LZ4-00U600-00U0

High Efficacy 365nm UV LED Emitter LZ4-00U600 Key Features  High Efficacy 365nm 11W UV LED  Ultra-small foot print – 7.0mm x 7.0mm  Surface mount ceramic package with integrated glass lens  Very low Thermal Resistance (1.1°C/W)  Individually addressable die  Electrically neutral thermal path  Highest Radiant Flux density  JEDEC Level 1 for Moisture Sensitivity Level  Lead (Pb) free and RoHS compliant  Reflow solderable (up to 6 cycles)  Emitter available on Standard and Serially connected MCPCB (optional) Typical Applications  Curing  Sterilization  Medical  Currency Verification  Fluorescence Microscopy  Inspection of dyes, rodent and animal contamination,  Leak detection  Forensics Description The LZ4-00U600 UV LED emitter provides superior radiometric power in the wavelength range specifically required for applications like curing, sterilization, currency verification, and various medical applications. With a 7.0mm x 7.0mm ultra-small footprint, this package provides exceptional optical power density. The patented design has unparalleled thermal and optical performance. The high quality materials used in the package are chosen to optimize light output, have excellent UV resistance, and minimize stresses which results in monumental reliability and radiant flux maintenance. UV RADIATION COPYRIGHT © 2014 LED ENGIN. ALL RIGHTS RESERVED. Avoid exposure to the beam Wear protective eyewear LZ4-00U600 (6.0-12/22/14) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Part number options Base part number Part number Description LZ4-00U600-xxxx LZ4 emitter LZ4-40U600-xxxx LZ4 emitter on Standard Star 1 channel MCPCB Bin kit option codes U6, Ultra-Violet (365nm) Kit number suffix Min flux Bin Color Bin Range 0000 L U0 - U1 00U0 L U0 - U0 00U1 L U1 - U1 Description full distribution flux; full distribution wavelength full distribution flux; wavelength U0 bin only full distribution flux; wavelength U1bin only Notes: 1. Default bin kit option is -0000 COPYRIGHT © 2014 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00U600 (6.0-12/22/14) 2 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Radiant Flux Bins Table 1: Bin Code Minimum Radiant Flux (Φ) @ IF = 700mA [1,2] (w) Maximum Radiant Flux (Φ) @ IF = 700mA [1,2] (W) L 0.80 1.00 M 1.00 1.25 N 1.25 1.60 P 1.60 2.00 Q 2.00 2.40 R 2.40 3.00 Notes for Table 1: 1. Radiant flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ± 10% on flux measurements. 2. Future products will have even higher levels of radiant flux performance. Contact LED Engin Sales for updated information. Peak Wavelength Bins Table 2: Bin Code Minimum Peak Wavelength (λP) @ IF = 700mA [1] (nm) Maximum Peak Wavelength (λP) @ IF = 700mA [1] (nm) U0 365 370 U1 370 375 Notes for Table 2: 1. LED Engin maintains a tolerance of ± 2.0nm on peak wavelength measurements. Forward Voltage Bins Table 3: Bin Code Minimum Forward Voltage (VF) @ IF = 700mA [1,2] (V) Maximum Forward Voltage (VF) @ IF = 700mA [1,2] (V) 0 14.72 19.52 Notes for Table 3: 1. Forward Voltage is binned with all four LED dice connected in series. 2. LED Engin maintains a tolerance of ± 0.16V for forward voltage measurements for the four LEDs. COPYRIGHT © 2014 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00U600 (6.0-12/22/14) 3 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Absolute Maximum Ratings Table 4: Parameter DC Forward Current at Tjmax=100°C Peak Pulsed Forward Current [2] Reverse Voltage Storage Temperature Junction Temperature Soldering Temperature[4] Allowable Reflow Cycles Symbol Value Unit IF IFP VR Tstg TJ Tsol 700 850 See Note 3 -40 ~ +150 100 180 6 mA mA V °C °C °C [1] > 2,000 V HBM Class 2 JESD22-A114-D ESD Sensitivity [5] Notes for Table 4: 1. Maximum DC forward current is determined by the overall thermal resistance and ambient temperature. Follow the curves in Figure 10 for current derating. 2: Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%. 3. LEDs are not designed to be reverse biased. 4. Use low temperature solders. LED Engin recommends 58Bi-42Sn (wt.%) Solder. See Reflow Soldering Profile Figure 3. 5. LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ4-00U600 in an electrostatic protected area (EPA). An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1. Optical Characteristics @ TC = 25°C Table 5: Parameter Symbol Typical Unit Radiant Flux (@ IF = 700mA) Peak Wavelength [1] Viewing Angle [2] Total Included Angle [3] Φ λP 2Θ½ Θ0.9 1.80 365 115 175 W nm Degrees Degrees Notes for Table 5: 1. When operating the UV LED, observe IEC 60825-1 class 3B rating. Avoid exposure to the beam. 2. Viewing Angle is the off axis angle from emitter centerline where the radiant power is ½ of the peak value. 3. Total Included Angle is the total angle that includes 90% of the total radiant flux. Electrical Characteristics @ TC = 25°C Table 6: Typical Parameter Symbol Forward Voltage (@ IF = 700mA) VF Temperature Coefficient of Forward Voltage ΔVF/ΔTJ -14.8 mV/°C Thermal Resistance (Junction to Case) RΘJ-C 1.1 °C/W COPYRIGHT © 2014 LED ENGIN. ALL RIGHTS RESERVED. 1 Die 4.1 4 Dice 16.4 Unit V LZ4-00U600 (6.0-12/22/14) 4 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com IPC IPC/JEDEC Moisture Sensitivity Level Table 7 - IPC/JEDEC J-STD-20D.1 MSL Classification: Soak Requirements Floor Life Standard Accelerated Level Time Conditions Time (hrs) Conditions Time (hrs) Conditions 1 Unlimited ≤ 30°C/ 85% RH 168 +5/-0 85°C/ 85% RH n/a n/a Notes for Table 7: 1. The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and includes the maximum time allowed out of the bag at the distributor’s facility. COPYRIGHT © 2014 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00U600 (6.0-12/22/14) 5 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Mechanical Dimensions (mm) Pin Out Pad Die 1 A Anode 2 A Cathode 3 B Anode 4 B Cathode 5 C Anode 6 C Cathode 7 D Anode 8 D Cathode 9 [2] n/a Thermal 1 2 Function 3 8 4 Figure 1: Package outline drawing. 7 6 5 Notes for Figure 1: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. Thermal contact, Pad 9, is electrically neutra l. Recommended Solder Pad Layout (mm) Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad. Note for Figure 2a: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. This pad layout is “patent pending”. COPYRIGHT © 2014 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00U600 (6.0-12/22/14) 6 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Recommended Solder Mask Layout (mm) Figure 2b: Recommended solder mask opening (hatched area) for anode, cathode, and thermal pad. Note for Figure 2b: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. Reflow Soldering Profile 200 180 Peak Temp. 180 C 160 Temperature (°C) 140 120 100 < 2.5 C/sec. 80 Reflow Zone time above 150 C (90 sec. max.) 40 - 70 sec. typical Soaking Zone (2.0 min. max.) 60 - 90 sec. typical 60 40 Pre-heating Zone (2.0 - 4.0 min. max.) 20 0 0 30 60 90 120 150 180 210 240 270 300 Time (sec.) Figure 3: Reflow soldering profile for low temperature lead free soldering. COPYRIGHT © 2014 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00U600 (6.0-12/22/14) 7 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Typical Radiation Pattern 100 90 Relative Intensity (%) 80 70 60 50 40 30 20 10 100 90 80 70 60 50 40 30 20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 0 Angular Displacement (Degrees) Figure 4: Typical representative spatial radiation pattern. Typical Relative Spectral Power Distribution 1 Relative Spectral Power 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 300 325 350 375 400 425 450 Wavelength (nm) Figure 5: Typical relative spectral power vs. wavelength @ TC = 25°C. COPYRIGHT © 2014 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00U600 (6.0-12/22/14) 8 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Typical Peak Wavelength Shift over Temperature Peak Wavelength Shift (nm) 6.0 5.0 4.0 3.0 2.0 1.0 0.0 0 20 40 60 80 100 800 1000 Case Temperature (ºC) Figure 6: Typical peak wavelength shift vs. case temperature. Typical Normalized Radiant Flux 1.6 Normalized Radiant Flux 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 200 400 600 IF - Forward Current (mA) Figure 7: Typical normalized radiant flux vs. forward current @ T C = 25°C. COPYRIGHT © 2014 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00U600 (6.0-12/22/14) 9 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Typical Normalized Radiant Flux over Temperature 1.2 Normalized Radiant Flux 1 0.8 0.6 0.4 0.2 0 0 20 40 60 80 100 120 Case Temperature (ºC) Figure 8: Typical normalized radiant flux vs. case temperature. Typical Forward Current Characteristics 1200 IF - Forward Current (mA) 1000 800 600 400 200 0 12.0 13.0 14.0 15.0 16.0 17.0 18.0 VF - Forward Voltage (V) Figure 9: Typical forward current vs. forward voltage @ T C = at 25°C. COPYRIGHT © 2014 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00U600 (6.0-12/22/14) 10 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Current De-rating IF - Maximum Current (mA) 1200 1000 800 700 (Rated) 600 400 RΘJ-A = 4°C/W RΘJ-A = 5°C/W RΘJ-A = 6°C/W 200 0 0 25 50 75 100 125 Maximum Ambient Temperature (ºC) Figure 10: Maximum forward current vs. ambient temperature based on T J(MAX) = 125°C. Notes for Figure 10: 1. RΘJ-C [Junction to Case Thermal Resistance] for the LZ4-00UA00 is typically 1.1°C/W. 2. RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance]. COPYRIGHT © 2014 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00U600 (6.0-12/22/14) 11 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Emitter Tape and Reel Specifications (mm) Figure 11: Emitter carrier tape specifications (mm). Figure 12: Emitter Reel specifications (mm). Notes: 1. Packaging contains UV caution labels. Avoid exposure to the beam and wear appropriate protective eyewear when operating the UV LED. COPYRIGHT © 2014 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00U600 (6.0-12/22/14) 12 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com LZ4 MCPCB Family Part number Type of MCPCB Diameter (mm) LZ4-4xxxxx 1-channel 19.9 Emitter + MCPCB Typical Vf Thermal Resistance (V) (°C /W) Typical If (mA) 1.1 + 1.1 = 2.2 700 16.4 Mechanical Mounting of MCPCB   MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to substrate cracking and subsequently LED dies cracking. To avoid MCPCB bending: o Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws. o Care must be taken when securing the board to the heat sink. This can be done by tightening three M3 screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will increase the likelihood of board bending. o It is recommended to always use plastics washers in combinations with the three screws. o If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after tightening (with controlled torque) and then re-tighten the screws again. Thermal interface material    To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when mounting the MCPCB on to the heat sink. There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal epoxies. An example of such material is Electrolube EHTC. It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating conditions. Wire soldering   To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 100oC. Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is recommended to use a solder iron of more than 60W. For UV 365nm emitters (LZx-00U600), it is recommended to use low temperature, lead-free, no-clean solder. For example: Sn42/Bi58 (wt.%) solder from Indium Corp (Indalloy #281). COPYRIGHT © 2014 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00U600 (6.0-12/22/14) 13 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com LZ4-4xxxxx 1 channel, Standard Star MCPCB (1x4) Dimensions (mm) Notes:  Unless otherwise noted, the tolerance = ± 0.2 mm.  Slots in MCPCB are for M3 or #4-40 mounting screws.  LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.  Electrical connection pads on MCPCB are labeled “+” for Anode and “-” for Cathode  LED Engin recommends thermal interface material when attaching the MCPCB to a heatsink  The thermal resistance of the MCPCB is: RΘC-B 1.1°C/W Components used MCPCB: ESD chips: HT04503 BZX585-C30 (Bergquist) (NXP, for 4 LED dies in series) Pad layout Ch. 1 MCPCB Pad 1, 2, 3 4, 5 String/die Function 1/ABCD Cathode Anode + COPYRIGHT © 2014 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00U600 (6.0-12/22/14) 14 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Company Information LED Engin, Inc., based in California’s Silicon Valley, specializes in ultra-bright, ultra compact solid state lighting solutions allowing lighting designers & engineers the freedom to create uncompromised yet energy efficient lighting experiences. The LuxiGen™ Platform — an emitter and lens combination or integrated module solution, delivers superior flexibility in light output, ranging from 3W to 90W, a wide spectrum of available colors, including whites, multi-color and UV, and the ability to deliver upwards of 5,000 high quality lumens to a target. The small size combined with powerful output allows for a previously unobtainable freedom of design wherever high-flux density, directional light is required. LED Engin’s packaging technologies lead the industry with products that feature lowest thermal resistance, highest flux density and consummate reliability, enabling compact and efficient solid state lighting solutions. LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions. LED Engin reserves the right to make changes to improve performance without notice. Please contact sales@ledengin.com or (408) 922-7200 for more information. COPYRIGHT © 2014 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00U600 (6.0-12/22/14) 15 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com