-40 mounting screws. Maximum torque should not exceed 1N-m ( 8.9 lbf-in)
LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.
LED Engin recommends using thermally interface material when attaching the MCPCB to a heatsink
For the connectors it is recommended to use solid wires with gauge size, 18, 20 or 22 AWG. It is recommended to strip the insulation of the wires to a length
of 4-5mm. When stranded wires are used it is recommended to twists the strands at the end of the wire and use wire extraction toll to insert the wires.
LED Engin uses a copper core MCPCB with pedestal design, allowing direct solder connect between the MCPCB copper core and the emitter thermal slug. The
thermal resistance of this copper core MCPCB is: RΘC-B 0.1°C/W
Components used
MCPCB:
ESD chips:
Thermistor:
SuperMCPCB
BZX585-C51
BZX585-C9
NCP15WF104F03RC
Connectors:
00-9276-002-0-21-1-06
Ch.
1
2
T
Pad
LED1+
LED1LED2+
LED2NTC
NTC
Emitter pin
15, 17
8, 24
2
23
na
na
(Bridge Semiconductor, copper core with pedestal design)
(NXP, for 12 LED dies in series)
(NXP, for optional center die)
(Murata, 100kOhm for the LZx-xxxxT1, please see
www.murata.com for details on calculating the thermistor
temperature)
(AVX, poke-home)
Function
Anode
Cathode
Anode
Cathode
Anode
Cathode
COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED.
LZP-00CW00 (5.3-07/01/13)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
LZP-HxxxT1
2-Channel, Connectorized MCPCB with Thermistor (4x6+1) Dimensions (mm)
Note for Figure 1:
Unless otherwise noted, the tolerance = ± 0.2 mm. angle = ± 1°
Slots in MCPCB are for M3 or #4-40 mounting screws. Maximum torque should not exceed 1N-m ( 8.9 lbf-in)
LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.
LED Engin recommends using thermally interface material when attaching the MCPCB to a heatsink
For the connectors it is recommended to use solid wires with gauge size, 18, 20 or 22 AWG. It is recommended to strip the insulation of the wires to a length
of 4-5mm. When stranded wires are used it is recommended to twists the strands at the end of the wire and use wire extraction toll to insert the wires.
LED Engin uses a copper core MCPCB with pedestal design, allowing direct solder connect between the MCPCB copper core and the emitter thermal slug. The
thermal resistance of this copper core MCPCB is: RΘC-B 0.1°C/W
Components used
MCPCB:
ESD chips:
Thermistor:
SuperMCPCB
BZX585-C30
BZX585-C9
NCP15WF104F03RC
Connectors:
00-9276-002-0-21-1-06
Ch.
1
2
T
Pad
LED1+
LED1LED2+
LED2NTC
NTC
Emitter pin
14, 15, 17, 18
8, 5, 3, 24
2
23
na
na
(Bridge Semiconductor, copper core with pedestal design)
(NXP, for 6 LED dies in series)
(NXP, for optional center die)
(Murata, 100kOhm for the LZx-xxxxT1, please see
www.murata.com for details on calculating the thermistor
temperature)
(AVX, poke-home)
Function
Anode
Cathode
Anode
Cathode
Anode
Cathode
COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED.
LZP-00CW00 (5.3-07/01/13)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Appendix: Wire Insertion and Extraction Instructions AVX poke-home
For the AVX poke-home it is recommended to use solid wires with gauge size, 18, 20 or 22 AWG, but stranded wire
can be used as well. Push the wire in and then give slight tug on the wire to confirm that it is properly engaged.
Wire Insertion Solid conductor
Strip insulation length 4-5mm
Insert into appropriate hole to a stop
Inserted wire will be retained by contact
Wire Insertion Stranded wire conductor
Twist strands together
Insert tool into contact operation slot
Insert wire
Remove tool
Wire extraction
Insert tool into contact
Extract wire
Remove tool
Extraction Tool References:
Thin Blade Wire Extraction Tool: AVX P/N - 0692-7670-0101-000 or
Miniature Precision Screw Driver, 0.047” Tip Width
COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED.
LZP-00CW00 (5.3-07/01/13)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Company Information
LED Engin, based in California’s Silicon Valley, develops, manufactures, and sells advanced LED emitters, optics and
light engines to create uncompromised lighting experiences for a wide range of entertainment, architectural,
general lighting and specialty applications. LuxiGen™ multi-die emitter and secondary lens combinations reliably
deliver industry-leading flux density, upwards of 5000 quality lumens to a target, in a wide spectrum of colors
including whites, tunable whites, multi-color and UV LEDs in a unique patented compact ceramic package. Our
TM
LuxiTune series of tunable white lighting modules leverage our LuxiGen emitters and lenses to deliver quality,
control, freedom and high density tunable white light solutions for a broad range of new recessed and
downlighting applications. The small size, yet remarkably powerful beam output and superior in-source color
mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional light is
required.
LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions.
LED Engin reserves the right to make changes to improve performance without notice.
Please contact sales@ledengin.com or (408) 922-7200 for more information.
COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED.
LZP-00CW00 (5.3-07/01/13)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
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