LZC-C0U600-00U0

High Radiant Flux Density 365nm UV LED Emitter LZC-00U600 Key Features  Ultra-bright, compact 12-die, 365nm UV LED  Very high Radiant Flux density  Small high density foot print, 9.0mm x 9.0mm  Surface mount ceramic package with integrated glass lens  Exceptionally low Thermal Resistance (0.7°C/W)  Electrically neutral thermal slug  Autoclave complaint (JEDEC JESD22-A102-C)  JEDEC Level 1 for Moisture Sensitivity Level  Lead (Pb) free and RoHS compliant  Reflow solderable (up to 6 cycles)  Emitter available on MCPCB (optional) Typical Applications  Curing  Sterilization  Medical  Currency Verification  Fluorescence Microscopy  Inspection of dyes, rodent and animal contamination,  Leak detection  Forensics Description The LZC-series emitter is rated for 40W power handling in an ultra compact package. With a small 9.0mm x 9.0mm footprint, this package provides exceptional radiant flux density. The patented design has unparalleled thermal and optical performance. The high quality materials used in the package are chosen to optimize Radiant Flux and minimize stresses which results in monumental reliability and radiant flux maintenance. The robust product design thrives in outdoor applications with high ambient temperatures and high humidity. UV RADIATION COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. Avoid exposure to the beam Wear protective eyewear LZC-00U600 (5.5-11/18/13) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Part number options Base part number Part number Description LZC-00U600-xxxx LZC emitter LZC-70U600-xxxx LZC emitter on 1 channel 1x12 Star MCPCB LZC-C0U600-xxxx LZC emitter on 2 channel 2x6 Star MCPCB Bin kit option codes U6, Ultra-Violet (365nm) Kit number suffix Min flux Bin Color Bin Range 0000 R U0 - U1 00U0 R U0 - U0 00U1 R U1 - U1 Description full distribution flux; full distribution wavelength full distribution flux; wavelength U0 bin only full distribution flux; wavelength U1bin only Notes: 1. Default bin kit option is -0000 COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZC-00U600 (5.5-11/18/13) 2 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Radiant Flux Bins Table 1: Bin Code Minimum Radiant Flux (Φ) @ IF = 700mA [1,2] (W) Maximum Radiant Flux (Φ) @ IF = 700mA [1,2] (W) R 2.40 3.00 S 3.00 3.80 T 3.80 4.80 U 4.80 6.00 V 6.00 7.50 Notes for Table 1: 1. Radiant flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ± 10% on flux measurements. 2. Future products will have even higher levels of radiant flux performance. Contact LED Engin Sales for updated information. Peak Wavelength Bins Table 2: Bin Code Minimum Peak Wavelength (λP) @ IF = 700mA [1] (nm) Maximum Peak Wavelength (λP) @ IF = 700mA [1] (nm) U0 365 370 U1 370 375 Notes for Table 2: 1. LED Engin maintains a tolerance of ± 2.0nm on peak wavelength measurements. Forward Voltage Bins Table 3: Bin Code Minimum Forward Voltage (VF) @ IF = 700mA [1,2] (V) Maximum Forward Voltage (VF) @ IF = 700mA [1,2] (V) 0 41.28 55.68 Notes for Table 3: 1. Forward Voltage is binned with all 12 LED dice connected in series. 2. LED Engin maintains a tolerance of ± 0.48V for forward voltage measurements (± 0.04V per die). COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZC-00U600 (5.5-11/18/13) 3 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Absolute Maximum Ratings Table 4: Parameter Symbol Value Unit IF IFP VR Tstg TJ Tsol 700 850 See Note 3 -40 ~ +150 100 180 6 > 2,000 V HBM Class 2B JESD22-A114-D mA mA V °C °C °C [1] DC Forward Current Peak Pulsed Forward Current [2] Reverse Voltage Storage Temperature Junction Temperature Soldering Temperature [4] Allowable Reflow Cycles ESD Sensitivity [5] Notes for Table 4: 1. Maximum DC forward current (per die) is determined by the overall thermal resistance and ambient temperature. Follow the curves in Figure 10 for current derating. 2. Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%. 3. LEDs are not designed to be reverse biased. 4. Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 3. 5. LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZC-00U600 in an electrostatic protected area (EPA). An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1. Optical Characteristics @ TC = 25°C Table 5: Parameter Symbol Typical Unit Radiant Flux (@ IF = 700mA) Peak Wavelength [1] Viewing Angle [2] Total Included Angle [3] ΦV λD 2Θ1/2 Θ0.9V 5.00 365 95 115 W nm Degrees Degrees Notes for Table 5: 1. When operating the UV LED, observe IEC 60825-1 class 3B rating. Avoid exposure to the beam. 2. Viewing Angle is the off axis angle from emitter centerline where the luminous intensity is ½ of the peak value. 3. Total Included Angle is the total angle that includes 90% of the total luminous flux. Electrical Characteristics @ TC = 25°C Table 6: Parameter Symbol Typical Unit Forward Voltage (@ IF = 700mA) [1] Temperature Coefficient of Forward Voltage [1] Thermal Resistance (Junction to Case) VF 49 V ΔVF/ΔTJ -14.8 mV/°C RΘJ-C 0.7 °C/W Notes for Table 6: 1. Typical values for Forward Voltage and Temperature Coefficient of Forward Voltage is shown for with all 12 LED dice connected in series. COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZC-00U600 (5.5-11/18/13) 4 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com IPC/JEDEC Moisture Sensitivity Level Table 7 - IPC/JEDEC J-STD-20D.1 MSL Classification: Soak Requirements Floor Life Standard Accelerated Level Time Conditions Time (hrs) Conditions Time (hrs) Conditions 1 Unlimited ≤ 30°C/ 85% RH 168 +5/-0 85°C/ 85% RH n/a n/a Notes for Table 7: 1. The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and includes the maximum time allowed out of the bag at the distributor’s facility. COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZC-00U600 (5.5-11/18/13) 5 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Mechanical Dimensions (mm) Pin Out Pad Series Function 2 1 Cathode 3 1 Cathode 5 2 Cathode 6 2 Cathode 14 2 Anode 15 2 Anode 17 1 Anode 18 1 Anode 17 2 18 3 14 5 15 6 Figure 1: Package outline drawing. Notes for Figure 1: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. Thermal contact, Pad is electrically neutral. Recommended Solder Pad Layout (mm) Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad. Note for Figure 2a: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZC-00U600 (5.5-11/18/13) 6 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Recommended Solder Mask Layout (mm) Figure 2b: Recommended solder mask opening (hatched area) for anode, cathode, and thermal pad. Note for Figure 2b: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. Reflow Soldering Profile 200 180 Peak Temp. 180 C 160 Temperature (°C) 140 120 100 < 2.5 C/sec. 80 Reflow Zone time above 150 C (90 sec. max.) 40 - 70 sec. typical Soaking Zone (2.0 min. max.) 60 - 90 sec. typical 60 40 Pre-heating Zone (2.0 - 4.0 min. max.) 20 0 0 30 60 90 120 150 180 210 240 270 300 Time (sec.) Figure 3: Reflow soldering profile for lead free soldering. Notes for Figure 3: 1. Solder profile for low temperature solder. LED Engin recommends 58Bi-42Sn (wt.%) Solder for our low temperature solder profile. COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZC-00U600 (5.5-11/18/13) 7 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Typical Radiation Pattern 100 90 Relative Intensity (%) 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Angular Displacement (Degrees) Figure 4: Typical representative spatial radiation pattern. Typical Relative Spectral Power Distribution 1 Relative Spectral Power 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 300 325 350 375 400 425 450 Wavelength (nm) Figure 5: Relative spectral power vs. wavelength @ TC = 25°C. COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZC-00U600 (5.5-11/18/13) 8 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Typical Relative Dominant Wavelength Shift over Temperature Peak Wavelength Shift (nm) 6.0 5.0 4.0 3.0 2.0 1.0 0.0 0 20 40 60 80 100 Case Temperature (ºC) Figure 6: Typical dominant wavelength shift vs. case temperature. Typical Relative Radiant Flux 1.20 Normalized Radiant Flux 1.00 0.80 0.60 0.40 0.20 0.00 0 200 400 600 800 1000 If-Forward Current (mA) Figure 7: Typical relative Radiant Flux vs. forward current @ TC = 25°C. COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZC-00U600 (5.5-11/18/13) 9 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Typical Relative Radiant Flux over Temperature 1.2 Normalized Radiant Flux 1 0.8 0.6 0.4 0.2 0 0 20 40 60 80 100 120 Case Temperature (ºC) Figure 8: Typical relative Radiant Flux vs. case temperature. Typical Forward Current Characteristics 900 If-Forward Current (mA) 800 700 600 500 400 300 200 100 0 41 43 45 47 49 51 Vf-Forward Voltage (V) Figure 9: Typical forward current vs. forward voltage @ T C = 25°C. Note for Figure 9: 1. Forward Voltage curve is assumes that all twelve LED dice are connected in series. COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZC-00U600 (5.5-11/18/13) 10 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Current De-rating 1200 Maximum Current (mA) 1000 800 700 (Rated) 600 400 RthJ-A = 1.4°C/W RthJ-A = 1.9°C/W RthJ-A = 2.2°C/W 200 0 0 25 50 75 100 125 150 Maximum Ambient Temperature (°C) Figure 10: Maximum forward current vs. ambient temperature based on T J(MAX) = 100°C. Notes for Figure 10: 1 Maximum current assumes that all four LED dice are operating concurrently at the same current. 2. RΘJ-C [Junction to Case Thermal Resistance] for the LZC-series is typically 0.7°C/W. 3. RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance]. COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZC-00U600 (5.5-11/18/13) 11 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Emitter Tape and Reel Specifications (mm) Figure 11: Emitter carrier tape specifications (mm). Figure 12: Emitter Reel specifications (mm). COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZC-00U600 (5.5-11/18/13) 12 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com LZC MCPCB Family Part number Type of MCPCB Emitter + MCPCB Diameter Thermal Resistance (mm) (oC/W) LZC-7xxxxx 1-channel 28.3 0.7 + 0.6 = 1.3 42.0 700 LZC-Cxxxxx 2-channel 28.3 0.7 + 0.6 = 1.3 21.0 2 x 700 Typical Vf (V) Typical If (mA) Mechanical Mounting of MCPCB   MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to substrate cracking and subsequently LED dies cracking. To avoid MCPCB bending: o Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws. o Care must be taken when securing the board to the heat sink. This can be done by tightening three M3 screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will increase the likelihood of board bending. o It is recommended to always use plastics washers in combinations with the three screws. o If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after tightening (with controlled torque) and then re-tighten the screws again. Thermal interface material    To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when mounting the MCPCB on to the heat sink. There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal epoxies. An example of such material is Electrolube EHTC. It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating conditions. Wire soldering   To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 100oC. Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is recommended to use a solder iron of more than 60W. For UV 365nm emitters (LZx-00U600), it is recommended to use low temperature, lead-free, no-clean solder. For example: Sn42/Bi58 (wt.%) solder from Indium Corp (Indalloy #281). COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZC-00U600 (5.5-11/18/13) 13 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com LZC-7xxxxx Emitter on 1-channel MCPCB Dimensions (mm) Tc Pin Out Pad Function + Anode - Cathode Note for Figure 1: • Unless otherwise noted, the tolerance = ± 0.2 mm. • Slots in MCPCB are for M3 or #4-40 mounting screws. • LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces. • Electrical connection pads on MCPCB are labeled “+” for Anode and “-” for Cathode. • LED Engin recommends using thermal interface material when attaching the MCPCB to a heatsink. • The thermal resistance of the MCPCB is: RΘC-B 0.6°C/W Components used MCPCB: ESD chips: HT04503 BZX585-C51 (Bergquist) (NPX, for 12 LED dies in series) COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZC-00U600 (5.5-11/18/13) 14 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com LZC-Cxxxxx Emitter on 2-channel MCPCB Dimensions (mm) Tc Pin Out Pad Function 1+ Anode Ch1 1- Cathode Ch1 2+ Anode Ch2 2- Cathode Ch2 Note for Figure 1: • Unless otherwise noted, the tolerance = ± 0.2 mm. • Slots in MCPCB are for M3 or #4-40 mounting screws. • LED Engin recommends plastic washers to electrically • • • insulate screws from solder pads and electrical traces. Electrical connection pads on MCPCB are labeled “+” for Anode and “-” for Cathode. LED Engin recommends thermal interface material when attaching the MCPCB to a heatsink. The thermal resistance of the MCPCB is: RΘC-B 0.6°C/W Components used MCPCB: ESD chips: HT04503 BZT52C36LP (Bergquist) (NPX, for 6 LED dies in series) COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZC-00U600 (5.5-11/18/13) 15 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Company Information LED Engin, Inc., based in California’s Silicon Valley, specializes in ultra-bright, ultra compact solid state lighting solutions allowing lighting designers & engineers the freedom to create uncompromised yet energy efficient lighting experiences. The LuxiGen™ Platform — an emitter and lens combination or integrated module solution, delivers superior flexibility in light output, ranging from 3W to 90W, a wide spectrum of available colors, including whites, multi-color and UV, and the ability to deliver upwards of 5,000 high quality lumens to a target. The small size combined with powerful output allows for a previously unobtainable freedom of design wherever high-flux density, directional light is required. LED Engin’s packaging technologies lead the industry with products that feature lowest thermal resistance, highest flux density and consummate reliability, enabling compact and efficient solid state lighting solutions. LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions. LED Engin reserves the right to make changes to improve performance without notice. Please contact sales@ledengin.com or (408) 922-7200 for more information. COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZC-00U600 (5.5-11/18/13) 16 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com