SFH4273-Z

Rote Lumineszenzdiode Red Emitter Lead (Pb) Free Product - RoHS Compliant SFH 4273 Wesentliche Merkmale Features • Schwarz eingefärbtes TOPLED-Gehäuse • Typische Emissionswellenlänge 660nm • Verbesserte Abbildungseigenschaften durch Absorption der Seitenstrahlung • Größe der Leuchtquelle 325 µm x 325 µmt • Feuchte-Empfindlichkeitsstufe 2 nach JEDEC Standard J-STD-020C • Black colored TOPLED-package • Typical peak wavelength 660nm • Improved imaging characteristics due to absorption of side emission • Size of emitting area 325µm x 325µm • Moisture sensitivity level 2 according to JEDEC Standard J-STD-020C Anwendungen Applications • Miniaturlichtschranken und Lichtschranken über große Entfernungen • Industrieelektronik • „Messen/Steuern/Regeln“ • Sensorik • Alarm- und Sicherungssysteme • • • • • Miniature and long distance photointerrupters Industrial electronics For drive and control circuits Sensor technology Alarm and safety equipment Typ Type Bestellnummer Ordering Code Strahlstärkegruppierung1) (IF = 50 mA, tp = 20 ms) Radiant Intensity Grouping1) Ie (mW/sr) SFH 4273 Q65110A2523 > 0.63 (typ. 1.0) 1) gemessen bei einem Raumwinkel Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr Achtung: Es wird empfohlen, das Bauteil nicht bei extremer Luftfeuchtigkeit zu betreiben. Ist dies dennoch vorgesehen, setzen Sie sich bitte mit OSRAM OS in Verbindung Attention: It is recommended not to operate the device under extreme humdity. If this is designated though, please contact OSRAM OS. 2007-06-18 1 SFH 4273 Grenzwerte (TA = 25 °C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg – 40 … + 100 °C Sperrspannung Reverse voltage VR 3 V Durchlassstrom Forward current IF 50 mA Stoßstrom, τ = 10 µs, D = 0 Surge current IFSM 1 A Verlustleistung Power dissipation Ptot 125 mW 450 K/W ≈ 200 K/W Wärmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgröße je 16 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm2 each Wärmewiderstand Sperrschicht - Lötstelle bei RthJS Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block 2007-06-18 2 SFH 4273 Kennwerte (TA = 25 °C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlänge der Strahlung Wavelength at peak emission IF = 50 mA, tp = 20 ms λpeak 660 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 50 mA ∆λ 25 nm Abstrahlwinkel Half angle ϕ ± 60 Grad deg. Aktive Chipfläche Active chip area A 0.106 mm2 Abmessungen der aktiven Chipfläche Dimensions of the active chip area L×B L×W 0.325 × 0.325 mm² Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 50 mA, RL = 50 Ω Switching times, Ιe from 10% to 90% and from 90% to 10%, IF = 50 mA, RL = 50 Ω tr , tf 100 ns Kapazität Capacitance VR = 0 V, f = 1 MHz Co 30 pF Durchlassspannung Forward voltage IF = 50 mA, tp = 20 ms VF 2.1 (≤ 2.8) V Sperrstrom, Reverse curr50mA50 mAent VR = 5 V IR 0.01 (≤ 1) µA Gesamtstrahlungsfluss Total radiant flux IF = 50 mA, tp = 20 ms Φe 5 mW Temperaturkoeffizient von Ie bzw. Φe, IF = 50 mA Temperature coefficient of Ie or Φe, IF = 50 mA TCI – 0.4 %/K Temperaturkoeffizient von VF, IF = 50 mA Temperature coefficient of VF, IF = 50 mA TCV –3 mV/K Temperaturkoeffizient von λ, IF = 50 mA Temperature coefficient of λ, IF = 50 mA TCλ + 0.16 nm/K 2007-06-18 3 SFH 4273 Strahlstärke Ie in Achsrichtung gemessen bei einem Raumwinkel Ω = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of Ω = 0.01 sr Bezeichnung Parameter Symbol Werte Values Einheit Unit Strahlstärke Radiant intensity IF = 50 mA, tp = 20 ms Ie > 0.63 (typ. 1.0) mW/sr 2007-06-18 4 SFH 4273 Relative Spectral Emission Irel = f (λ) Radiant Intensity Single pulse, tp = 20 µs OHR01869 100 Max. Permissible Forward Current IF = f (TA) Ie/Ie(50mA) = f (IF) 10 2 Ι rel % OHR01870 Ι F mA Ιe Ι e 50 mA 80 OHR01461 120 100 10 1 80 60 10 0 60 40 40 10 -1 20 20 0 600 650 700 nm λ 10 -2 750 10 0 Forward Current IF = f (VF) single pulse, tp = 20 µs 10 2 10 3 mA ΙF Permissible Pulse Handling Capability IF = f (tp), TA = 25 °C duty cycle D = parameter OHR01871 10 3 mA ΙF 10 1 ΙF OHR01872 10 4 mA tP D= ΙF T D= 0.005 0.01 0.02 0.05 10 3 10 2 tP T 0.1 0.2 10 2 0.5 10 1 DC 10 0 0 1 2 3 4 5 10 1 10 -5 10 -4 10 -3 10 -2 10 -1 6 V 7 VF 10 1 s tP Radiation Characteristics Irel = f (ϕ) 40˚ 30˚ 20˚ 10˚ 0˚ ϕ 50˚ OHL01660 1.0 0.8 0.6 60˚ 0.4 70˚ 0.2 80˚ 0 90˚ 100˚ 1.0 2007-06-18 0.8 0.6 0.4 0˚ 20˚ 40˚ 60˚ 80˚ 5 100˚ 120˚ 0 0 20 40 60 80 ˚C 100 TA SFH 4273 Maßzeichnung Package Outlines 2.1 (0.083) 3.0 (0.118) 2.6 (0.102) 2.3 (0.091) 1.7 (0.067) 0.1 (0.004) (typ.) 0.9 (0.035) 0.7 (0.028) 3.7 (0.146) 3.3 (0.130) 4˚±1 3.4 (0.134) 3.0 (0.118) (2.4) (0.095) 2.1 (0.083) A 0.5 (0.020) Cathode marking 1.1 (0.043) C 0.18 (0.007) 0.12 (0.005) 0.6 (0.024) 0.4 (0.016) GPLY6724 Maße in mm (inch) / Dimensions in mm (inch). Gehäuse / Package TOPLED®, klarer Verguss / TOPLED®, clear resin Anschlussbelegung Pin configuration abgeschrägte Ecke: Kathode beveled edge: Cathode Farbe Color schwarz black Brechungsindex Verguss Refractive index resin 1.53 1.53 2007-06-18 6 SFH 4273 Empfohlenes Lötpaddesign Recommended Solder Pad Reflow Löten Reflow Soldering 4.5 (0.177) 2.6 (0.102) 1.5 (0.059) 1.5 (0.059) 4.5 (0.177) 2.6 (0.102) Padgeometrie für verbesserte Wärmeableitung Lötstopplack Solder resist Paddesign for improved heat dissipation Cu-Fläche > 16 mm 2 Cu-area > 16 mm 2 OHLPY970 Maße in mm (inch) / Dimensions in mm (inch) 2007-06-18 7 SFH 4273 Lötbedingungen Soldering Conditions Reflow Lötprofil für bleifreies Löten Reflow Soldering Profile for lead free soldering Vorbehandlung nach JEDEC Level 2 Preconditioning acc. to JEDEC Level 2 (nach J-STD-020C) (acc. to J-STD-020C) OHLA0687 300 Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile ˚C 255 ˚C 240 ˚C T 250 ˚C 260 ˚C +0 -5 ˚C 245 ˚C ±5 ˚C ˚C 235 ˚C +5 -0 ˚C 217 ˚C 10 s min 200 30 s max Ramp Down 6 K/s (max) 150 100 s max 120 s max 100 Ramp Up 3 K/s (max) 50 25 ˚C 0 0 50 100 150 200 250 s 300 t Wellenlöten (TTW) TTW Soldering (nach CECC 00802) (acc. to CECC 00802) OHLY0598 300 C T 10 s 250 Normalkurve standard curve 235 C ... 260 C Grenzkurven limit curves 2. Welle 2. wave 200 1. Welle 1. wave 150 ca 200 K/s 2 K/s 5 K/s 100 C ... 130 C 100 2 K/s 50 Zwangskühlung forced cooling 0 0 50 100 150 200 t 2007-06-18 8 s 250 SFH 4273 Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com © All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2007-06-18 9