PRODUCT DATASHEET
A250 Series PTC Devices
A250 Series PTC Devices
Description
The JDTFUSE A250 Series is designed to protect
against short duration high voltage fault currents (power
cross or power induction surge) typically found in
telecom applications (250Vrms). The series can be used
to help telecom networking equipment meet the
protection requirements specified in ITU K.20 and K.21.
Features
● 0.08 - 0.18A hold current range, 60VDC operating
voltage
● 250VAC interrupt rating
● Fast time-to-trip
● Binned and sorted narrow resistance ranges available
● RoHS compliant, Lead-Free and Halogen-Free*
Agency Approvals
Agency
Applications
File Number
E472196
● Customer Premises Equipment (CPE)
● Central Office (CO)/telecom centers
● LAN/WAN equipment
● Access equipment
pending
Regulation
Standard
2002/95/EC
EN14582
JDT FUSE Industrial Corp.
www.jdtfuse.com
Page 1/6
A250 Series PTC Devices
Performance Specification
Model
I hold
I trip
V max
V max
Operating Interrupt
(V dc)
(Vrms)
I max
@25°C
(A)
@25°C
(A)
(A)
A250-080
0.080
0.160
60
250
3.0
A250-110
0.110
0.220
60
250
A250-120
0.120
0.240
60
A250-145
0.145
0.290
A250-180
0.180
A250-200
0.200
Pd
Typ.
(W)
Maximum
Time To Trip
Resistance
Current
(A)
Time
(Sec)
R i min
R1max
1.00
0.35
3.00
12.0
33.0
3.0
1.00
1.00
1.10
6.0
16.0
250
3.0
1.00
1.00
1.50
6.0
14.0
60
250
3.0
1.00
1.00
2.50
3.0
12.0
0.360
60
250
10.0
1.50
1.00
18.00
1.0
2.50
0.400
60
250
10.0
1.50
1.00
15.00
1.5
4.50
(Ω)
(Ω)
I hold = Hold Current. Maximum current device will not trip in 25°C still air.
I trip = Trip Current. Minimum current at which the device will always trip in 25°C still air.
V max = Maximum operating voltage device can withstand without damage at rated current (Imax).
I max = Maximum fault current device can withstand without damage at rated voltage (V max).
Pd
= Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.
Ri min/max = Minimum/Maximum device resistance prior to tripping at 25°C.
R1max = Maximum device resistance is measured one hour post reflow.
CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.
Environmental Specifications
Conditions
Test
Passive aging
Humidity aging
Thermal shock
Resistance to solvent
Vibration
Resistance change
+85°C, 1000 hrs.
±5% typical
+85°C, 85% R.H. , 168 hours
±5% typical
+85°C to -40°C, 20 times
±33% typical
MIL-STD-202,Method 215
No change
MIL-STD-202,Method 201
No change
Ambient operating conditions : - 40 °C to +85 °C
Maximum surface temperature of the device in the tripped state is 125 °C
JDT FUSE Industrial Corp.
www.jdtfuse.com
Page 2/6
A250 Series PTC Devices
Thermal Derating Curve
Derating Curves for A250 Series
180
Percentage of Rated Current
160
140
120
100
80
60
40
20
-40 -30 -20
-10
0
10
20
30
40
50
60
70
80
Temperature (°C )
Average Time-Current Curve
1000
A250-080
TIME IN SECOND
100
A250-110
10
A250-120
1
A250-145
0.1
A250-180
0.01
0
1
2
3
CURRENT IN AMPERES
JDT FUSE Industrial Corp.
www.jdtfuse.com
Page 3/6
A250 Series PTC Devices
Ihold Versus Temperature
Maximum ambient operating temperature (Tmao) vs. hold current (Ihold)
Model
- 40°C
- 20°C
0°C
25°C
40°C
50°C
60°C
70°C
85°C
A250-080
0.124
0.110
0.095
0.080
0.066
0.059
0.051
0.044
0.033
A250-110
0.171
0.151
0.131
0.110
0.091
0.081
0.071
0.061
0.046
A250-120
0.186
0.165
0.143
0.120
0.099
0.088
0.077
0.066
0.050
A250-145
0.225
0.199
0.172
0.145
0.119
0.106
0.093
0.080
0.060
A250-180
0.279
0.247
0.213
0.180
0.147
0.131
0.115
0.099
0.074
A250-200
0.264
0.243
0.220
0.200
0.182
0.175
0.163
0.154
0.143
Soldering Parameters
TP 20~40 S
TP 260
Ramp-up
Critical Zone
TL to TP
TL 217
tL
Tsmax
60~150 s
Temperature (°C )
200
Tsmin
Ramp-down
150
ts
Preheat 60~180 s
25
t 25°C to peak
Time
Profile Feature
Average Ramp-Up Rate
Pb-Free Assembly
3℃/second mac.
(Ts max to T p)
Preheat
-Temperature Min(Ts min)
150℃
-Temperature Max(Ts max)
200℃
-Time(Ts min to Ts max)
60~180 seconds
Time maintained above:
-Temperature(TL)
217℃
-Time(tL)
60~150 seconds
Peak Temperature(Tp)
260℃
Ramp-Down Rate
6℃/second max.
Time 25℃ to Peak Temperature 8 minutes max
Storage Condition
0℃~35℃,≤70%RH
JDT FUSE Industrial Corp.
www.jdtfuse.com
Recommended reflow methods: IR, vapor phase oven,
hot air oven, N2 environment for lead-free
Recommended maximum paste thickness is 0.25mm
Devices can be cleaned using standard industry methods
and solvents.
Note 1:All temperature refer to topside of the package,
measured on the package body surface.
Note 2: If reflow temperatures exceed the recommended
profile, devices may not meet the performance
requirements.
Page 4/6
A250 Series PTC Devices
Physical Dimensions(mm.)
A
A
E
a250
B
B
D
D
RF080
= Trademark
= 0.08A hold
current
C
A
B
C
D
E
Max.
Typ.
Max.
Min.
Max.
A250-080
5.8
9.9
5.1
5.0
3.8
A250-110
6.5
11.0
5.1
5.0
3.8
A250-120
7.1
11.0
5.1
5.0
3.8
A250-145
7.1
11.0
5.1
5.0
3.8
A250-180
9.0
12.6
5.1
5.0
3.8
A250-200
9.0
12.6
5.1
5.0
4.7
Model
PHYSICAL SPECIFICATIONS :
Materials :
A250- 080~180: Tin-plated copper, 22AWG, Φ0.65mm(0.026 in).
Lead Solderability : MIL-STD-202, Method 208E
JDT FUSE Industrial Corp.
www.jdtfuse.com
Page 5/6
A250 Series PTC Devices
Packaging Quantity
A250
120
T
RA
B-0.5
KR or KU
Product
Hold
T= Pre-tripped
Rx=
B-x.x=
K=Kink leads
name
Current
U= Uncoated
Resistance
Resistance Bin
R=Tape&Reel
250V
(mA)
Blank= Standard
range
Reel QTY Bag QTY
Range within 0.5ohm U=Bulk package
(Optional)
1500
500
in one lot. (Optional)
Tape & Reel packaging per EIA468-B standard.
Cross Reference
Cross Reference
Model
Tyco / PolySwitch®
Bourns / POLY-FUSE®
Polytronics / EVERFUSE®
A250-080
TRF250-080
-
HVR250P080CF
A250-110
-
-
-
A250-120
TRF250-120
MF-RX012/250
HVR250P120CF
A250-145
TRF250-145
MF-RX014/250
HVR250P145CF
A250-180
TRF250-180
MF-RX018/250
HVR250P180CF
A250-200
TRF250-200
MF-RX020/250
HVR250P200CF
“PolySwitch” is a registered trademark of Tyco Electronics.
“POLY-FUSE” is a registered trademark of Littelfuse,Inc.
“EVERFUSE” is a registered trademark of Polytronics Technology Corp.
JDT FUSE Industrial Corp.
www.jdtfuse.com
Page 6/6
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