LZP-D0UA00-0000

High Radiant Flux Density 400nm Violet LED Emitter LZP-00UA00 Key Features  Ultra-bright, compact 24-die, 400nm Violet LED  Very high Radiant Flux density  Small high density foot print, 12.0mm x 12.0mm package  Surface mount ceramic package with integrated glass lens  Exceptionally low Thermal Resistance (0.6°C/W)  Electrically neutral thermal slug  Autoclave complaint (JEDEC JESD22-A102-C)  JEDEC Level 1 for Moisture Sensitivity Level  Lead (Pb) free and RoHS compliant  Reflow solderable (up to 6 cycles)  Copper core MCPCB option with emitter thermal slug directly soldered to the copper core Typical Applications  Curing  Sterilization  Medical  Currency Verification  Fluorescence Microscopy  Inspection of dyes, rodent and animal contamination,  Leak detection  Forensics Description The LZP-series emitter is rated for 90W power handling in an ultra compact package. With a small 12.0mm x 12.0mm footprint, this package provides exceptional radiant flux density. The patented design has unparalleled thermal and optical performance. The high quality materials used in the package are chosen to optimize Radiant Flux and minimize stresses which results in monumental reliability and radiant flux maintenance. The robust product design thrives in outdoor applications with high ambient temperatures and high humidity. UV RADIATION COPYRIGHT © 2016 LED ENGIN. ALL RIGHTS RESERVED. Avoid exposure to the beam Wear protective eyewear LZP-00UA00 (6.3 - 7/24/17) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Part number options Base part number Part number Description LZP-00UA00-xxxx LZP emitter LZP-D0UA00-xxxx LZP emitter on 5 channel 4x6+1 Star MCPCB Bin kit option codes Single wavelength bin (5nm range) Kit number suffix Min flux Bin Color Bin Range Description 00U4 Z U4 Z minimum flux; wavelength U4 bin only 00U5 Z U5 Z minimum flux; wavelength U5 bin only 00U6 Z U6 Z minimum flux; wavelength U6 bin only 00U7 Z U7 Z minimum flux; wavelength U7 bin only 00U8 Z U8 Z minimum flux; wavelength U8 bin only COPYRIGHT © 2016 LED ENGIN. ALL RIGHTS RESERVED. LZP-00UA00 (6.3 - 7/24/17) 2 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Radiant Flux Bins Table 1: Bin Code Minimum Radiant Flux (Φ) @ IF = 700mA [1,2] (W) Maximum Radiant Flux (Φ) @ IF = 700mA [1,2] (W) Z 15.0 20.0 C2 20.0 25.0 Notes for Table 1: 1. Radiant flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ± 10% on flux measurements. 2. Future products will have even higher levels of radiant flux performance. Contact LED Engin Sales for updated information. Peak Wavelength Bins Table 2: Bin Code Minimum Peak Wavelength (λP) @ IF = 700mA [1] (nm) Maximum Peak Wavelength (λP) @ IF = 700mA [1] (nm) U4 385 390 U5 390 395 U6 395 400 U7 400 405 U8 405 410 Notes for Table 2: 1. LED Engin maintains a tolerance of ± 2.0nm on peak wavelength measurements. Forward Voltage Bins Table 3: Bin Code Minimum Forward Voltage (VF/Ch) @ IF = 700mA [1,2] (V) Maximum Forward Voltage (VF/Ch) @ IF = 700mA [1,2] (V) 0 20.64 23.52 Notes for Table 3: 1. LED Engin maintains a tolerance of ± 0.24V for forward voltage measurements. 2. Forward Voltage is binned with 6 LED dies connected in series. The LED is configured with 4 Channels of 6 dies in series each. COPYRIGHT © 2016 LED ENGIN. ALL RIGHTS RESERVED. LZP-00UA00 (6.3 - 7/24/17) 3 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Absolute Maximum Ratings Table 4: Parameter Symbol Value Unit IF IFP VR Tstg TJ Tsol 1000 /Channel 1000 /Channel See Note 3 -40 ~ +150 125 260 6 > 2,000 V HBM Class 2B JESD22-A114-D mA mA V °C °C °C [1] DC Forward Current Peak Pulsed Forward Current [2] Reverse Voltage Storage Temperature Junction Temperature Soldering Temperature [4] Allowable Reflow Cycles ESD Sensitivity [5] Notes for Table 4: 1. Maximum DC forward current (per die) is determined by the overall thermal resistance and ambient temperature. Follow the curves in Figure 10 for current derating. 2. Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%. 3. LEDs are not designed to be reverse biased. 4. Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 3. 5. LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZP-00UA00 in an electrostatic protected area (EPA). An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1. Optical Characteristics @ TC = 25°C Table 5: Typical Parameter Symbol Radiant Flux (@ IF = 700mA) Radiant Flux (@ IF = 1000mA) Peak Wavelength Viewing Angle [1] [2] Total Included Angle [3] Unit 385-390nm 390-400nm 400-410nm Φ 16.20 19.30 21.50 W Φ 22.60 27.00 30.1 W λP 385 395 405 nm 2Θ1/2 115 Degrees Θ0.9V 135 Degrees Notes for Table 5: 1. When operating the VIOLET LED, observe IEC 60825-1 class 3B rating. Avoid exposure to the beam. 2. Viewing Angle is the off axis angle from emitter centerline where the Radiant intensity is ½ of the peak value. 3. Total Included Angle is the total angle that includes 90% of the total Radiant flux. Electrical Characteristics @ TC = 25°C Table 6: Parameter Symbol Typical Unit Forward Voltage (@ IF = 700mA) [1] Temperature Coefficient of Forward Voltage [1] VF 22.0 /Channel V ΔVF/ΔTJ -14.2 mV/°C RΘJ-C 0.6 °C/W Thermal Resistance (Junction to Case) Notes for Table 6: 1. Forward Voltage is measured for a single string of 6 dies connected in series. The LED is configured with 4 Channels of 6 dies in series each. COPYRIGHT © 2016 LED ENGIN. ALL RIGHTS RESERVED. LZP-00UA00 (6.3 - 7/24/17) 4 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com IPC/JEDEC Moisture Sensitivity Level Table 7 - IPC/JEDEC J-STD-20D.1 MSL Classification: Soak Requirements Floor Life Standard Accelerated Level Time Conditions Time (hrs) Conditions Time (hrs) Conditions 1 Unlimited ≤ 30°C/ 85% RH 168 +5/-0 85°C/ 85% RH n/a n/a Notes for Table 7: 1. The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and includes the maximum time allowed out of the bag at the distributor’s facility. Average Radiant Flux Maintenance Projections Lumen maintenance generally describes the ability of an emitter to retain its output over time. The useful lifetime for power LEDs is also defined as Radiant Flux Maintenance, with the percentage of the original light output remaining at a defined time period. Based on long-term WHTOL testing, LED Engin projects that the LZ Series will deliver, on average, 70% Radiant Flux Maintenance (RP70%) at 20,000 hours of operation at a forward current of 700 mA per die. This projection is based on constant current operation with junction temperature maintained at or below 80°C. COPYRIGHT © 2016 LED ENGIN. ALL RIGHTS RESERVED. LZP-00UA00 (6.3 - 7/24/17) 5 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Mechanical Dimensions (mm) Pin Out Ch. Pad Die Color Function 18 E UA Anode D UA C UA na na na 1 B UA A UA na 24 F UA Cathode 17 J UA I UA Anode na H UA na G UA na L UA na 3 K UA Cathode 15 O UA N UA Anode na S UA na na 2 3 Figure 1: Package outline drawing. Notes for Figure 1: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. Thermal slug is electrically isolated 3. Ts is a thermal reference point R UA Q UA na 5 P UA Cathode 14 T UA Y UA Anode na X UA na W UA na V UA na 8 U UA 2 M - Cathode na 23 M - na 4 Recommended Solder Pad Layout (mm) 5 +18 -24 -3 +17 +15 -5 -8 +14 +2 -23 Figure 2: Recommended solder mask opening (hatched area) for anode, cathode, and thermal pad. Notes: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. LED Engin recommends the use of copper core MCPCB’s which allow for the emitter thermal slug to be soldered directly to the copper core (so called pedestal design). Such MCPCB technologies eliminate the high thermal resistance dielectric layer that standard MCPCB technologies use in between the emitter thermal slug and the metal core of the MCPCB, thus lowering the overall system thermal resistance. 3. LED Engin recommends x-ray sample monitoring for solder voids underneath the emitter thermal slug. The total area covered by solder voids should be less than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to higher failure rates due to thermal over stress. COPYRIGHT © 2016 LED ENGIN. ALL RIGHTS RESERVED. LZP-00UA00 (6.3 - 7/24/17) 6 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Reflow Soldering Profile Figure 3: Reflow soldering profile for lead free soldering. Typical Radiation Pattern 100 Relative Intensity (%) 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Angular Displacement (Degrees) Figure 4: Typical representative spatial radiation pattern. COPYRIGHT © 2016 LED ENGIN. ALL RIGHTS RESERVED. LZP-00UA00 (6.3 - 7/24/17) 7 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Typical Relative Spectral Power Distribution 1 Relative Spectral Power 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 300 350 400 450 500 Wavelength (nm) Figure 5: Relative spectral power vs. wavelength @ TC = 25°C. Typical Relative Peak Wavelength Shift over Temperature Peak Wavelength Shift (nm) 5.0 4.0 3.0 2.0 1.0 0.0 0 20 40 60 80 100 120 Case Temperature (ºC) Figure 6: Typical Peak wavelength shift vs. case temperature. COPYRIGHT © 2016 LED ENGIN. ALL RIGHTS RESERVED. LZP-00UA00 (6.3 - 7/24/17) 8 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Typical Relative Radiant Flux 1.4 Normalized Radiant Flux 1.2 1 0.8 0.6 0.4 0.2 0 0 200 400 600 800 1000 IF - Forward Current (mA) Figure 7: Typical relative Radiant Flux vs. forward current @ TC = 25°C. Typical Normalized Radiant Flux over Temperature 1.20 Normalized Radiant Flux 1.00 0.80 0.60 0.40 0.20 0.00 0 20 40 60 Case 80 100 120 Temperature (oC) Figure 8: Typical normalized radiant flux vs. case temperature @700mA COPYRIGHT © 2016 LED ENGIN. ALL RIGHTS RESERVED. LZP-00UA00 (6.3 - 7/24/17) 9 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Typical Forward Current Characteristics 1200 If-Forward Current (mA) 1000 800 600 400 200 0 19 20 21 22 23 Vf-Forward Voltage (V) Figure 9: Typical forward current vs. forward voltage @ T C = 25°C. Notes: 1. Forward Voltage curve is pro channel of 6 LED dies connected in series. The LED is configured with 4 Channels of 6 dies in series each. Current De-rating IF - Maximum Current (mA) 1200 1000 800 700 (Rated) 600 400 R=Θ C/W RΘJ-A = 1.0˚ 2.0°C/W J-A= R=Θ C/W RΘJ-A = 1.5˚ 3.0°C/W J-A= R=Θ C/W RΘJ-A = 2.0˚ 4.0°C/W J-A= 200 0 0 25 50 75 100 125 150 Maximum Ambient Temperature (°C) Figure 10: Maximum forward current vs. ambient temperature based on T J(MAX) = 150°C. Notes: 1. Maximum current assumes that all LED dies are operating at rated current. 2. RΘJ-C [Junction to Case Thermal Resistance] for the LZP-series is typically 0.6°C/W. 3. RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance]. COPYRIGHT © 2016 LED ENGIN. ALL RIGHTS RESERVED. LZP-00UA00 (6.3 - 7/24/17) 10 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com LZP MCPCB Family Part number Type of MCPCB Diameter (mm) LZP-Dxxxxx 5-channel (4x6+1 strings) 28.3 Emitter + MCPCB Typical Vf Thermal Resistance (V) (°C /W) Typical If (mA) 0.6 + 0.1 = 0.7 4 x 700 22.0 Mechanical Mounting of MCPCB   MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to substrate cracking and subsequently LED dies cracking. To avoid MCPCB bending: o Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws. o Care must be taken when securing the board to the heat sink. This can be done by tightening three M3 screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will increase the likelihood of board bending. o It is recommended to always use plastics washers in combinations with the three screws. o If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after tightening (with controlled torque) and then re-tighten the screws again. Thermal interface material    To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when mounting the MCPCB on to the heat sink. There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal epoxies. An example of such material is Electrolube EHTC. It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating conditions. Wire soldering   o To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150 C. Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is recommended to use a solder iron of more than 60W. It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn: 24-7068-7601) COPYRIGHT © 2016 LED ENGIN. ALL RIGHTS RESERVED. LZP-00UA00 (6.3 - 7/24/17) 11 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com LZP-Dxxxxx 5-channel, Standard Star MCPCB (4x6+1) Mechanical Dimensions (mm) Notes: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. Slots in MCPCB are for M3 or #4 mounting screws. 3. LED Engin recommends using plastic washers to electrically insulate screws from solder pads and electrical traces. 4. LED Engin recommends using thermal interface material when attaching the MCPCB to a heat sink. 5. LED Engin uses a copper core MCPCB with pedestal design, allowing direct solder connect between the MCPCB copper core and the emitter thermal slug. The thermal resistance of this copper core MCPCB is: RΘC-B 0.1°C/W Components used MCPCB: ESD chips: SuperMCPCB BZT52C36LP (Bridge Semiconductor, copper core with pedestal design) (NXP, for 6 LED dies in series) Pad layout Ch. 1 2 3 4 5 MCPCB Pad 1 10 2 9 3 8 4 7 5 6 String/die 1/EDCBAF 2/JIHGLK 3/ONSRQP 4/TYXWVU 5/M Function Cathode Anode + Cathode Anode + Cathode Anode + Cathode Anode + N/A N/A COPYRIGHT © 2016 LED ENGIN. ALL RIGHTS RESERVED. LZP-00UA00 (6.3 - 7/24/17) 12 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com