High Luminous Efficacy
Neutral White LED Emitter
LZ4-00NW00
Key Features
High Luminous Efficacy 10W Neutral White LED
Ultra-small foot print – 7.0mm x 7.0mm
Single 4000K ANSI bin distribution
Surface mount ceramic package with integrated glass lens
Very low Thermal Resistance (1.1°C/W)
Individually addressable die
Very high Luminous Flux density
Spatial color uniformity across radiation pattern
JEDEC Level 1 for Moisture Sensitivity Level
Autoclave complaint (JEDEC JESD22-A102-C)
Lead (Pb) free and RoHS compliant
Reflow solderable (up to 6 cycles)
Emitter available on Standard or Serially Connected MCPCB (optional)
Typical Applications
General Lighting
Museum Lighting
Retail & Display Lighting
Hospitality Lighting
Accent & Task Lighting
Architectural Detail Lighting
Description
The LZ4-00NW00 Neutral White LED emitter provides 10W power in an extremely small package. With a 7.0mm x
7.0mm ultra-small footprint, this package provides exceptional luminous flux density. LED Engin’s patent-pending
thermally insulated phosphor layers provide spatial color uniformity across the radiation pattern and a consistent
CCT over time and temperature. LED Engin’s LZ4-00NW00 LED offers ultimate design flexibility with individually
addressable die. The high quality materials used in the package are chosen to optimize light output and minimize
stresses which results in monumental reliability and lumen maintenance. The robust product design thrives in
outdoor applications with high ambient temperatures and high humidity.
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LZ4-00NW00 (5.5-07/01/13)
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Product Nomenclature
Base part number
Part number
Description
LZ4-00NW00-xxxx
LZ4 emitter
LZ4-40NW00-xxxx
LZ4 emitter on Standard Star 1 channel MCPCB
Bin kit option codes:
NW, Neutral White (4000K – 4500K)
Kit number
suffix
Min
flux
Bin
Chromaticity bins
Description
0040
T
5B2, 5C2, 5B1, 5C1, 5A2, 5D2, 5A1, 5D1
full distribution flux; 4000K ANSI CCT bin
U040
U
5B2, 5C2, 5B1, 5C1, 5A2, 5D2, 5A1, 5D1
U=minimum flux bin; 4000K ANSI CCT
bin
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Neutral White Chromaticity Groups
0.44
0.42
0.40
5C2
CIEy
5B2
0.38
5C1
Planckian Locus
5D2
5B1
5A2
5D1
5A1
0.36
4000K ANSI
C78.377A bin
0.34
0.32
0.34
0.36
0.38
0.40
0.42
CIEx
Standard Chromaticity Groups plotted on excerpt from the CIE 1931 (2°) x-y Chromaticity Diagram.
Coordinates are listed below in the table.
Neutral White Bin Coordinates
Bin code
5B2
5B1
5A2
5A1
CIEx
0.3719
0.3736
0.3869
0.3847
0.3719
0.3702
0.3719
0.3847
0.3825
0.3702
0.3686
0.3702
0.3825
0.3804
0.3686
0.367
0.3686
0.3804
0.3783
0.367
CIEy
0.3797
0.3874
0.3958
0.3877
0.3797
0.3722
0.3797
0.3877
0.3798
0.3722
0.3649
0.3722
0.3798
0.3721
0.3649
0.3578
0.3649
0.3721
0.3646
0.3578
Bin code
5C2
5C1
5D2
5D1
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CIEx
0.3847
0.3869
0.4006
0.3978
0.3847
0.3825
0.3847
0.3978
0.395
0.3825
0.3804
0.3825
0.395
0.3924
0.3804
0.3783
0.3804
0.3924
0.3898
0.3783
CIEy
0.3877
0.3958
0.4044
0.3958
0.3877
0.3798
0.3877
0.3958
0.3875
0.3798
0.3721
0.3798
0.3875
0.3794
0.3721
0.3646
0.3721
0.3794
0.3716
0.3646
3
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Luminous Flux Bins
Table 1:
Bin
Code
Minimum
Luminous Flux (ΦV)
@ IF = 700mA [1,2]
(lm)
Maximum
Luminous Flux (ΦV)
@ IF = 700mA [1,2]
(lm)
Typical
Luminous Flux (ΦV)
@ IF = 1000mA [2]
(lm)
T
U
V
445
556
695
556
695
868
580
810
1010
Notes for Table 1:
1.
Luminous flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ± 10% on flux measurements.
2.
Future products will have even higher levels of luminous flux performance. Contact LED Engin Sales for updated information.
Forward Voltage Bins
Table 2:
Bin
Code
Minimum
Forward Voltage (VF)
@ IF = 700mA [1,2]
(V)
Maximum
Forward Voltage (VF)
@ IF = 700mA [1,2]
(V)
0
12.80
16.64
Notes for Table 2:
1.
Forward Voltage is binned with all four LED dice connected in series.
2.
LED Engin maintains a tolerance of ± 0.16V for forward voltage measurements for the four LEDs.
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Absolute Maximum Ratings
Table 3:
Parameter
Symbol
Value
Unit
DC Forward Current at Tjmax=135°C [1]
DC Forward Current at Tjmax=150°C [1]
Peak Pulsed Forward Current [2]
Reverse Voltage
Storage Temperature
Junction Temperature
Soldering Temperature [4]
Allowable Reflow Cycles
IF
IF
IFP
VR
Tstg
TJ
Tsol
1200
1000
1500
See Note 3
-40 ~ +150
150
260
6
mA
mA
mA
V
°C
°C
°C
Autoclave Conditions [5]
121°C at 2 ATM,
100% RH for 168 hours
ESD Sensitivity [6]
> 8,000 V HBM
Class 3B JESD22-A114-D
Notes for Table 3:
1.
Maximum DC forward current (per die) is determined by the overall thermal resistance and ambient temperature.
Follow the curves in Figure 10 for current derating.
2:
Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%.
3.
LEDs are not designed to be reverse biased.
4.
Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 5.
5.
Autoclave Conditions per JEDEC JESD22-A102-C.
6.
LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ4-00NW00 in an electrostatic protected area (EPA).
An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.
Optical Characteristics @ TC = 25°C
Table 4:
Parameter
Symbol
Typical
Unit
ΦV
ΦV
CCT
Ra
2Θ1/2
Θ0.9V
610
760
4000
82
95
125
lm
lm
K
[1]
Luminous Flux (@ IF = 700mA)
Luminous Flux (@ IF = 1000mA) [1]
Correlated Color Temperature
Color Rendering Index (CRI) [2]
Viewing Angle [3]
Total Included Angle [4]
Degrees
Degrees
Notes for Table 4:
1.
Luminous flux typical value is for all four LED dice operating concurrently at rated current.
2.
Minimum Color Rendering Index (CRI) is 80.
3.
Viewing Angle is the off axis angle from emitter centerline where the luminous intensity is ½ of the peak value.
4.
Total Included Angle is the total angle that includes 90% of the total luminous flux.
Electrical Characteristics @ TC = 25°C
Table 5:
Parameter
Symbol
Typical
Unit
Forward Voltage (@ IF = 700mA)
Forward Voltage (@ IF = 1000mA) [1]
VF
VF
14.0
14.6
V
V
Temperature Coefficient
of Forward Voltage [1]
ΔVF/ΔTJ
-11.9
mV/°C
Thermal Resistance
(Junction to Case)
RΘJ-C
1.1
°C/W
[1]
Notes for Table 5:
1.
Forward Voltage typical value is for all four LED dice connected in series.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
IPC/JEDEC Moisture Sensitivity Level
Table 6 - IPC/JEDEC J-STD-20 MSL Classification:
Soak Requirements
Floor Life
Standard
Accelerated
Level
Time
Conditions
Time (hrs)
Conditions
Time (hrs)
Conditions
1
Unlimited
≤ 30°C/
60% RH
168
+5/-0
85°C/
60% RH
n/a
n/a
Notes for Table 6:
1.
The standard soak time is the sum of the default value of 24 hours for the semiconductor manufacturer’s exposure time (MET) between bake and bag
and the floor life of maximum time allowed out of the bag at the end user of distributor’s facility.
Average Lumen Maintenance Projections
Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for
solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original
light output remaining at a defined time period.
Based on long-term WHTOL testing, LED Engin projects that the LZ Series will deliver, on average, 90% Lumen
Maintenance at 65,000 hours of operation at a forward current of 700 mA per die. This projection is based on
constant current operation with junction temperature maintained at or below 125°C.
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Mechanical Dimensions (mm)
Pin Out
Pad
Die
1
A
Anode
2
A
Cathode
3
B
Anode
4
B
Cathode
5
C
Anode
6
C
Cathode
7
D
Anode
8
D
Cathode
9 [2]
n/a
Thermal
1
2
Function
3
8
4
Figure 1: Package outline drawing.
7
6
5
Notes for Figure 1:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
2.
Thermal contact, Pad 9, is electrically neutral.
Recommended Solder Pad Layout (mm)
Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad.
Note for Figure 2a:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
2.
This pad layout is “patent pending”.
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Recommended Solder Mask Layout (mm)
Figure 2b: Recommended solder mask opening (hatched area) for anode, cathode, and thermal pad.
Note for Figure 2b:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
Reflow Soldering Profile
Figure 3: Reflow soldering profile for lead free soldering.
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Typical Radiation Pattern
100
90
Relative Intensity (%)
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
Angular Displacement (Degrees)
Figure 4: Typical representative spatial radiation pattern.
Typical Relative Spectral Power Distribution
1
Relative Spectral Power
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
380
430
480
530
580
630
680
730
780
830
880
Wavelength (nm)
Figure 5: Typical relative spectral power vs. wavelength @ TC = 25°C.
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Typical Relative Light Output
140
Relative Light Output (%)
120
100
80
60
40
20
0
0
200
400
600
800
1000
IF - Forward Current (mA)
Figure 6: Typical relative light output vs. forward current @ TC = 25°C.
Typical Relative Light Output over Temperature
120
Relative Light Output (%)
100
80
60
40
20
0
0
20
40
60
80
100
120
Case Temperature (ºC)
Figure 7: Typical relative light output vs. case temperature.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Forward Current Characteristics
1200
IF - Forward Current (mA)
1000
800
600
400
200
0
12
12.5
13
13.5
14
14.5
15
125
150
VF - Forward Voltage (V)
Figure 8: Typical forward current vs. forward voltage @ T C = at 25°C.
Note for Figure 8:
1.
Forward Voltage curve assumes that all four LED dice are connected in series.
Current De-rating
IF - Maximum Current (mA)
1200
1000
800
700
(Rated)
600
RΘJ-A = 4.0°C/W
RΘJ-A = 5.0°C/W
RΘJ-A = 6.0°C/W
400
200
0
0
25
50
75
100
Maximum Ambient Temperature (°C)
Figure 9: Maximum forward current vs. ambient temperature based on T J(MAX) = 150°C.
Notes for Figure 9:
1.
Maximum current assumes that all four LED dice are operating concurrently at the same current.
2.
RΘJ-C [Junction to Case Thermal Resistance] for the LZ4-00NW00 is typically 1.1°C/W.
3.
RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance].
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Emitter Tape and Reel Specifications (mm)
Figure 10: Emitter carrier tape specifications (mm).
Figure 11: Emitter Reel specifications (mm).
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
LZ4 MCPCB Family
Part number
Type of MCPCB
Diameter
(mm)
LZ4-4xxxxx
1-channel
19.9
Emitter + MCPCB
Typical Vf Typical If
Thermal Resistance
(V)
(mA)
(oC/W)
1.1 + 1.1 = 2.2
14.0
700
Mechanical Mounting of MCPCB
MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to
substrate cracking and subsequently LED dies cracking.
To avoid MCPCB bending:
o Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws.
o Care must be taken when securing the board to the heat sink. This can be done by tightening three M3
screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will
increase the likelihood of board bending.
o It is recommended to always use plastics washers in combinations with the three screws.
o If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after
tightening (with controlled torque) and then re-tighten the screws again.
Thermal interface material
To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when
mounting the MCPCB on to the heat sink.
There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal
epoxies. An example of such material is Electrolube EHTC.
It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating
conditions.
Wire soldering
To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC.
Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is
recommended to use a solder iron of more than 60W.
It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:
24-7068-7601)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
LZ4-4xxxxx
1 channel, Standard Star MCPCB (1x4) Dimensions (mm)
Notes:
Unless otherwise noted, the tolerance = ± 0.2 mm.
Slots in MCPCB are for M3 or #4-40 mounting screws.
LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.
Electrical connection pads on MCPCB are labeled “+” for Anode and “-” for Cathode
LED Engin recommends thermal interface material when attaching the MCPCB to a heatsink
The thermal resistance of the MCPCB is: RΘC-B 1.1°C/W
Components used
MCPCB:
ESD chips:
HT04503
BZX585-C30
(Bergquist)
(NXP, for 4 LED dies in series)
Pad layout
Ch.
1
MCPCB
Pad
+
String/die
Function
1/ABCD
Cathode Anode +
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Company Information
LED Engin, based in California’s Silicon Valley, develops, manufactures, and sells advanced LED emitters, optics and
light engines to create uncompromised lighting experiences for a wide range of entertainment, architectural,
general lighting and specialty applications. LuxiGen™ multi-die emitter and secondary lens combinations reliably
deliver industry-leading flux density, upwards of 5000 quality lumens to a target, in a wide spectrum of colors
including whites, tunable whites, multi-color and UV LEDs in a unique patented compact ceramic package. Our
LuxiTuneTM series of tunable white lighting modules leverage our LuxiGen emitters and lenses to deliver quality,
control, freedom and high density tunable white light solutions for a broad range of new recessed and
downlighting applications. The small size, yet remarkably powerful beam output and superior in-source color
mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional light is
required.
LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions.
LED Engin reserves the right to make changes to improve performance without notice.
Please contact sales@ledengin.com or (408) 922-7200 for more information.
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