LZP-00UB00-00U6

385-410nm VIOLET LED Emitter LZP-00UB00 Key Features  Ultra-high flux output 385-410nm surface mount ceramic VIOLET LED package with integrated glass lens  5nm wavelength bins  Small high density foot print – 12.0mm x 12.0mm  Exceptionally low Thermal Resistance (0.6°C/W)  Electrically neutral thermal slug  Autoclave complaint (JEDEC JESD22-A102-C)  JEDEC Level 1 for Moisture Sensitivity Level  Lead (Pb) free and RoHS compliant  Copper core MCPCB option with emitter thermal slug directly soldered to the copper core Typical Applications  Curing  Sterilization  Medical  Currency Verification  Fluorescence Microscopy  Inspection of dyes, rodent and animal contamination,  Leak detection  Forensics Description The LZP-series emitter is rated for 90W power handling in an ultra compact package. With a small 12.0mm x 12.0mm footprint, this package provides exceptional radiant flux density. The patented design has unparalleled thermal and optical performance. The high quality materials used in the package are chosen to optimize Radiant Flux and minimize stresses which results in monumental reliability and radiant flux maintenance. The robust product design thrives in outdoor applications with high ambient temperatures and high humidity. UV RADIATION Avoid exposure to the beam Wear protective eyewear COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZP-00UB00 (1.3 - 11/13/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Part number options Base part number Part number Description LZP-00UB00-xxxx LZP emitter LZP-D0UB00-xxxx LZP emitter on 5 channel 4x6+1 Star MCPCB Bin kit option codes Single wavelength bin (5nm range) Kit number suffix Min flux Bin Color Bin Range Description 00U4 C2 U4 C2 minimum flux; wavelength U4 bin only 00U5 C2 U5 C2 minimum flux; wavelength U5 bin only 00U6 C2 U6 C2 minimum flux; wavelength U6 bin only 00U7 Z U7 Z minimum flux; wavelength U7 bin only 00U8 Z U8 Z minimum flux; wavelength U8 bin only COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZP-00UB00 (1.3 – 11/13/2018) 2 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Radiant Flux Bins Table 1: Bin Code Minimum Radiant Flux (Φ) @ IF = 700mA [1,2] (W) Maximum Radiant Flux (Φ) @ IF = 700mA [1,2] (W) Z 15.0 20.0 C2 20.0 25.0 D2 25.0 31.2 Notes for Table 1: 1. Radiant flux performance is measured at specified current, 10ms pulse width, TC = 25oC. LED Engin maintains a tolerance of ± 10% on flux measurements. Peak Wavelength Bins Table 2: Bin Code Minimum Peak Wavelength (λP) @ IF = 700mA [1] (nm) Maximum Peak Wavelength (λP) @ IF = 700mA [1] (nm) U4 385 390 U5 390 395 U6 395 400 U7 400 405 U8 405 410 Notes for Table 2: 1. Peak wavelength is measured at specified current, 10ms pulse width, TC=25oC. LED Engin maintains a tolerance of ± 2.0nm on peak wavelength measurements. Forward Voltage Bins Table 3: Bin Code Minimum Forward Voltage (VF/Ch) @ IF = 700mA [1,2] (V) Maximum Forward Voltage (VF/Ch) @ IF = 700mA [1,2] (V) 0 20.64 23.52 Notes for Table 3: 1. LED Engin maintains a tolerance of ± 0.24V for forward voltage measurements. 2. Forward Voltage is binned with 6 LED dies connected in series at specified current, 10ms pulse width, TC=25oC.. The LED is configured with 4 Channels of 6 dies in series each. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZP-00UB00 (1.3 – 11/13/2018) 3 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Absolute Maximum Ratings Table 4: Parameter Symbol Value Unit IF IFP VR Tstg TJ Tsol 1000 /Channel 1000 /Channel See Note 3 -40 ~ +150 130 260 mA mA V °C °C °C [1] DC Forward Current Peak Pulsed Forward Current [2] Reverse Voltage Storage Temperature Junction Temperature Soldering Temperature [4] Notes for Table 4: 1. Maximum DC forward current (per die) is determined by the overall thermal resistance and ambient temperature. Follow the curves in Figure 10 for current derating. 2. Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%. 3. LEDs are not designed to be reverse biased. 4. Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 3. 5. LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZP-00UA00in an electrostatic protected area (EPA). An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1. Optical Characteristics @ TC = 25°C Table 5: Parameter Symbol Radiant Flux (@ IF = 700mA) Typical Unit 385-390nm 390-400nm 400-410nm Φ 24.5 24.5 22.5 Radiant Flux (@ IF = 1000mA) Φ 34.0 34.0 31.0 W Peak Wavelength [1] λP 385 395 405 nm Viewing Angle [2] Total Included Angle [3] W 2Θ1/2 130 Degrees Θ0.9V 140 Degrees Notes for Table 5: 1. When operating the VIOLET LED, observe IEC 60825-1 class 3B rating. Avoid exposure to the beam. 2. Viewing Angle is the off axis angle from emitter centerline where the Radiant intensity is ½ of the peak value. 3. Total Included Angle is the total angle that includes 90% of the total Radiant flux. Electrical Characteristics @ TC = 25°C Table 6: Parameter Forward Voltage (@ IF = 700mA) Temperature Coefficient of Forward Voltage [1] Thermal Resistance (Junction to Case) [1] Symbol Typical Unit VF 22.0 /Channel V ΔVF/ΔTJ -13.2 mV/°C RΘJ-C 0.6 °C/W Notes for Table 6: 1. Forward Voltage is measured for a single string of 6 dies connected in series. The LED is configured with 4 Channels of 6 dies in series each. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZP-00UB00 (1.3 – 11/13/2018) 4 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin IPC/JEDEC Moisture Sensitivity Level Table 7 - IPC/JEDEC J-STD-20D.1 MSL Classification: Soak Requirements Floor Life Standard Accelerated Level Time Conditions Time (hrs) Conditions Time (hrs) Conditions 1 Unlimited ≤ 30°C/ 85% RH 168 +5/-0 85°C/ 85% RH n/a n/a Notes for Table 7: 1. The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and includes the maximum time allowed out of the bag at the distributor’s facility. Average Radiant Flux Maintenance Projections Lumen maintenance generally describes the ability of an emitter to retain its output over time. The useful lifetime for power LEDs is also defined as Radiant Flux Maintenance, with the percentage of the original light output remaining at a defined time period. Based on long-term WHTOL testing, LED Engin projects that the LZ Series will deliver, on average, 70% Radiant Flux Maintenance (RP70%) at 20,000 hours of operation at a forward current of 700 mA per die. This projection is based on constant current operation with junction temperature maintained at or below 80°C. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZP-00UB00 (1.3 – 11/13/2018) 5 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Mechanical Dimensions (mm) Pin Out Ch. Pad Die Color Function 18 E UB Anode D UB C UB na na na 1 B UB A UB na 24 F UB Cathode 17 J UB I UB Anode na H UB na G UB na L UB na 3 K UB Cathode 15 O UB N UB Anode na 2 S UB na R UB na Q UB na 5 P UB Cathode 14 T UB Y UB Anode na 3 Figure 1: Package outline drawing. Notes for Figure 1: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. Thermal slug is electrically isolated 3. Ts is a thermal reference point X UB na W UB na V UB na 8 U UB 2 M - Cathode na 23 M - na 4 Recommended Solder Pad Layout (mm) 5 +18 -24 -3 +17 +15 -5 -8 +14 +2 -23 Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad Notes: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. LED Engin recommends the use of copper core MCPCB’s which allow for the emitter thermal slug to be soldered directly to the copper core (so called pedestal design). Such MCPCB technologies eliminate the high thermal resistance dielectric layer that standard MCPCB technologies use in between the emitter thermal slug and the metal core of the MCPCB, thus lowering the overall system thermal resistance. 3. LED Engin recommends x-ray sample monitoring for solder voids underneath the emitter thermal slug. The total area covered by solder voids should be less than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to higher failure rates due to thermal over stress. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZP-00UB00 (1.3 – 11/13/2018) 6 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Recommended Solder Mask Layout (mm) Figure 2b: Recommended solder mask opening for anode, cathode, and thermal pad Note for Figure 2b: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. Recommended 8 mil Stencil Apertures Layout (mm) Figure 2c: Recommended 8mil stencil apertures for anode, cathode, and thermal pad Note for Figure 2c: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZP-00UB00 (1.3 – 11/13/2018) 7 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Reflow Soldering Profile Figure 3: Reflow soldering profile for lead free soldering. Typical Radiation Pattern 1.00 0.90 0.80 Relative Intensity 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0.00 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 Angular Displacement (Degrees) 40 50 60 70 80 90 Figure 4: Typical representative spatial radiation pattern. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZP-00UB00 (1.3 – 11/13/2018) 8 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Typical Relative Spectral Power Distribution 1.0 0.9 Relative Spectral Power 0.8 0.7 0.6 0.5 0.4 385nm 0.3 395nm 0.2 405nm 0.1 0.0 340 360 380 400 420 440 460 Wavelength (nm) Figure 5: Relative spectral power vs. wavelength @ TC = 25°C. Typical Forward Current Characteristics 1200 IF - Forward Current (mA) 1000 800 600 400 200 0 17 18 19 20 21 22 23 24 25 VF- Forward Voltage (V) Figure 6: Typical forward current vs. forward voltage @ TC = 25°C. Notes: 1. Forward Voltage curve is per channel with 6 LED dies connected in series. The LZP-00UB00 is configured with 4 Channels of 6 dies in series each. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZP-00UB00 (1.3 – 11/13/2018) 9 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Typical Normalized Radiant Flux over Current 160% 140% Relative Radiant Flux 120% 100% 80% 60% 40% 20% 0% 0 200 400 600 800 1000 1200 Forward Current (mA) Figure 7: Typical normalized radiant flux vs. forward current @ TC = 25°C. Typical Normalized Radiant Flux over Temperature 120% Normalized Radiant Flux 100% 80% 60% 385nm 40% 395nm 405nm 20% 0% 0 20 40 60 80 100 120 TC - Case Temperature (°C) Figure 8: Typical normalized radiant flux vs. case temperature @700mA COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZP-00UB00 (1.3 – 11/13/2018) 10 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Typical Peak Wavelength Shift over Current 3.0 Peak Wavelength Shift (nm) 2.0 1.0 0.0 -1.0 -2.0 -3.0 0 200 400 600 800 1000 1200 Forward Current (mA) Figure 9: Typical peak wavelength shift vs. forward current @ Tc = 25°C Typical Peak Wavelength Shift over Temperature 5.0 4.0 Peak Wavelength Shift (nm) 3.0 2.0 1.0 0.0 -1.0 -2.0 -3.0 -4.0 -5.0 0 25 50 75 100 Case Temperature (°C) Figure 10: Typical peak wavelength shift vs. case temperature @700mA COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZP-00UB00 (1.3 – 11/13/2018) 11 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Current De-rating 1200 IF - Forward Current (mA) 1000 800 700 (Rated) 600 400 RΘ JA = 1.0°C/W RΘ JA = 1.5°C/W RΘ JA = 2.0°C/W 200 0 0 25 50 75 100 125 (TJ(MAX) = 130) 150 TA - Ambient Temperature (°C) Figure 10: Maximum forward current vs. ambient temperature based on TJ(MAX) = 130°C. Notes: 1. Maximum current assumes that all LED dies are operating at rated current. 2. RΘJ-C [Junction to Case Thermal Resistance] for the LZP-series is typically 0.6°C/W. 3. RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance]. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZP-00UB00 (1.3 – 11/13/2018) 12 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin LZP MCPCB Family Part number Type of MCPCB Diameter (mm) LZP-Dxxxxx 5-channel (4x6+1 strings) 28.3 COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. Emitter + MCPCB Typical Vf Thermal Resistance (V) (°C /W) Typical If (mA) 0.6 + 0.1 = 0.7 4 x 700 22.0 LZP-00UB00 (1.3 – 11/13/2018) 13 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin LZP-Dxxxxx 5-channel, Standard Star MCPCB (4x6+1) Mechanical Dimensions (mm) Notes: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. Slots in MCPCB are for M3 or #4 mounting screws. 3. LED Engin recommends using plastic washers to electrically insulate screws from solder pads and electrical traces. 4. LED Engin recommends using thermal interface material when attaching the MCPCB to a heat sink. 5. LED Engin uses a copper core MCPCB with pedestal design, allowing direct solder connect between the MCPCB copper core and the emitter thermal slug. The thermal resistance of this copper core MCPCB is: RΘC-B 0.1°C/W Components used MCPCB: ESD chips: SuperMCPCB BZT52C36LP (Bridge Semiconductor, copper core with pedestal design) (NXP, for 6 LED dies in series) Pad layout Ch. 1 2 3 4 5 MCPCB Pad 1 10 2 9 3 8 4 7 5 6 String/die 1/EDCBAF 2/JIHGLK 3/ONSRQP 4/TYXWVU 5/M Function Cathode Anode + Cathode Anode + Cathode Anode + Cathode Anode + N/A N/A COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZP-00UB00 (1.3 – 11/13/2018) 14 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Application Guidelines MCPCB Assembly Recommendations A good thermal design requires an efficient heat transfer from the MCPCB to the heat sink. In order to minimize air gaps in between the MCPCB and the heat sink, it is common practice to use thermal interface materials such as thermal pastes, thermal pads, phase change materials and thermal epoxies. Each material has its pros and cons depending on the design. Thermal interface materials are most efficient when the mating surfaces of the MCPCB and the heat sink are flat and smooth. Rough and uneven surfaces may cause gaps with higher thermal resistances, increasing the overall thermal resistance of this interface. It is critical that the thermal resistance of the interface is low, allowing for an efficient heat transfer to the heat sink and keeping MCPCB temperatures low. When optimizing the thermal performance, attention must also be paid to the amount of stress that is applied on the MCPCB. Too much stress can cause the ceramic emitter to crack. To relax some of the stress, it is advisable to use plastic washers between the screw head and the MCPCB and to follow the torque range listed below. For applications where the heat sink temperature can be above 50oC, it is recommended to use high temperature and rigid plastic washers, such as polycarbonate or glass-filled nylon. LED Engin recommends the use of the following thermal interface materials: 1. Bergquist’s Gap Pad 5000S35, 0.020in thick  Part Number: Gap Pad® 5000S35 0.020in/0.508mm  Thickness: 0.020in/0.508mm  Thermal conductivity: 5 W/m-K  Continuous use max temperature: 200°C  Using M3 Screw (or #4 screw), with polycarbonate or glass-filled nylon washer (#4) the recommended torque range is: 20 to 25 oz-in (1.25 to 1.56 lbf-in or 0.14 to 0.18 N-m) 2. 3M’s Acrylic Interface Pad 5590H  Part number: 5590H @ 0.5mm  Thickness: 0.020in/0.508mm  Thermal conductivity: 3 W/m-K  Continuous use max temperature: 100°C  Using M3 Screw (or #4 screw), with polycarbonate or glass-filled nylon washer (#4) the recommended torque range is: 20 to 25 oz-in (1.25 to 1.56 lbf-in or 0.14 to 0.18 N-m) Mechanical Mounting Considerations The mounting of MCPCB assembly is a critical process step. Excessive mechanical stress build up in the MCPCB can cause the MCPCB to warp which can lead to emitter substrate cracking and subsequent cracking of the LED dies LED Engin recommends the following steps to avoid mechanical stress build up in the MCPCB: o Inspect MCPCB and heat sink for flatness and smoothness. o Select appropriate torque for mounting screws. Screw torque depends on the MCPCB mounting method (thermal interface materials, screws, and washer). o Always use three M3 or #4-40 screws with #4 washers. o When fastening the three screws, it is recommended to tighten the screws in multiple small steps. This method avoids building stress by tilting the MCPCB when one screw is tightened in a single step. o Always use plastic washers in combinations with the three screws. This avoids high point contact stress on the screw head to MCPCB interface, in case the screw is not seated perpendicular. o In designs with non-tapped holes using self-tapping screws, it is common practice to follow a method of three turns tapping a hole clockwise, followed by half a turn anti-clockwise, until the appropriate torque is reached. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZP-00UB00 (1.3 – 11/13/2018) 15 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Wire Soldering   To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC. Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is recommended to use a solder iron of more than 60W. It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn: 24-7068-7601) COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZP-00UB00 (1.3 – 11/13/2018) 16 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin About LED Engin LED Engin, an OSRAM business based in California’s Silicon Valley, develops, manufactures, and sells advanced LED emitters, optics and light engines to create uncompromised lighting experiences for a wide range of entertainment, architectural, general lighting and specialty applications. LuxiGenTM multi-die emitter and secondary lens combinations reliably deliver industry-leading flux density, upwards of 5000 quality lumens to a target, in a wide spectrum of colors including whites, tunable whites, multi-color and UV LEDs in a unique patented compact ceramic package. Our LuxiTuneTM series of tunable white lighting modules leverage our LuxiGen emitters and lenses to deliver quality, control, freedom and high density tunable white light solutions for a broad range of new recessed and downlighting applications. The small size, yet remarkably powerful beam output and superior insource color mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional light is required. LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions; and reserves the right to make changes to improve performance without notice. For more information, please contact LEDE-Sales@osram.com or +1 408 922-7200. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZP-00UB00 (1.3 – 11/13/2018) 17 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin