SPECIFICATION
CUSTOMER : MIKROELEKTRONIKA
MODULE NO.:
WDG0151-TMI-V#N00
APPROVED BY:
( FOR CUSTOMER USE ONLY ) PCB VERSION:
SALES BY
VERSION
APPROVED BY
DATE
DATA:
CHECKED BY
REVISED
SUMMARY
PAGE NO.
0
2009/11/10
First issue
1 of 30
PREPARED BY
MODLE NO:
DOC. FIRST ISSUE
RECORDS OF REVISION
VERSION
DATE
0
2009/11/10
REVISED
PAGE NO.
SUMMARY
First issue
2 of 30
Contents
1.Module classification information
2.Precautions in Use of LCM
3.General Specification
4.Absolute Maximum Ratings
5.Electrical Characteristics
6.Optical Characteristics
7.Interface Pin Function
8.Counter Drawing & Block Diagram
9.Timing Characteristics
10.Display Control Instruction
11.Detailed Explanation
12.Reliability
13.Backlight Information
14.Inspection specification
15.Material List of Components for RoHs
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1.Module Classification Information
W D G 0151- T M I-
V# N00
Brand:WINSTAR DISPLAY CORPORATION
Custom:D
Display Type:H→ Character Type ; G→ Graphic Type N → LCD Display
Model serials no.0000 - ZZZZ
Backlight Type:
LCD Mode:
N→ Without backlight
P→ LED, Blue
B→ EL, Blue green
A→ LED, Amber
D→ EL, Green
R→ LED, Red
W→ EL, White
O→ LED, Orange
F→ CCFL, White
G→ LED, Green
Y→ LED, Yellow Green
T→ LED, White
B→ TN Positive, Gray
T→ FSTN Negative
N→ TN Negative,
G→ STN Positive, Gray
Y→ STN Positive, Yellow Green
M→ STN Negative, Blue
F→ FSTN Positive
LCD Polarizer
A→ Reflective, N.T, 6:00
H→ Transflective, W.T,6:00
Type/
D→ Reflective, N.T, 12:00
K→ Transflective, W.T,12:00
Temperature
G→ Reflective, W. T, 6:00
C→ Transmissive, N.T,6:00
range/ View
J→ Reflective, W. T, 12:00
F→ Transmissive, N.T,12:00
direction
B→ Transflective, N.T,6:00
I→ Transmissive, W. T, 6:00
E→ Transflective, N.T.12:00
L→ Transmissive, W.T,12:00
Special Code
V:Build in Negative Voltage
N:IC NT7107,NT7108C
# : Fit in with the ROHS Directions and regulations;
0:Sales code 0:Version
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2.Precautions in Use of LCD Module
(1)Avoid applying excessive shocks to the module or making any alterations or modifications to it.
(2)Don’t make extra holes on the printed circuit board, modify its shape or change the components of
LCD Module.
(3)Don’t disassemble the LCM.
(4)Don’t operate it above the absolute maximum rating.
(5)Don’t drop, bend or twist LCM.
(6)Soldering: only to the I/O terminals.
(7)Storage: please storage in anti-static electricity container and clean environment.
(8). Winstar have the right to change the passive components
(9). Winstar have the right to change the PCB Rev.
3.General Specification
ITEM
STANDARD VALUE
UNIT
Number of dots
128 ×64
dots
Outline dimension
78.0 (W) ×70.0 (H) ×14.3 (T)
mm
View area
62.0(W) ×44.0(H)
mm
Active area
56.3(W) ×38.38(H)
mm
Dot size
0.42(W) ×0.58(H)
mm
Dot pitch
0.44(W) ×0.60(H)
mm
LCD type
View direction
Backlight
STN Negative, Blue, Transmissive
(In LCD production, It will occur slightly color difference. We can
only guarantee the same color in the same batch.)
6 o’clock
LED , White
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4.Absolute Maximum Ratings
ITEM
SYMBOL
MIN.
TYP.
MAX.
UNIT
Operating Temperature
TOP
-20
-
+70
℃
Storage Temperature
TST
-30
-
+80
℃
Input Voltage
VI
0
-
VDD
V
Supply Voltage For Logic
VDD-VSS
0
-
6.5
V
Supply Voltage For LCD
VDD-VLCD
0
-
17.0
V
5.Electrical Characteristics
ITEM
Logic Voltage
SYMBOL
CONDITION
MIN.
TYP.
MAX.
UNIT
VDD-VSS
-
4.5
5.0
5.5
V
Ta=-20℃
-
-
-
V
Ta=25℃
7.62
8.51
9.26
V
Ta=+70℃
-
-
-
V
Supply Voltage For
LCD
VDD-VO
*Note
Input High Volt.
VIH
-
2.0
-
VDD
V
Input Low Volt.
VIL
-
0
-
0.8
V
Output High Volt.
VOH
-
2.4
-
VDD
V
Output Low Volt.
VOL
-
0
-
0.4
V
Supply Current
IOP
5.0
2.8
3.1
3.4
mA
* Note: Please design the VOP adjustment circuit on customer's main board
Vdd
VR
10K~20K
Vo
LCM
Module
Vee
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6.Optical Characteristics
ITEM
View Angle
Contrast Ratio
SYMBAL
CONDITION
MIN
TYP
MAX
UNIT
(V)θ
CR≧ 2
20
-
40
deg.
(H)φ
CR≧ 2
-30
-
30
deg.
CR
-
-
3
-
-
T rise
-
-
200
300
ms
T fall
-
-
150
200
ms
Response Time
Definitions
( Visual angle direction )
Brightness at selected state ( BS )
Brightness at non-selected state ( Bns )
Selected state
CR =
X
Brightness (%)
Z
φ
6.1
Non-selected state
Bs
Bns
θY
Operating voltage for LCD driving
■ View Angles
■ Contrast Ratio
■ Response time
Selected Condition
Nonselected Condition
90 %
100 %
Brightness
Nonselected Condition
10 %
tr
Rise Time
Page 7 of 30
7 of 30
td
Decay Time ( fall time tf )
7.Interface Pin Function
Pin No. Symbol
Level
Description
1
CS1
L
Select Segment 1 ~ Segment 64
2
CS2
L
Select Segment 65 ~ Segment128
3
Vss
0V
4
VDD
5.0V
5
VO
6
D/I
H/L
H: Data , L: Instruction
7
R/W
H/L
H: Read(MPU Module) , L :Write(MPU→ Module)
8
E
H
Enable signal
9
DB0
H/L
Data bus line
10
DB1
H/L
Data bus line
11
DB2
H/L
Data bus line
12
DB3
H/L
Data bus line
13
DB4
H/L
Data bus line
14
DB5
H/L
Data bus line
15
DB6
H/L
Data bus line
16
DB7
H/L
Data bus line
17
RST
L
18
VEE
Negative Voltage Output
19
A
Power supply for B/L(+)
20
K
Power supply for B/L(-)
Ground
Supply voltage for logic
(Variable) Operating voltage for LCD
Reset the LCM
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8.Counter Drawing & Block diagram
7 8 .0
2 .0
8 .0
5 6 .3 (A A )
1 0 .8 5
2 0 - 1 .0 P T H
2 0 - 2 .0 P A D
1
1 4 .3 M a x
9 .7
20
64.92
1 2 8 X 6 4 D o ts
4 - 2 .5 P T H
4 - 5 .0 P A D
6 8 .0
1 .6
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
L E D B /L
0.6
0 .4 4
0 .4 2
T h e n o n -sp e cified to le ran c e o f d im e n sio n is
0.58
15.81
38.38(AA)
7.4
13.0
55.2
70.0 0.5
44.0(VA)
1 .8
2.54
P 2 .5 4 * 1 9 = 4 8 .2 6
2.54
1 3 .0
5 .0
0 .5
7 4 .0
6 2 .0 (V A )
D O T S IZ E
S C A L E 1 0 /1
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0 .3 m m .
CS1
CS2
V ss
VDD
Vo
D /I
R /W
E
DB0
DB1
DB2
DB3
DB4
DB5
DB6
DB7
RST
VEE
A
K
NT7108C
Seg65~128
Seg Driver
80 series
or
68 series
E
D/I
R/W
DB0~DB7
Com Driver
NT7107C
Com1~64
N.V.
Generator
MPU
Seg Driver
Bias and
Power Circuit
NT7108C
Seg1~64
FR,M,CL,CLK1,CLK2
128X64 DOT
CS1
CS2
RST
Power on
reset circuit
Vdd
VO
Vss
VR
10K or 20K
Vee
Optional
External contrast adjustment.
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9.Timing Characteristics
MPU Interface
Characteristic
(T=25℃, VDD=+5.0V±0.5)
Symbol
Min
Typ
Max
Unit
E cycle
tcyc
1000
-
-
ns
E high level width
twhE
450
-
-
ns
E low level width
twlE
450
-
-
ns
E rise time
tr
-
-
25
ns
E tall time
tf
-
-
25
ns
Address set-up time
tas
140
-
-
ns
Address hold time
tah
10
-
-
ns
Data set-up time
tdsw
140
-
-
ns
Data delay time
tddr
-
-
320
ns
Data hold time (write)
tdhw
10
-
-
ns
Data hold time (read)
tdhr
20
-
-
ns
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10.Display Control Instruction
The display control instructions control the internal state of the NT7108. Instruction is received from
MPU to NT7108 for the display control. The following table shows various instructions.
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11.Detailed Explanation
The display data appears when D is 1 and disappears when D is 0. Though the data is not on the
screen with D=0, it remains in the display data RAM. Therefore, you can make it appear by
changing D=0 into D=1.
SET ADDRESS (Y ADDRESS)
Y address (AC0-AC5) of the display data RAM is set in the Y address counter. An address is set by
instruction and increased by 1 automatically by read or write operations of display data.
SET PAGE (X ADDRESS)
X address (AC0-AC2) of the display data RAM is set in the X address register. Writing or reading to
or from MPU is executed in this specified page until the next page is set.
DISPLAY START LINE (Z ADDRESS)
Z address (AC0-AC5) of the display data RAM is set in the display start line register and displayed
at the top of the screen. When the display duty cycle is 1/64 or others (1/32-1/64), the data of total
line number of LCD screen, from the line specified by display start line instruction, is displayed.
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STATUS READ
BUSY
When BUSY is 1, the Chip is executing internal operation and no instructions are accepted.
When BUSY is 0, the Chip is ready to accept any instructions.
ON/OFF
When ON/OFF is 1, the display is OFF.
When ON/OFF is 0, the display is ON.
RESET
When RESET is 1, the system is being initialized.
In this condition, no instructions except status read can be accepted.
When RESET is 0, initializing has finished and the system is in usual operation condition.
WRITE DISPLAY DATA
Writes data (D0-D7) into the display data RAM. After writing instruction, Y address is increased by
1automatically.
READ DISPLAY DATA
Reads data (D0-D7) from the display data RAM. After reading instruction, Y address is increased by
1 automatically.
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12.RELIABILITY
Content of Reliability Test (wide temperature, -20℃~70℃
℃)
Environmental Test
Test Item
High Temperature
storage
Content of Test
Endurance test applying the high storage
temperature for a long time.
Test Condition
Note
80℃
200hrs
2
Low Temperature
storage
Endurance test applying the high storage
temperature for a long time.
-30℃
200hrs
1,2
High Temperature
Operation
Endurance test applying the electric stress
(Voltage & Current) and the thermal stress to
the element for a long time.
70℃
200hrs
——
Low Temperature
Operation
Endurance test applying the electric stress
under low temperature for a long time.
-20℃
200hrs
1
The module should be allowed to stand at 60
High Temperature/
Humidity Operation
Thermal shock
resistance
℃,90%RH max
For 96hrs under no-load condition excluding
the polarizer,
Then taking it out and drying it at normal
temperature.
The sample should be allowed stand the
following 10 cycles of operation
-20℃
30min
25℃
5min
1 cycle
70℃
60℃,90%RH
96hrs
-20℃/70℃
10 cycles
1,2
——
30min
Vibration test
Total fixed amplitude :
1.5mm
Vibration Frequency :
Endurance test applying the vibration during
10~55Hz
transportation and using.
One cycle 60 seconds to
3 directions of X,Y,Z
for Each 15 minutes
Static electricity test
Endurance test applying the electric stress to
the terminal.
VS=800V,RS=1.5k
CS=100pF
1 time
Note1: No dew condensation to be observed.
Note2: The function test shall be conducted after 4 hours storage at the normal
Temperature and humidity after remove from the test chamber.
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3
——
Note3: Vibration test will be conducted to the product itself without putting it in a container.
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13.Backlight Information
PARAMETER
SYMBOL
MIN
TYP
MAX
UNIT
Supply Current
ILED
57.6
64
100
mA
Supply Voltage
V
3.4
3.5
3.6
V
Reverse Voltage
VR
-
-
5
V
Luminous Intensity
IV
282
344
-
CD/M2
-
50K
-
Hr.
LED Life Time
(For Reference
only)
Color
TEST
CONDITION
V=3.5V
ILED=64mA
ILED 64mA
25℃
℃,50-60%RH,
(Note 1)
White
Note: The LED of B/L is drive by current only, drive voltage is for reference only.
drive voltage can make driving current under safety area (current between
minimum and maximum).
Note1 :50K hours is only a estimate for reference.
2.Drive from pin19,pin20
R
A
B/L
K
LCM
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14. Inspection specification
NO
Item
Criterion
AQL
01
Electrical
Testing
1.1 Missing vertical, horizontal segment, segment contrast defect.
1.2 Missing character , dot or icon.
1.3 Display malfunction.
1.4 No function or no display.
1.5 Current consumption exceeds product specifications.
1.6 LCD viewing angle defect.
1.7 Mixed product types.
1.8 Contrast defect.
0.65
02
Black or white
spots on LCD
(display only)
2.1 White and black spots on display 0.25mm, no more than
three white or black spots present.
2.2 Densely spaced: No more than two spots or lines within 3mm
2.5
3.1 Round type : As following drawing
2.5
03
LCD black
spots, white
spots,
contamination
(non-display)
3.2 Line type : (As following drawing)
Length
Width
--W
L
0.02
W
L
0.03
W
0.05
W
---
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Acceptable Q TY
Accept no dense
2.5
2
As round type
04
Polarizer
bubbles
If bubbles are visible,
judge using black spot
specifications, not easy
to find, must check in
specify direction.
Size
Acceptable Q TY
Accept no dense
3
2
0
Total Q TY
20 of 30
3
2.5
NO
Item
05
Scratches
Criterion
AQL
Follow NO.3 LCD black spots, white spots, contamination
Symbols Define:
x: Chip length
y: Chip width
z: Chip thickness
k: Seal width
t: Glass thickness a: LCD side length
L: Electrode pad length:
6.1 General glass chip :
6.1.1 Chip on panel surface and crack between panels:
C
06
C
C
Chipped
glass
2.5
C
C
C
21 of 30
C
NO
Item
Criterion
AQL
x: Chip length
y: Chip width
z: Chip thickness
k: Seal width
t: Glass thickness
a: LCD side length
L: Electrode pad length
6.2 Protrusion over terminal :
6.2.1 Chip on electrode pad :
C
C
C
Glass
06
2.5
cra
ck
C
C
L
22 of 30
C
L
23 of 30
NO
Item
07
Cracked glass
08
Backlight
elements
Criterion
AQL
LCD
2.5
0.65
2.5
LCD
0.65
2.5
09
Bezel
0.65
C
C
C
The height of the COB should not exceed the height indicated in the
10
PCB COB
assembly diagram.
10.4 There may not be more than 2mm of sealant outside the seal area on
the PCB. And there should be no more than three places.
10.5 No oxidation or contamination PCB terminals.
10.6 Parts on PCB must be the same as on the production characteristic
chart. There should be no wrong parts, missing parts or excess
parts.
10.7 The jumper on the PCB should conform to the product characteristic
chart.
10.8 If solder gets on bezel tab pads, LED pad, zebra pad or screw hold
pad, make sure it is smoothed down.
10.9 The Scraping testing standard for Copper Coating of PCB
2.5
2.5
0.65
2.5
2.5
0.65
0.65
2.5
2.5
X
Y
X * Y