365nm UV LED Gen 2 Emitter
LZ1-00UV00
Key Features
365nm UV LED with 1200mW flux output at 2.7W power dissipation
Ultra-small foot print – 4.4mm x 4.4mm
Highest Radiant Flux density
Surface mount ceramic package with integrated glass lens
Very low Thermal Resistance (4.2°C/W)
JEDEC Level 1 for Moisture Sensitivity Level
Lead (Pb) free and RoHS compliant
Reflow solderable (up to 6 cycles)
Emitter available on Standard or Miniature MCPCB (optional)
Typical Applications
Curing
Printing
PCB Exposure
Sterilization
Medical
Currency Verification
Fluorescence Microscopy
Inspection of dyes, rodent and animal contamination
Forensics
Description
The LZ1-00UV00 UV LED emitter provides superior radiometric power in the wavelength range specifically required
for applications like curing, printing, sterilization, currency verification, and various medical applications. With a
4.4mm x 4.4mm ultra-small footprint, this package provides exceptional optical power density. The patented
design has unparalleled thermal and optical performance. The high quality materials used in the package are
chosen to optimize light output, have excellent UV resistance, and minimize stresses which results in monumental
reliability and radiant flux maintenance.
UV RADIATION
Avoid exposure to the beam
Wear protective eyewear
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LZ1-00UV00 (3.1 – 11/20/18)
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Part number options
Base part number
Part number
Description
LZ1-00UV00-xxxx
LZ1 emitter
LZ1-10UV00-xxxx
LZ1 emitter on Standard Star MCPCB
LZ1-30UV00-xxxx
LZ1 emitter on Miniature round MCPCB
Bin kit option codes
UV, Ultra-Violet (365nm)
Kit number
suffix
Min
flux
Bin
Color Bin Range
Description
0100*
M
U0 – U0
Flux bin M and above; wavelength U0 bin
only
* Previous version was -0000, please refer to Mechanical Dimensions section on p.6, PCN 54-2 and 55 for more details.
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Radiant Flux Bins
Table 1:
Bin Code
Minimum
Radiant Flux (Φ)
@ IF = 700mA [1,2]
(mW)
Maximum
Radiant Flux (Φ)
@ IF = 700mA [1,2]
(mW)
M
1000
1250
N
1250
1600
Notes for Table 1:
o
1.
Radiant flux performance is measured at specified current, 10ms pulse width, Tc = 25 C. LED Engin maintains a tolerance of ± 10% on flux measurements.
Peak Wavelength Bins
Table 2:
Bin Code
Minimum
Peak Wavelength (λP)
@ IF = 700mA [1]
(nm)
Maximum
Peak Wavelength (λP)
@ IF = 700mA [1]
(nm)
U0
365
370
Notes for Table 2:
o
1.
Peak wavelength is measured at specified current, 10ms pulse width, Tc = 25 C. LED Engin maintains a tolerance of ± 2.0nm on peak wavelength
measurements.
Forward Voltage Bins
Table 3:
Bin Code
Minimum
Forward Voltage (VF)
@ IF = 700mA [1]
(V)
Maximum
Forward Voltage (VF)
@ IF = 700mA [1]
(V)
0
3.5
4.5
Notes for Table 3:
o
1.
Forward voltage is measured at specified current, 10ms pulse width, Tc = 25 C. LED Engin maintains a tolerance of ± 0.04V for forward voltage measurements.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Absolute Maximum Ratings
Table 4:
Parameter
DC Forward Current
Symbol
Value
Unit
IF
1000
mA
[1]
Peak Pulsed Forward Current
[2]
IFP
1000
mA
Reverse Voltage
VR
See Note 3
V
Storage Temperature
Tstg
-40 ~ +150
°C
Junction Temperature
TJ
115
°C
Soldering Temperature[4]
Tsol
260
°C
Allowable Reflow Cycles
6
ESD Sensitivity[5]
> 2,000 V HBM
Class 2 JESD22-A114-D
Notes for Table 4:
1.
Maximum DC forward current is determined by the overall thermal resistance and ambient temperature.
Follow the curves in Figure 11 for current derating.
2.
Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%.
3.
LEDs are not designed to be reverse biased.
4.
Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 5.
5.
LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ1-00UV00 in an electrostatic protected area (EPA).
An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.
Optical Characteristics @ TC = 25°C
Table 5:
Parameter
Symbol
Typical
Unit
Radiant Flux (@ IF = 700mA)
Φ
1200
mW
Radiant Flux (@ IF = 1000mA)
Φ
1680
mW
λP
365
nm
2Θ1/2
70
Degrees
Θ0.9V
105
Degrees
Peak Wavelength
Viewing Angle
[1]
[2]
Total Included Angle [3]
Notes for Table 5:
1.
When operating the UV LED, observe safety precaution given in IEC 62471 Risk Group 3. Avoid eye and skin exposure to unshielded product.
2.
Viewing Angle is the off axis angle from emitter centerline where the radiometric power is ½ of the peak value.
3.
Total Included Angle is the total angle that includes 90% of the total radiant flux.
Electrical Characteristics @ TC = 25°C
Table 6:
Parameter
Symbol
Typical
Unit
Forward Voltage (@ IF = 700mA)
VF
3.8
V
Temperature Coefficient
of Forward Voltage
ΔVF/ΔTJ
-1.3
mV/°C
Thermal Resistance
(Junction to Case)
RΘJ-C
4.2
°C/W
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
IPC/JEDEC Moisture Sensitivity Level
Table 7 - IPC/JEDEC J-STD-20D.1 MSL Classification:
Soak Requirements
Floor Life
Standard
Accelerated
Level
Time
Conditions
Time (hrs)
Conditions
Time (hrs)
Conditions
1
Unlimited
≤ 30°C/
85% RH
168
+5/-0
85°C/
85% RH
n/a
n/a
Notes for Table 7:
1.
The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and
includes the maximum time allowed out of the bag at the distributor’s facility.
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Mechanical Dimensions (mm)
Pin Out
Pad
Function
1
Cathode
2
Anode
3
Anode
4
Cathode
5
[2]
Thermal
1
2
5
4
3
Figure 1: Package outline drawing.
Notes for Figure 1:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
2.
Thermal contact, Pad 5, is electrically neutral.
3.
Previous version of the emitter (p/n: LZ1-00UV00-0000) has different marking: -,+,+,- for pin 1,2,3,4. Please refer to PCN 54-2 for more details.
Recommended Solder Pad Layout (mm)
Non-pedestal MCPCB Design
Pedestal MCPCB Design
Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad for non-pedestal and pedestal design
Note for Figure 2a:
1. Unless otherwise noted, the tolerance = ± 0.20 mm.
2. Pedestal MCPCB allows the emitter thermal slug to be soldered directly to the metal core of the MCPCB. Such MCPCB eliminate t he high thermal resistance
dielectric layer that standard MCPCB technologies use in between the emitter thermal slug and the metal core of the MCPCB, thus lowering the overall system
thermal resistance.
3. LED Engin recommends x-ray sample monitoring for solder voids underneath the emitter thermal slug. The total area covered by solder voids should be less
than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to higher failure
rates due to thermal over stress.
4. This emitter is compatible with all LZ1 MCPCBs provided that the MCPCB design follows the recommended solder mask layout (Figure 2b).
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Recommended Solder Mask Layout (mm)
Non-pedestal MCPCB Design
Pedestal MCPCB Design
Figure 2b: Recommended solder mask opening for anode, cathode, and thermal pad for non-pedestal and pedestal design
Note for Figure 2b:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
Recommended 8mil Stencil Apertures Layout (mm)
Figure 2c: Recommended solder mask opening for anode, cathode, and thermal pad for non-pedestal and pedestal design
Note for Figure 2c:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Reflow Soldering Profile
Figure 3: Reflow soldering profile for lead free soldering
Typical Radiation Pattern
100%
90%
80%
Relative Intensity
70%
60%
50%
40%
30%
20%
10%
0%
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20
Angle (degrees)
30
40
50
60
70
80
90
Figure 4: Typical representative spatial radiation pattern
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Typical Relative Spectral Power Distribution
1
Relative Spectral Power
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
300
325
350
375
400
425
450
4.0
4.2
Wavelength (nm)
Figure 5: Typical relative spectral power vs. wavelength @ TC = 25°C
Typical Forward Current Characteristics
1200
IF - Forward Current (mA)
1000
800
600
400
200
0
3.0
3.2
3.4
3.6
3.8
VF - Forward Voltage (V)
Figure 6: Typical forward current vs. forward voltage @ T C = 25°C
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Typical Normalized Radiant Flux over Current
1.6
Normalized Radiant Flux
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
200
400
600
800
1000
1200
IF - Forward Current (mA)
Figure 7: Typical normalized radiant flux vs. forward current @ T C = 25°C
Typical Normalized Radiant Flux over Temperature
1.4
Normalized Radiant Flux
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
25
50
75
100
TC - Case Temperature (°C)
Figure 8: Typical normalized radiant flux vs. case temperature
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Typical Peak Wavelength Shift over Current
3.00
Peak Wavelength Shift (nm)
2.00
1.00
0.00
-1.00
-2.00
-3.00
0
200
400
600
800
1000
1200
IF - Forward Current (mA)
Figure 9: Typical peak wavelength shift vs. forward current @ Tc = 25°C
Typical Peak Wavelength Shift over Temperature
5.00
Peak Wavelength Shift (nm)
4.00
3.00
2.00
1.00
0.00
-1.00
-2.00
0
25
50
75
100
TC - Case Temperature (°C)
Figure 10: Typical peak wavelength shift vs. case temperature
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Current De-rating
1200
IF - Forward Current (mA)
1000
800
700
(Rated)
600
RΘJA = 9°C/W
400
RΘJA = 11°C/W
RΘJA = 13°C/W
200
0
0
25
50
75
100 (TJ(MAX) = 115)
125
TA - Ambient Temperature (°C)
Figure 11: Maximum forward current vs. ambient temperature based on T J(MAX) = 115°C
Notes for Figure 11:
1.
RΘJ-C [Junction to Case Thermal Resistance] for the LZ1-00UV00 is typically 4.2°C/W.
2.
RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance].
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Emitter Tape and Reel Specifications (mm)
Figure 12: Emitter carrier tape specifications (mm).
Ø 178mm (SMALL REEL)
Ø 330mm (LARGE REEL)
Figure 13: Emitter reel specifications (mm).
Notes:
1.
Small reel quantity: up to 500 emitters
2.
Large reel quantity: 501-2500 emitters.
3.
Single flux bin and single wavelength bin per reel.
4.
Previous version of the emitter (p/n: LZ1-00UV00-0000) has different emitter position in the Tape and Reel. Please refer to PCN 54-2 for more details.
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LZ1 MCPCB Family
Emitter + MCPCB
Typical Vf Typical If
Thermal Resistance
(V)
(mA)
(oC/W)
Part number
Type of MCPCB
Diameter
(mm)
LZ1-1xxxxx
1-channel Star
19.9
4.2 + 1.5 = 5.7
3.8
700
LZ1-3xxxxx
1-channel Mini
11.5
4.2 + 2.0 = 6.2
3.8
700
Mechanical Mounting of MCPCB
MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to
substrate cracking and subsequently LED dies cracking.
To avoid MCPCB bending:
o Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws.
o Care must be taken when securing the board to the heat sink. This can be done by tightening three M3
screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will
increase the likelihood of board bending.
o It is recommended to always use plastics washers in combinations with the three screws.
o If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after
tightening (with controlled torque) and then re-tighten the screws again.
Thermal interface material
To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when
mounting the MCPCB on to the heat sink.
There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal
epoxies. An example of such material is Electrolube EHTC.
It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating
conditions.
Wire soldering
To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC.
Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is
recommended to use a solder iron of more than 60W.
It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:
24-7068-7601)
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LZ1-1xxxxx
1 channel, Standard Star MCPCB (1x1) Dimensions (mm)
Notes:
Unless otherwise noted, the tolerance = ± 0.2 mm.
Slots in MCPCB are for M3 or #4-40 mounting screws.
LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.
LED Engin recommends using thermal interface material when attaching the MCPCB to a heat sink.
The thermal resistance of the MCPCB is: RΘC-B 1.5°C/W
Previous version of the emitter (p/n: LZ1-10UV00-0000) has different marking: -,+,+,- for pin 1,2,3,4. Please refer to PCN 55 for more details.
Components used
MCPCB:
HT04503
ESD/TVS Diode: BZT52C5V1LP-7
VBUS05L1-DD1
(Bergquist)
(Diodes, Inc., for 1 LED die)
(Vishay Semiconductors, for 1 LED die)
Pad layout
Ch.
1
MCPCB
Pad
1,2,3
4,5,6
String/die
Function
1/A
Cathode Anode +
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LZ1-3xxxxx
1 channel, Mini Round MCPCB (1x1) Dimensions (mm)
Notes:
Unless otherwise noted, the tolerance = ± 0.20 mm.
LED Engin recommends using thermal interface material when attaching the MCPCB to a heat sink.
The thermal resistance of the MCPCB is: RΘC-B 2.0°C/W
Previous version of the emitter (p/n: LZ1-30UV00-0000) has different marking: -,+,+,- for pin 1,2,3,4. Please refer to PCN 55 for more details.
Components used
MCPCB:
HT04503
ESD/TVS Diode: BZT52C5V1LP-7
VBUS05L1-DD1
(Bergquist)
(Diodes, Inc., for 1 LED die)
(Vishay Semiconductors, for 1 LED die)
Pad layout
Ch.
1
MCPCB
Pad
1
2
String/die
Function
1/A
Anode +
Cathode -
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About LED Engin
LED Engin, an OSRAM business based in California’s Silicon Valley, develops, manufactures, and sells advanced LED
emitters, optics and light engines to create uncompromised lighting experiences for a wide range of
TM
entertainment, architectural, general lighting and specialty applications. LuxiGen multi-die emitter and
secondary lens combinations reliably deliver industry-leading flux density, upwards of 5000 quality lumens to a
target, in a wide spectrum of colors including whites, tunable whites, multi-color and UV LEDs in a unique patented
TM
compact ceramic package. Our LuxiTune series of tunable white lighting modules leverage our LuxiGen emitters
and lenses to deliver quality, control, freedom and high density tunable white light solutions for a broad range of
new recessed and downlighting applications. The small size, yet remarkably powerful beam output and superior insource color mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional
light is required. LED Engin is committed to providing products that conserve natural resources and reduce
greenhouse emissions; and reserves the right to make changes to improve performance without notice.
For more information, please contact LEDE-Sales@osram.com or +1 408 922-7200.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin