ASMD1210-020

PRODUCT DATASHEET ASMD1210 Series Surface Mount PTC Devices ASMD1210 Series Surface Mount PTC Devices Description The ASMD1210 series provides surface mount resettable overcurrent protection with holding current from 0.05A to 2.00A. This series is suitable for wide range of applications in modern electronics where space is limited. Features ● RoHS compliant and lead-free ● Low profile ● Halogen-free ● Fast response to fault current ● Compact design saves board space ● Compatible with high temperature solders Agency Approvals Agency Applications File Number pending pending ● Battery PCM ● Game console port protection ● USB hubs, ports and peripherals ● Optical disk drives ● Set-top-box and HDMI ● General electronics Regulation Standard 2002/95/EC EN14582 JDT FUSE Industrial Corp. www.jdtfuse.com Page 1/7 ASMD1210 Series Surface Mount PTC Devices Performance Specification Model V max (V dc) I max (A) I hold I trip Maximum Time To Trip Pd @25°C (A) @25°C (A) Typ. (W) Resistance Current (A) Time (Sec) R i min R1max (Ω) (Ω) ASMD1210-005 30.0 100 0.05 0.15 0.6 0.25 1.50 2.800 50.000 ASMD1210-010 30.0 100 0.10 0.30 0.6 0.50 0.60 0.800 15.000 ASMD1210-020 30.0 100 0.20 0.40 0.6 8.0 0.02 0.400 5.000 ASMD1210-035 6.0 100 0.35 0.75 0.6 8.0 0.20 0.200 1.300 ASMD1210-050 13.2 100 0.50 1.00 0.6 8.0 0.10 0.180 0.900 ASMD1210-075 6.0 100 0.75 1.50 0.6 8.0 0.10 0.070 0.400 ASMD1210-110 6.0 100 1.10 2.20 0.6 8.0 0.30 0.050 0.210 ASMD1210-150 6.0 100 1.50 3.00 0.6 8.0 0.50 0.030 0.110 ASMD1210-175 6.0 100 1.75 3.50 0.8 8.0 0.60 0.020 0.080 ASMD1210-200 6.0 100 2.00 4.00 0.8 8.0 1.00 0.015 0.070 I hold = Hold Current. Maximum current device will not trip in 25°C still air. I trip = Trip Current. Minimum current at which the device will always trip in 25°C still air. V max = Maximum operating voltage device can withstand without damage at rated current (Imax). I max = Maximum fault current device can withstand without damage at rated voltage (V max). Pd = Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage. Ri min/max = Minimum/Maximum device resistance prior to tripping at 25°C. R1max = Maximum device resistance is measured one hour post reflow. CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame. Environmental Specifications Conditions Test Resistance change Passive aging +85°C, 1000 hrs. ±5% typical Humidity aging +85°C, 85% R.H. , 168 hours ±5% typical Thermal shock +85°C to -40°C, 20 times ±33% typical Resistance to solvent MIL-STD-202,Method 215 No change Vibration MIL-STD-202,Method 201 No change 　 Ambient operating conditions : - 40 °C to +85 °C Maximum surface temperature of the device in the tripped state is 125 °C JDT FUSE Industrial Corp. www.jdtfuse.com Page 2/7 ASMD1210 Series Surface Mount PTC Devices Thermal Derating Curve Percentage of Derated Current Derating Curves for SMD1210 Series 160 140 120 100 80 60 40 20 0 -40 -20 0 20 40 60 80 Temperature (°C ) Average Time-Current Curve TIME IN SECOND 100 0.05A 0.10A 0.12A 0.20A 0.25A 0.35A 0.50A 0.75A 1.00A 1.10A 1.50A 2.00A 10 1 0.1 0.01 0.1 1 10 CURRENT IN AMPERES JDT FUSE Industrial Corp. www.jdtfuse.com Page 3/7 ASMD1210 Series Surface Mount PTC Devices Thermal Derading Chart Maximum ambient operating temperature (Tmao) vs. hold current (Ihold) Model - 40°C - 20°C 0°C 25°C 40°C 50°C 60°C 70°C 85°C ASMD1210-005 0.08 0.07 0.06 0.05 0.04 0.04 0.03 0.03 0.02 ASMD1210-010 0.16 0.14 0.12 0.10 0.08 0.07 0.06 0.05 0.03 ASMD1210-020 0.29 0.26 0.22 0.20 0.16 0.14 0.13 0.11 0.08 ASMD1210-035 0.47 0.45 0.40 0.35 0.33 0.28 0.24 0.21 0.18 ASMD1210-050 0.76 0.67 0.58 0.50 0.43 0.40 0.36 0.32 0.28 ASMD1210-075 1.00 0.97 0.86 0.75 0.64 0.59 0.54 0.48 0.40 ASMD1210-110 1.69 1.48 1.29 1.10 0.88 0.76 0.65 0.57 0.43 ASMD1210-150 2.13 1.92 1.71 1.50 1.26 1.14 1.01 0.89 0.71 ASMD1210-175 2.54 2.30 2.02 1.75 1.47 1.33 1.18 1.05 0.86 ASMD1210-200 2.90 2.63 2.31 2.00 1.68 1.52 1.35 1.20 0.98 Soldering Parameters TP 20~40 S TP 260 Ramp-up Profile Feature Critical Zone TL to TP TL 217 tL Tsmax Temperature (°C ) Preheat Tsmin Ramp-down ts Preheat 60~180 s 25 3℃/second mac. (Ts max to T p) 60~150 s 200 150 Average Ramp-Up Rate Pb-Free Assembly t 25°C to peak Time Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free Recommended maximum paste thickness is 0.25mm Devices can be cleaned using standard industry methods and solvents. Note 1:All temperature refer to topside of the package, measured on the package body surface. Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. JDT FUSE Industrial Corp. www.jdtfuse.com -Temperature Min(Ts min) 150℃ -Temperature Max(Ts max) 200℃ -Time(Ts min to Ts max) 60~180 seconds Time maintained above: -Temperature(TL) 217℃ -Time(tL) 60~150 seconds Peak Temperature(Tp) 260℃ Ramp-Down Rate 6℃/second max. Time 25℃ to Peak Temperature 8 minutes max Storage Condition 0℃~35℃,≤70%RH Page 4/7 ASMD1210 Series Surface Mount PTC Devices Physical Dimensions(mm.) A Model B C D E Min. Max. Min. Max. Min. Max. Min. Min. ASMD1210-005 3.00 3.43 2.35 2.80 0.30 0.80 0.30 0.10 ASMD1210-010 3.00 3.43 2.35 2.80 0.30 0.80 0.30 0.10 ASMD1210-020 3.00 3.43 2.35 2.80 0.30 0.80 0.30 0.10 ASMD1210-035 3.00 3.43 2.35 2.80 0.30 0.80 0.30 0.10 ASMD1210-050 3.00 3.43 2.35 2.80 0.30 0.80 0.30 0.10 ASMD1210-075 3.00 3.43 2.35 2.80 0.30 0.80 0.30 0.10 ASMD1210-110 3.00 3.43 2.35 2.80 0.30 0.80 0.30 0.10 ASMD1210-150 3.00 3.43 2.35 2.80 0.40 0.80 0.30 0.10 ASMD1210-175 3.00 3.43 2.35 2.80 0.50 1.20 0.30 0.10 ASMD1210-200 3.00 3.43 2.35 2.80 0.50 1.20 0.30 0.10 Termination Pad Characteristics Terminal pad materials：Tin-plated Nickel-Copper Terminal pad solder ability：Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3. Packaging Quantity and Marking 2.0±0.1 Part Number 1.9±0.1 1.0±0.1 JDT FUSE Industrial Corp. www.jdtfuse.com Quantity ASMD1210-050.075 4000 pcs/reel The others 4500 pcs/reel 1.0±0.1 Page 5/7 ASMD1210 Series Surface Mount PTC Devices Tape And Reel Specifications (mm) Governing Specifications EIA 481-1 W 8.15 ± 0.2 P0 4.0 ± 0.10 P1 4.0 ± 0.10 P2 2.0 ± 0.05 A0 2.82 ± 0.10 B0 3.52 ± 0.10 B1max. 4.35 D0 1.50 + 0.1, -0 F 3.5 ± 0.05 E1 1.75 ± 0.10 E2min. 6.25 T 0.6 T1max. 0.1 K0 1.04 ± 0.1 Leader min. 390 Trailer min. 160 Reel Dimensions 　 A max. 178 N min. 60 W1 9 ± 0.5 W2 12.6 ± 0.5 Storage And Handling ● Storage conditions：40°C max, 70% R.H. ● Devices may not meet specified performance if storage conditions are exceeded.Technology Corp. JDT FUSE Industrial Corp. www.jdtfuse.com P1 P2 D0 P0 E1 F W T D2 K0 A0 B0 H W4 W3 D C W2 W F W1 H1 Page 6/7 ASMD1210 Series Surface Mount PTC Devices Part Number System ASMD 1210 - Special Voltage Rating(Optional) Holding Current Rating Device Dimensions: Length/width(Unit:1/100 inch) Size 3225 mm / 1210 inch Surface Mount Device Cross Reference Cross Reference Model Tyco / PolySwitch® Littelfuse / POLY-FUSE® Polytronics / EVERFUSE® ASMD1210-005 MicroSMD005F 1210L005 SMD1210P005TF ASMD1210-010 MicroSMD010F 1210L010 SMD1210P010TF ASMD1210-020 - 1210L020 SMD1210P020TF ASMD1210-035 MicroSMD035F 1210L035 SMD1210P035TF ASMD1210-050 MicroSMD050F 1210L050 SMD1210P050TF ASMD1210-075 MicroSMD075F 1210L075 SMD1210P750TF ASMD1210-110 MicroSMD110F 1210L110 SMD1210P110TF ASMD1210-150 MicroSMD150F 1210L150 SMD1210P150TF ASMD1210-175 MicroSMD175F 1210L175 SMD1210P175TF ASMD1210-200 MicroSMD200F 1210L200 SMD1210P200TF “PolySwitch” is a registered trademark of Tyco Electronics. “POLY-FUSE” is a registered trademark of Littelfuse,Inc. “EVERFUSE” is a registered trademark of Polytronics Technology Corp. 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