940nm Infrared LED Emitter
LZ4-00R508
Key Features
High Efficacy 940nm 5W Infrared LED
Ultra-small foot print – 7.0mm x 7.0mm
Surface mount ceramic package with integrated glass lens
Low Thermal Resistance (2.8°C/W)
Individually addressable die
Very high Radiant Flux density
Autoclave compliant (JEDEC JESD22-A102-C)
JEDEC Level 1 for Moisture Sensitivity Level
Lead (Pb) free and RoHS compliant
Reflow solderable (up to 6 cycles)
Emitter available on Serially Connected MCPCB (optional)
Typical Applications
Inspection
Security lighting
Description
The LZ4-00R508 940nm Infrared LED emitter generates 1.9W nominal output at 5W power dissipation in an
extremely small package. With a 7.0mm x 7.0mm ultra-small footprint, this package provides exceptional radiant
flux density. The patented design has unparalleled thermal and optical performance. The high quality materials
used in the package are chosen to optimize light output and minimize stresses which results in monumental
reliability and lumen maintenance. The robust product design thrives in outdoor applications with high ambient
temperatures and high humidity.
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LZ4-00R508 (1.0 – 08/23/13)
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Part number options
Base part number
Part number
Description
LZ4-00R508-xxxx
LZ4 emitter
LZ4-40R508-xxxx
LZ4 emitter on 1 channel Standard Star MCPCB
Bin kit option codes
R5, Infrared (940nm)
Kit number
suffix
Min
flux
Bin
Color Bin Range
Description
0000
N
F09
full distribution flux; full distribution
wavelength
Notes:
1. Default bin kit option is -0000
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Radiant Flux Bins
Table 1:
Bin Code
Minimum
Radiant Flux (Φ)
@ IF = 700mA [1,2]
(W)
Maximum
Radiant Flux (Φ)
@ IF = 700mA [1,2]
(W)
N
1.25
1.60
P
1.60
2.00
Q
2.00
2.40
Notes for Table 1:
1.
Radiant flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ± 10% on flux measurements.
2.
Future products will have even higher levels of radiant flux performance. Contact LED Engin Sales for updated information.
Peak Wavelength Bin
Table 2:
Bin Code
Minimum
Peak Wavelength (λP)
@ IF = 700mA [1]
(nm)
Maximum
Peak Wavelength (λP)
@ IF = 700mA [1]
(nm)
F09
920
960
Notes for Table 2:
1.
LED Engin maintains a tolerance of ± 2.0nm on peak wavelength measurements.
Forward Voltage Bins
Table 3:
Bin Code
Minimum
Forward Voltage (VF)
@ IF = 700mA [1,2]
(V)
Maximum
Forward Voltage (VF)
@ IF = 700mA [1,2]
(V)
0
6.8
10.8
Notes for Table 3:
1.
Forward Voltage is binned with all four LED dice connected in series.
2.
LED Engin maintains a tolerance of ± 0.16V for forward voltage measurements for the four LEDs.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Absolute Maximum Ratings
Table 4:
Parameter
Symbol
Value
Unit
IF
IFP
VR
Tstg
TJ
Tsol
1000
2000
See Note 3
-40 ~ +125
125
260
6
mA
[1]
DC Forward Current
Peak Pulsed Forward Current [2]
Reverse Voltage
Storage Temperature
Junction Temperature
Soldering Temperature [4]
Allowable Reflow Cycles
mA
V
°C
°C
°C
Autoclave Conditions [5]
121°C at 2 ATM,
100% RH for 168 hours
ESD Sensitivity [6]
> 8,000 V HBM
Class 3B JESD22-A114-D
Notes for Table 4:
1.
Maximum DC forward current (per die) is determined by the overall thermal resistance and ambient temperature.
Follow the curves in Figure 11 for current derating.
2:
Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%.
3.
LEDs are not designed to be reverse biased.
4.
Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 3.
5.
Autoclave Conditions per JEDEC JESD22-A102-C.
6.
LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ4-00R508 in an electrostatic protected area (EPA).
An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.
Optical Characteristics @ TC = 25°C
Table 5:
Parameter
Radiant Flux (@ IF = 700mA)
Symbol
Typical
Unit
Φ
1.90
W
Φ
2.65
W
λP
940
nm
2Θ1/2
95
Degrees
Θ0.9
110
Degrees
[1]
Radiant Flux (@ IF = 1000mA) [1]
[2]
Peak Wavelength
Viewing Angle
[3]
Total Included Angle [4]
Notes for Table 5:
1.
Radiant flux typical value is for all four LED dice operating concurrently at rated current.
2.
This product emits non visible infrared light, which can be hazardous depending on total system configuration (including, but not limited to optics, drive
current and temperature). Observe safety precaution given in IEC 62471 when operating this product.
3.
Viewing Angle is the off axis angle from emitter centerline where the radiant power is ½ of the peak value.
4.
Total Included Angle is the total angle that includes 90% of the total radiant flux.
Electrical Characteristics @ TC = 25°C
Table 6:
Parameter
Symbol
Typical
Unit
Forward Voltage (@ IF = 700mA) [1]
VF
7.2
V
Forward Voltage (@ IF = 1000mA) [1]
VF
8.0
V
Temperature Coefficient
of Forward Voltage
ΔVF/ΔTJ
-8.0
mV/°C
Thermal Resistance
(Junction to Case)
RΘJ-C
2.8
°C/W
Notes for Table 6:
1. Forward Voltage typical value is for all four LED dice connected in series.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
IPC/JEDEC Moisture Sensitivity Level
Table 7 - IPC/JEDEC J-STD-20 MSL Classification:
Soak Requirements
Floor Life
Standard
Accelerated
Level
Time
Conditions
Time (hrs)
Conditions
Time (hrs)
Conditions
1
1 Year
≤ 30°C/
85% RH
168
+5/-0
85°C/
85% RH
n/a
n/a
Notes for Table 7:
1.
The standard soak time is the sum of the default value of 24 hours for the semiconductor manufacturer’s exposure time (MET) between bake a nd bag
and the floor life of maximum time allowed out of the bag at the end user of distributor’s facility.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Mechanical Dimensions (mm)
Pin Out
Pad
Die
1
A
Anode
2
A
Cathode
3
B
Anode
4
B
Cathode
5
C
Anode
6
C
Cathode
7
D
Anode
8
D
Cathode
9 [2]
n/a
Thermal
1
2
Function
3
8
4
Figure 1: Package outline drawing.
7
6
5
Notes for Figure 1:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
2. Thermal contact, Pad 9, is electrically neutral.
Recommended Solder Pad Layout (mm)
Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad.
Note for Figure 2a:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
2.
This pad layout is “patent pending”.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Recommended Solder Mask Layout (mm)
Figure 2b: Recommended solder mask opening for anode, cathode, and thermal pad
Note for Figure 2b:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
Recommended 8 mil Stencil Apertures Layout (mm)
Figure 2c: Recommended 8mil stencil apertures layout for anode, cathode, and thermal pad
Note for Figure 2c:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Reflow Soldering Profile
Figure 3: Reflow soldering profile for lead free soldering.
Typical Radiation Pattern
100
90
Relative Intensity (%)
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
Angular Displacement (Degrees)
Figure 4: Typical representative spatial radiation pattern.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Relative Spectral Power Distribution
1.00
0.90
Relative Spectral Power
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0.00
650
700
750
800
850
900
950
1000
1050
Wavelength (nm)
Figure 5: Relative spectral power vs. wavelength @ TC = 25°C.
Typical Peak Wavelength Shift over Current
3.00
Peak Wavelength Shift (nm)
2.00
1.00
0.00
-1.00
-2.00
-3.00
0
200
400
600
800
1000
1200
IF - Forward Current (mA)
Figure 6: Typical peak wavelength shift vs. forward current @ Tc = 25°C
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Peak Wavelength Shift over Temperature
40.00
Peak Wavelength Shift (nm)
30.00
20.00
10.00
0.00
-10.00
-20.00
0
10
20
30
40
50
60
70
80
90
100
Case Temperature (°C)
Figure 7: Typical peak wavelength shift vs. case temperature
Typical Normalized Radiant Flux over Current
160%
Normalized Radiant Flux
140%
120%
100%
80%
60%
40%
20%
0%
0
200
400
600
800
1000
1200
IF - Forward Current (mA)
Figure 8: Typical normalized radiant flux vs. forward current @ TC = 25°C
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Normalized Radiant Flux over Temperature
140%
Normalized Radiant Flux
120%
100%
80%
60%
40%
20%
0%
0
10
20
30
40
50
60
70
80
90
100
Case Temperature (°C)
Figure 9: Typical normalized radiant flux vs. case temperature.
Typical Forward Current Characteristics
1200
IF - Forward Current (mA)
1000
800
600
400
200
0
4.0
4.4
4.8
5.2
5.6
6.0
6.4
6.8
7.2
7.6
8.0
8.4
8.8
VF - Forward Voltage (V)
Figure 10: Typical forward current vs. forward voltage @ TC = 25°C
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Current De-rating
IF - Maximum Current (mA)
1200
1000
800
700
(Rated)
600
RΘJ-A = 4.0°C/W
RΘJ-A = 5.0°C/W
RΘJ-A = 6.0°C/W
400
200
0
0
25
50
75
100
125
Maximum Ambient Temperature (°C)
Figure 11: Maximum forward current vs. ambient temperature based on TJ(MAX) = 125°C.
Notes for Figure 11:
1.
Maximum current assumes that all four LED dice are operating concurrently at the same current.
2.
RΘJ-C [Junction to Case Thermal Resistance] for the LZ4-00R508 is typically 2.8°C/W.
3.
RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance].
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Emitter Tape and Reel Specifications (mm)
Figure 12: Emitter carrier tape specifications (mm).
Figure 13: Emitter Reel specifications (mm).
Notes for Figure 13:
1.
Reel quantity minimum: 100 emitters. Reel quantity maximum: 1200 emitters.
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LZ4 MCPCB Family
Part number
Type of MCPCB
Diameter
(mm)
LZ4-4xxxxx
1-channel
19.9
Emitter + MCPCB
Typical Vf Typical If
Thermal Resistance
(V)
(mA)
(oC/W)
2.8 + 1.1 = 3.9
7.2
700
Mechanical Mounting of MCPCB
o Mechanical stress on the emitter that could be caused by bending the MCPCB should be avoided. The
stress can cause the substrate to crack and as a result might lead to cracks in the dies.
o Therefore special attention needs to be paid to the flatness of the heat sink surface and the torque
on the screws. Maximum torque should not exceed 1 Nm (8.9 lbf/in).
o Care must be taken when securing the board to the heatsink to eliminate bending of the MCPCB. This
can be done by tightening the three M3 screws (or #4-40) in steps and not all at once. This is
analogous to tightening a wheel of an automobile
o It is recommended to always use plastic washers in combination with three screws. Two screws could
more easily lead to bending of the board.
o If non taped holes are used with self-tapping screws it is advised to back out the screws slightly after
tighten (with controlled torque) and retighten the screws again.
Thermal interface material
o To properly transfer the heat from the LED to the heatsink a thermally conductive material is required
when mounting the MCPCB to the heatsink
o There are several materials which can be used as thermal interface material, such as thermal paste,
thermal pads, phase change materials and thermal epoxies. Each has pro’s and con’s depending on
the application. For our emitter it is critical to verify that the thermal resistance is sufficient for the
selected emitter and its environment.
o To properly transfer the heat from the MCPCB to the heatsink also special attention should be paid to
the flatness of the heatsink.
Wire soldering
o For easy soldering of wires to the MCPCB it is advised to preheat the MCPCB on a hot plate to a
maximum of 150°. Subsequently apply the solder and additional heat from the solder iron to initiate a
good solder reflow. It is recommended to use a solder iron of more than 60W. We advise to use lead
free, no-clean solder. For example SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn: 24-7068-7601)
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LZ4-4xxxxx
1 channel, Standard Star MCPCB (1x4) Dimensions (mm)
Notes:
Unless otherwise noted, the tolerance = ± 0.2 mm.
Slots in MCPCB are for M3 or #4-40 mounting screws.
LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.
Electrical connection pads on MCPCB are labeled “+” for Anode and “-” for Cathode
LED Engin recommends thermal interface material when attaching the MCPCB to a heatsink
The thermal resistance of the MCPCB is: RΘC-B 1.1°C/W
Components used
MCPCB:
ESD chips:
HT04503
BZX585-C30
(Bergquist)
(NXP, for 4 LED dies in series)
Pad layout
Ch.
1
MCPCB
Pad
1,2,3
4,5
String/die
Function
1/ABCD
Cathode Anode +
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Company Information
LED Engin, Inc., based in California’s Silicon Valley, specializes in ultra-bright, ultra compact solid state lighting
solutions allowing lighting designers & engineers the freedom to create uncompromised yet energy efficient
lighting experiences. The LuxiGen™ Platform — an emitter and lens combination or integrated module solution,
delivers superior flexibility in light output, ranging from 3W to 90W, a wide spectrum of available colors, including
whites, multi-color and UV, and the ability to deliver upwards of 5,000 high quality lumens to a target. The small
size combined with powerful output allows for a previously unobtainable freedom of design wherever high-flux
density, directional light is required. LED Engin’s packaging technologies lead the industry with products that
feature lowest thermal resistance, highest flux density and consummate reliability, enabling compact and efficient
solid state lighting solutions.
LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions.
LED Engin reserves the right to make changes to improve performance without notice.
Please contact sales@ledengin.com or (408) 922-7200 for more information.
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