SFH4246-Z

IR-Lumineszenzdiode (940 nm) mit hoher Ausgangsleistung High Power Infrared Emitter (940 nm) Lead (Pb) Free Product - RoHS Compliant SFH 4246 Wesentliche Merkmale Features • Infrarot LED mit hoher Ausgangsleistung • Kurze Schaltzeiten • High Power Infrared LED • Short switching times Anwendungen Applications • IR-Datenübertragung • Analoge und digitale Hi-Fi Audio- und Videosignalübertragung • Anwendungen mit hohen Zuverlässigkeitsansprüchen bzw. erhöhten Anforderungen • Alarm- und Sicherungssysteme • IR Data Transmission • Analog and digital Hi-Fi audio and video signal transmission • Suitable for professional and high-reliability applications Sicherheitshinweise Safety Advices Je nach Betriebsart emittieren diese Bauteile hochkonzentrierte, nicht sichtbare InfrarotStrahlung, die gefährlich für das menschliche Auge sein kann. Produkte, die diese Bauteile enthalten, müssen gemäß den Sicherheitsrichtlinien der IEC-Normen 60825-1 und 62471 behandelt werden. Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471. • Alarm and safety equipment Typ Type Bestellnummer Ordering Code Strahlstärkegruppierung1) (IF = 70 mA, tp = 20 ms) Radiant Intensity Grouping1) Ie (mW/sr) SFH 4246 Q65110A8100 ≥ 10 (typ. 30) 1) gemessen bei einem Raumwinkel Ω = 0.01 / measured at a solid angle of Ω = 0.01 sr 2012-03-06 1 SFH 4246 Grenzwerte (TA = 25 °C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top , Tstg – 40 … + 100 °C Sperrspannung Reverse voltage VR 5 V Vorwärtsgleichstrom Forward current IF 70 mA Stoßstrom, tp = 100 μs, D = 0 Surge current IFSM 700 mA Verlustleistung Power dissipation Ptot 140 mW 500 K/W 280 K/W Wärmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgröße je 16 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm2 each Wärmewiderstand Sperrschicht - Lötstelle bei RthJS Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block Kennwerte (TA = 25 °C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlänge der Strahlung Wavelength at peak emission IF = 70 mA λpeak 950 nm Centroid-Wellenlänge der Strahlung Centroid wavelength IF = 70 mA λcentroid 940 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 70 mA Δλ 42 nm Abstrahlwinkel Half angle ϕ ± 30 Grad deg. Aktive Chipfläche Active chip area A 0.04 mm2 2012-03-06 2 SFH 4246 Kennwerte (TA = 25 °C) Characteristics (cont’d) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Abmessungen der aktiven Chipfläche Dimension of the active chip area L×B L×W 0.2 × 0.2 mm² Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 70 mA, RL = 50 Ω Switching times, Ιe from 10% to 90% and from 90% to 10%, IF = 70 mA, RL = 50 Ω tr , tf 11 ns VF VF 1.6 (< 2.0) 2.4 (< 3.0) V V Sperrstrom Reverse current IR not designed for μA reverse operation Gesamtstrahlungsfluss Total radiant flux IF = 70 mA, tp = 20 ms Φe typ 35 mW Temperaturkoeffizient von Ie bzw. Φe, IF = 70 mA TCI Temperature coefficient of Ie or Φe, IF = 70 mA – 0.5 %/K Temperaturkoeffizient von VF, IF = 70 mA Temperature coefficient of VF, IF = 70 mA TCV – 3.5 mV/K Temperaturkoeffizient von λ, IF = 70 mA Temperature coefficient of λ, IF = 70 mA TCλ + 0.3 nm/K Durchlassspannung Forward voltage IF = 70 mA, tp = 20 ms IF = 500 mA, tp = 100 µs 2012-03-06 3 SFH 4246 Strahlstärke Ie in Achsrichtung1) gemessen bei einem Raumwinkel Ω = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of Ω = 0.01 sr Bezeichnung Parameter Symbol Werte Values SFH 4246-R SFH 4246-S Einheit Unit SFH 4246-T Strahlstärke Radiant intensity IF = 70 mA, tp = 20 ms Ie min Ie max 10 20 16 32 25 50 mW/sr mW/sr Strahlstärke Radiant intensity IF = 500 mA, tp = 25 µs Ie typ 75 120 185 mW/sr 1) Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) / Only one bin in one packing unit (variation lower 2:1) Abstrahlcharakteristik Radiation Characteristics Irel = f (ϕ) 40˚ 30˚ 20˚ 10˚ ϕ 0˚ OHL00732 1.0 50˚ 0.8 60˚ 0.6 70˚ 0.4 80˚ 0.2 0 90˚ 100˚ 1.0 2012-03-06 0.8 0.6 0.4 0˚ 20˚ 40˚ 60˚ 4 80˚ 100˚ 120˚ SFH 4246 Relative Spectral Emission Irel = f (λ) Radiant Intensity Single pulse, tp = 25 μs OHF04134 100 Max. Permissible Forward Current IF = f (TA), RthJA = 500 K/W OHF03827 101 Ie % I rel Ie = f (IF) Ie 70 mA IF I e (70 mA) OHF03732 80 mA 70 80 60 10 60 0 50 5 40 40 30 10-1 20 5 20 10 0 800 850 900 950 10-2 0 10 nm 1025 5 10 1 5 10 2 IF IF t D = TP tP IF T 10-1 0.5 0.005 0.01 0.02 0.05 0.1 0.2 0.3 0.5 1 -2 5 0.3 10-3 0.2 0.5 1 1.5 2 2.5 V 3 VF 2012-03-06 0.6 0.3 0.2 0.1 0.1 0 IF 0.7 A 0.4 5 10-4 60 80 100 ˚C 120 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp 5 OHF03824 t tP D = TP IF T 0.5 D= 0.4 10 40 Permissible Pulse Handling Capability IF = f (τ), TA = 85 °C, duty cycle D = parameter OHF03733 0.7 A 0.6 5 20 TA Permissible Pulse Handling Capability IF = f (τ), TA = 25 °C, duty cycle D = parameter OHF03828 100 A 0 IF λ Forward Current IF = f (VF) Single pulse, tp = 100 μs 0 mA 10 3 D= 0.005 0.01 0.02 0.05 0.1 0.2 0.3 0.5 1 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp SFH 4246 Maßzeichnung Package Outlines 3.5 (0.138) max. 2.1 (0.083) 1.7 (0.067) 3.0 (0.118) 2.6 (0.102) 2.3 (0.091) 0.9 (0.035) ø2.60 (0.102) 0.5 (0.020) Package marking 1.1 (0.043) 3.7 (0.146) 3.3 (0.130) 3.4 (0.134) 3.0 (0.118) 2 ø2.55 (0.100) 0.7 (0.028) 2.1 (0.083) 1 0.6 (0.024) 0.4 (0.016) 0.1 (0.004) (typ.) 0.18 (0.007) 0.13 (0.005) GEOY6956 Maße in mm (inch) / Dimensions in mm (inch). Gehäuse / Package TOPLED® mit Linse (P-LCC-2) / TOPLED® with lens (P-LCC-2) Anschlussbelegung pin configuration 1 = Anode / anode 2 = Kathode / cathode Farbe Color weiß white 2012-03-06 6 SFH 4246 Empfohlenes Lötpaddesign Recommended Solder Pad Reflow Löten Reflow Soldering 4.5 (0.177) 2.6 (0.102) 1.5 (0.059) 1.5 (0.059) 4.5 (0.177) 2.6 (0.102) Padgeometrie für verbesserte Wärmeableitung Lötstopplack Solder resist Paddesign for improved heat dissipation Cu-Fläche > 16 mm 2 Cu-area > 16 mm 2 OHLPY970 2012-03-06 7 SFH 4246 Lötbedingungen Soldering Conditions Reflow Lötprofil für bleifreies Löten Reflow Soldering Profile for lead free soldering Vorbehandlung nach JEDEC Level 2 Preconditioning acc. to JEDEC Level 2 (nach J-STD-020D.01) (acc. to J-STD-020D.01) OHA04525 300 ˚C T 250 Tp 245 ˚C 240 ˚C tP 217 ˚C 200 tL 150 tS 100 50 25 ˚C 0 0 50 100 150 200 s 300 250 t Profileigenschaften Profile Feature Bleifreier Aufbau / Pb-Free Assembly (SnAgCu) ) Aufheizrate zum Vorwärmen* / Ramp-up rate to preheat*) Zeit ts von TSmin bis TSmax / Time ts from TSmin to TSmax Aufheizrate zur Spitzentemperatur*) / Ramp-up rate to peak*) Empfehlung / Recommendation Grenzwerte / Max. Ratings 2K/s 3K/s 100 s min. 60 s max. 120 s 2K/s 3K/s 25 °C to 150 °C 150 °C to 200 °C 180 °C to TP Liquidustemperatur TL / Liquidus temperature TL 217 °C Zeit tL über TL / Time tL above TL 80 s max. 100 s Spitzentemperatur TP / Peak temperature TP 245 °C max. 250 °C Verweilzeit tP innerhalb des spezifizierten Spitzentemperaturbereichs TP - 5 K / Time tP within the specified peak temperature range TP - 5 K 20 s min. 10 s max. 30 s Abkühlrate*) / Ramp-down rate*) 3K/s 4 K / s maximum TP to 100 °C Zeitspanne von 25 °C bis zur Spitzentemperatur / Time from 25 °C to peak temperature max. 8 min. Alle Temperaturen beziehen sich auf die Bauteilmitte, jeweils auf der Bauteiloberseite gemessen / All temperatures refer to the center of the package, measured on the top of the package * Steigungsberechnung ΔT/Δt: Δt max. 5 s; erfüllt über den gesamten Temperaturbereich / slope calculation ΔT/Δt: Δt max. 5 s; fulfillment for the whole T-range 2012-03-06 8 SFH 4246 Wellenlöten (TTW) TTW Soldering (nach CECC 00802) (acc. to CECC 00802) OHLY0598 300 C T 10 s 250 Normalkurve standard curve 235 C ... 260 C Grenzkurven limit curves 2. Welle 2. wave 200 1. Welle 1. wave 150 ca 200 K/s 2 K/s 5 K/s 100 C ... 130 C 100 2 K/s 50 Zwangskühlung forced cooling 0 0 50 100 150 200 s 250 t Published by OSRAM Opto Semiconductors GmbH Leibnizstrasse 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2012-03-06 9