LZ4-40R708-0000

940nm Dual Junction Infrared LED Emitter LZ4-00R708 Key Features  940nm Dual Junction Infrared LED  Ultra-small foot print – 7.0mm x 7.0mm  Surface mount ceramic package with integrated glass lens  Low Thermal Resistance (2.8°C/W)  Individually addressable die  Ultra-high Radiant Flux density  JEDEC Level 1 for Moisture Sensitivity Level  Lead (Pb) free and RoHS compliant  Reflow solderable  Emitter available on Serially Connected MCPCB (optional) Typical Applications  Surveillance cameras  Traffic management  Gesture recognition  Machine vision  Biometric sensing Description The LZ4-00R708 940nm Dual Junction Infrared LED emitter generates 3.2W nominal output at 8.5W power dissipation in an extremely small package. With a 7.0mm x 7.0mm ultra-small footprint, this package provides exceptional radiant flux density. The patent-pending design has unparalleled thermal and optical performance. The high quality materials used in the package are chosen to optimize optical performance and minimize stresses which results in monumental reliability and flux maintenance. The robust product design thrives in outdoor applications with high ambient temperatures and high humidity. Notes This product emits non visible infrared light, which can be hazardous depending on total system configuration (including, but not limited to optics, drive current and temperature). Observe safety precaution given in IEC 62471 when operating this product. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00R708 (1.4- - 11/19/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Part number options Base part number Part number Description LZ4-00R708-xxxx LZ4 Infrared 940nm Dual Junction Emitter LZ4-40R708-xxxx LZ4 Infrared 940nm Dual Junction Emitter on 1 channel Standard Star MCPCB Bin kit option codes R7, Infrared Dual Junction (940nm) Kit number suffix Min flux Bin Wavelength Bin Range Description 0000 RS F09 full distribution flux; full distribution wavelength Notes: 1. Default bin kit option is -0000 COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 2 LZ4-00R708 (1.4 – 11/19/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Radiant Flux Bins Table 1: Bin Code Minimum Radiant Flux (Φ) @ IF = 700mA [1,2] (W) Maximum Radiant Flux (Φ) @ IF = 700mA [1,2] (W) RS 2.40 3.80 T 3.80 4.80 Notes for Table 1: 1. Radiant flux performance is measured at 10ms pulse, T C = 25°C. LED Engin maintains a tolerance of ± 10% on flux measurements. 2. Future products will have even higher levels of radiant flux performance. Contact LED Engin Sales for updated information. Peak Wavelength Bin Table 2: Bin Code Minimum Peak Wavelength (λP) @ IF = 700mA [1] (nm) Maximum Peak Wavelength (λP) @ IF = 700mA [1] (nm) F09 920 960 Notes for Table 2: 1. Peak wavelength is measured at 10ms pulse, T C = 25°C. LED Engin maintains a tolerance of ± 2.0nm on peak wavelength measurements. Forward Voltage Bins Table 3: Bin Code Minimum Forward Voltage (VF) @ IF = 700mA [1,2] (V) Maximum Forward Voltage (VF) @ IF = 700mA [1,2] (V) 0 10.8 14.8 Notes for Table 3: 1. Forward voltage is measured at 10ms pulse, T C = 25°C. 2. Forward Voltage is binned with all four LED dice connected in series. 3. LED Engin maintains a tolerance of ± 0.16V for forward voltage measurements for the four LEDs COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 3 LZ4-00R708 (1.4 – 11/19/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Absolute Maximum Ratings Table 4: Parameter Symbol Value Unit IF IFP VR Tstg 1000 5000 See Note 3 -40 ~ +125 145 260 mA mA V °C °C °C [1] DC Forward Current Peak Pulsed Forward Current [2] Reverse Voltage Storage Temperature Junction Temperature Soldering Temperature [4] TJ(MAX) Tsol Notes for Table 4: 1. Maximum DC forward current (per die) is determined by the overall thermal resistance and ambient temperature. Follow the curves in Figure 11 for current derating. 2: Pulse forward current conditions: Pulse Width ≤ 150μs and Duty Cycle ≤ 10%. 3. LEDs are not designed to be reverse biased. 4. Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 3. 5. LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ4-00R708 in an electrostatic protected area (EPA). An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1. Optical Characteristics @ TC = 25°C Table 5: Parameter Radiant Flux (@ IF = 700mA) Symbol Typical Unit Φ 3.75 W [1,2] Radiant Flux (@ IF = 1000mA) [1,2] Φ 5.25 W Wall Plug Efficiency (@ IF = 700mA) Ƞ 46 % Peak Wavelength λP 940 nm 2Θ1/2 100 Degrees Θ0.9 120 Degrees Viewing Angle [3] Total Included Angle [4] Notes for Table 5: 1. This product emits non visible infrared light, which can be hazardous depending on total system configuration (including, but not limited to optics, drive current and temperature). Observe safety precaution given in IEC 62471 when operating this product. 2. Radiant flux typical value is for all four LED dice operating concurrently at rated current. 3. Viewing Angle is the off axis angle from emitter centerline where the radiant power is ½ of the peak value. 4. Total Included Angle is the total angle that includes 90% of the total radiant flux. Electrical Characteristics @ TC = 25°C Table 6: Parameter Symbol Typical Unit VF 11.6 V VF 12.0 V Temperature Coefficient of Forward Voltage ΔVF/ΔTJ -8.0 mV/°C Thermal Resistance (Junction to Case) RΘJ-C 2.8 °C/W Forward Voltage (@ IF = 700mA) [1] Forward Voltage (@ IF = 1000mA) [1] Notes for Table 6: 1. Forward Voltage typical value is for all four LED dice connected in series. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 4 LZ4-00R708 (1.4 – 11/19/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Peak Pulse Forward Current (IFP) Capability Table 7: Parameter Value Unit tp = 150μs, D=10% 5000 mA tp = 10ms, D=20% 2000 mA Notes: 1. tp = Pulse Width, T = Period, D = Duty Cycle = tp/T. IPC/JEDEC Moisture Sensitivity Level Table 8 - IPC/JEDEC J-STD-20 MSL Classification: Soak Requirements Floor Life Standard Accelerated Level Time Conditions Time (hrs) Conditions Time (hrs) Conditions 1 1 Year ≤ 30°C/ 85% RH 168 +5/-0 85°C/ 85% RH n/a n/a Notes for Table 8: 1. The standard soak time is the sum of the default value of 24 hours for the semiconductor manufacturer’s exposure time (MET) between bake and bag and the floor life of maximum time allowed out of the bag at the end user of distributor’s facility. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 5 LZ4-00R708 (1.4 – 11/19/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Mechanical Dimensions (mm) Pin Out Pad Die 1 A Anode 2 A Cathode 3 B Anode 4 B Cathode 5 C Anode 6 C Cathode 7 D Anode 8 D Cathode 9 [2] n/a Thermal 1 Function 2 3 8 4 Figure 1: Package outline drawing. 7 6 5 Notes for Figure 1: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. Thermal contact, Pad 9, is electrically neutral. Recommended Solder Pad Layout (mm) Non-pedestal MCPCB Design Pedestal MCPCB Design Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad for non-pedestal and pedestal design Note for Figure 2a: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. Pedestal MCPCB allows the emitter thermal slug to be soldered directly to the metal core of the MCPCB. Such MCPCB eliminate t he high thermal resistance dielectric layer that standard MCPCB technologies use in between the emitter thermal slug and the metal core of the MCPCB, thus lowering the overall system thermal resistance. 3. LED Engin recommends x-ray sample monitoring for solder voids underneath the emitter thermal slug. The total area covered by solder voids should be less than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to higher failure rates due to thermal over stress. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 6 LZ4-00R708 (1.4 – 11/19/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Recommended Solder Mask Layout (mm) Non-pedestal MCPCB Design Pedestal MCPCB Design Figure 2b: Recommended solder mask opening for anode, cathode, and thermal pad for non-pedestal and pedestal design Note for Figure 2b: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. Recommended 8 mil Stencil Apertures Layout (mm) Non-pedestal MCPCB Design Pedestal MCPCB Design Figure 2c: Recommended 8mil stencil apertures for anode, cathode, and thermal pad for non-pedestal and pedestal design Note for Figure 2c: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 7 LZ4-00R708 (1.4 – 11/19/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Reflow Soldering Profile Figure 3: Reflow soldering profile for lead free soldering. Typical Radiation Pattern 100% 90% 80% Relatiive Intensity 70% 60% 50% 40% 30% 20% 10% 0% -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Angular Displacement (Degrees) Figure 4: Typical representative spatial radiation pattern. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 8 LZ4-00R708 (1.4 – 11/19/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Typical Relative Spectral Power Distribution 1 0.9 Relative Spectral Power 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 650 700 750 800 850 900 950 1000 1050 Wavelength (nm) Figure 5: Relative spectral power vs. wavelength @ T C = 25°C. Typical Forward Current Characteristics 1200 IF - Forward Current (mA) 1000 800 600 400 200 0 9.0 9.5 10.0 10.5 11.0 11.5 12.0 12.5 13.0 13.5 14.0 VF (V) Figure 6: Typical forward current vs. forward voltage @ TC = 25°C. Notes: 1. Forward Voltage curve assumes that all four LED dice are connected in series. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 9 LZ4-00R708 (1.4 – 11/19/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Typical Normalized Radiant Flux over Current 160% Normalized Radiant Flux 140% 120% 100% 80% 60% 40% 20% 0% 0 200 400 600 800 1000 Forward Current (mA) Figure 7: Typical normalized radiant flux vs. forward current @ T C = 25°C. Typical Normalized Radiant Flux over Case Temperature 120% Normalized Radiant Flux 100% 80% 60% 40% 20% 0% 0 25 50 75 100 TC - Case Temperature (°C) Figure 8: Typical normalized radiant flux vs. case temperature. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 10 LZ4-00R708 (1.4 – 11/19/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Typical Peak Wavelength Shift over Current 3.0 Peak Wavelength Shift (nm) 2.0 1.0 0.0 -1.0 -2.0 -3.0 -4.0 -5.0 0 200 400 600 800 1000 Forward Current (mA) Figure 9: Typical peak wavelength shift vs. forward current @ Tc = 25°C Typical Peak Wavelength Shift over Case Temperature 30.0 Peak Wavelength Shift (nm) 25.0 20.0 15.0 10.0 5.0 0.0 -5.0 -10.0 0 25 50 75 100 Case Temperature (°C) Figure 10: Typical peak wavelength shift vs. case temperature. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 11 LZ4-00R708 (1.4 – 11/19/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Current De-rating 1200 IF - Forward Current (mA) 1000 800 700 (Rated) 600 400 RΘJA = 4°C/W RΘJA = 5°C/W RΘJA = 6°C/W 200 0 0 25 50 75 100 TA - Ambient Temperature (°C) 125 (TJ(MAX) = 145) 150 Figure 11: Maximum forward current vs. ambient temperature based on T J(MAX) = 145°C. Notes: 1. Maximum current assumes that all four LED dice are operating concurrently at the same current. 2. RΘJ-C [Junction to Case Thermal Resistance] for the LZ4-00R708 is typically 2.8°C/W. 3. RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance]. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 12 LZ4-00R708 (1.4 – 11/19/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Emitter Tape and Reel Specifications (mm) Figure 12: Emitter carrier tape specifications (mm). Figure 13: Emitter Reel specifications (mm). Notes: 1. Reel quantity minimum: 100 emitters. Reel quantity maximum: 1200 emitters. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 13 LZ4-00R708 (1.4 – 11/19/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin LZ4 MCPCB Family Part number Type of MCPCB Diameter (mm) Emitter + MCPCB Thermal Resistance (oC/W) LZ4-4xxxxx 1-channel 19.9 2.8 + 1.1 = 3.9 Typical VF (V) Typical IF (mA) 11.6 700 Mechanical Mounting of MCPCB   MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to substrate cracking and subsequently LED dies cracking. To avoid MCPCB bending: o Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws. o Care must be taken when securing the board to the heat sink. This can be done by tightening three M3 screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will increase the likelihood of board bending. o It is recommended to always use plastics washers in combinations with the three screws. o If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after tightening (with controlled torque) and then re-tighten the screws again. Thermal interface material    To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when mounting the MCPCB on to the heat sink. There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal epoxies. An example of such material is Electrolube EHTC. It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating conditions. Wire soldering   To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC. Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is recommended to use a solder iron of more than 60W. It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn: 24-7068-7601) COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 14 LZ4-00R708 (1.4 – 11/19/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin LZ4-4xxxxx 1 channel, Standard Star MCPCB (1x4) Dimensions (mm) Notes:  Unless otherwise noted, the tolerance = ± 0.2 mm.  Slots in MCPCB are for M3 or #4-40 mounting screws.  LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.  LED Engin recommends thermal interface material when attaching the MCPCB to a heatsink  The thermal resistance of the MCPCB is: RΘ C-B 1.1°C/W Components used MCPCB: ESD chips: HT04503 BZX585-C30 (Bergquist) (NXP, for 4 LED dies in series) Pad layout Ch. 1 MCPCB Pad 1, 2, 3 4, 5 String/die 1/ABCD COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. Function Cathode Anode + 15 LZ4-00R708 (1.4 – 11/19/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin About LED Engin LED Engin, an OSRAM business based in California’s Silicon Valley, develops, manufactures, and sells advanced LED emitters, optics and light engines to create uncompromised lighting experiences for a wide range of TM entertainment, architectural, general lighting and specialty applications. LuxiGen multi-die emitter and secondary lens combinations reliably deliver industry-leading flux density, upwards of 5000 quality lumens to a target, in a wide spectrum of colors including whites, tunable whites, multi-color and UV LEDs in a unique patented TM compact ceramic package. Our LuxiTune series of tunable white lighting modules leverage our LuxiGen emitters and lenses to deliver quality, control, freedom and high density tunable white light solutions for a broad range of new recessed and downlighting applications. The small size, yet remarkably powerful beam output and superior insource color mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional light is required. LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions; and reserves the right to make changes to improve performance without notice. For more information, please contact LEDE-Sales@osram.com or +1 408 922-7200. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 16 LZ4-00R708 (1.4 – 11/19/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin