ASMD2018-200

PRODUCT DATASHEET Surface Mount PTC Devices ASMD2018 Series Surface Mount PTC Devices ASMD2018 Series Surface Mount PTC Devices Description The ASMD2018 series provides surface mount resettable overcurrent protection with holding current from 0.3A to 2.0A. This series is suitable for applications with higher holding currant and higher working voltage up to 60V. Features ● RoHS compliant and lead-free ● Low profile ● Halogen-free ● Fast response to fault current ● High voltage ● Compatible with high temperature solders Agency Approvals Agency Applications File Number pending pending ● Power over Ethernet (POE) ● IEEE 1394 port protection ● Powered USB for POS and IPC ● Low voltage telecom equipment ● Automotive electronics control module protection ● Industrial control ● Security systems Regulation Standard 2002/95/EC EN14582 JDT FUSE Industrial Corp. www.jdtfuse.com Page 1/7 ASMD2018 Series Surface Mount PTC Devices Performance Specification Model V max (V dc) I max (A) I hold I trip Maximum Time To Trip Pd @25°C (A) @25°C (A) Typ. (W) Resistance Current (A) Time (Sec) R i min R1max (Ω) (Ω) ASMD2018-030 60 100 0.30 0.60 0.9 1.5 3.00 0.500 2.300 ASMD2018-050 60 100 0.55 1.20 1.0 2.5 3.00 0.200 1.000 ASMD2018-100 15 100 1.10 2.20 1.1 8.0 0.40 0.060 0.360 ASMD2018-100-33 33 100 1.10 2.20 1.1 8.0 0.40 0.060 0.360 ASMD2018-150 15 100 1.50 3.00 1.1 8.0 0.80 0.050 0.170 ASMD2018-200 10 100 2.00 4.00 1.1 8.0 2.40 0.030 0.100 I hold = Hold Current. Maximum current device will not trip in 25°C still air. I trip = Trip Current. Minimum current at which the device will always trip in 25°C still air. V max = Maximum operating voltage device can withstand without damage at rated current (Imax). I max = Maximum fault current device can withstand without damage at rated voltage (V max). Pd = Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage. Ri min/max Test= Minimum/Maximum device resistance prior to tripping at 25°C. R1max = Maximum device resistance is measured one hour post reflow. CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame. Environmental Specifications Conditions Resistance change Passive aging +85°C, 1000 hrs. ±5% typical Humidity aging +85°C, 85% R.H. , 168 hours ±5% typical Thermal shock +85°C to -40°C, 20 times ±33% typical Resistance to solvent MIL-STD-202,Method 215 No change Vibration MIL-STD-202,Method 201 No change 　 Ambient operating conditions : - 40 °C to +85 °C Maximum surface temperature of the device in the tripped state is 125 °C JDT FUSE Industrial Corp. www.jdtfuse.com Page 2/7 ASMD2018 Series Surface Mount PTC Devices Thermal Derating Curve Percentage of Derated Current Derating Curves for SMD2018 Series 160 140 120 100 80 60 40 20 0 -40 -20 0 20 40 60 80 Temperature (°C ) Average Time-Current Curve TIME IN SECOND 100 10 0.30A 1 0.50A 1.00A 1.50A 2.00A 0.1 0.01 0.1 1 10 100 CURRENT IN AMPERES JDT FUSE Industrial Corp. www.jdtfuse.com Page 3/7 ASMD2018 Series Surface Mount PTC Devices Thermal Derading Chart Maximum ambient operating temperature (Tmao) vs. hold current (Ihold) Model - 40°C - 20°C 0°C 25°C 40°C 50°C 60°C 70°C 85°C ASMD2018-030 0.48 0.42 0.35 0.30 0.24 0.21 0.17 0.15 0.10 ASMD2018-050 0.87 0.77 0.67 0.55 0.46 0.41 0.36 0.31 0.23 ASMD2018-100 1.71 1.52 1.32 1.10 0.94 0.84 0.74 0.64 0.50 ASMD2018-100-33V 1.71 1.52 1.32 1.10 0.94 0.84 0.74 0.64 0.50 ASMD2018-150 2.38 2.10 1.82 1.50 1.27 1.13 0.99 0.85 0.64 ASMD2018-200 2.95 2.65 2.35 2.00 1.74 1.59 1.44 1.29 1.06 Soldering Parameters TP 20~40 S TP 260 Ramp-up Critical Zone TL to TP TL 217 tL Tsmax 60~150 s Temperature (°C ) 200 Tsmin Ramp-down 150 ts Preheat 60~180 s 25 t 25°C to peak Time Profile Feature Average Ramp-Up Rate Pb-Free Assembly 3℃/second mac. (Ts max to T p) Preheat -Temperature Min(Ts min) 150℃ -Temperature Max(Ts max) 200℃ -Time(Ts min to Ts max) 60~180 seconds Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free Recommended maximum paste thickness is 0.25mm Devices can be cleaned using standard industry methods and solvents. Note 1:All temperature refer to topside of the package, measured on the package body surface. Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Time maintained above: -Temperature(TL) 217℃ -Time(tL) 60~150 seconds Peak Temperature(Tp) 260℃ Ramp-Down Rate 6℃/second max. Time 25℃ to Peak Temperature 8 minutes max Storage Condition 0℃~35℃,≤70%RH JDT FUSE Industrial Corp. www.jdtfuse.com Page 4/7 ASMD2018 Series Surface Mount PTC Devices Physical Dimensions(mm.) A Model B C D E Min. Max. Min. Max. Min. Max. Min. Min. ASMD2018-030 4.72 5.44 4.22 4.93 0.60 1.10 0.30 4.72 ASMD2018-050 4.72 5.44 4.22 4.93 0.70 1.30 0.30 4.72 ASMD2018-100 4.72 5.44 4.22 4.93 0.45 0.80 0.30 4.72 ASMD2018-100-33V 4.72 5.44 4.22 4.93 0.45 0.80 0.30 4.72 ASMD2018-150 4.72 5.44 4.22 4.93 0.45 0.80 0.30 4.72 ASMD2018-200 4.72 5.44 4.22 4.93 0.40 0.80 0.30 4.72 Termination Pad Characteristics Terminal pad materials：Tin-plated Nickel-Copper Terminal pad solder ability：Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3. Packaging Quantity and Marking 3.4±0.1 Part Number 4.6±0.1 Quantity ASMD2018-030.050 1500 pcs/reel The others 2500 pcs/reel Tape & reel packaging per EIA481-1 1.5±0.1 JDT FUSE Industrial Corp. www.jdtfuse.com 1.5±0.1 Page 5/7 ASMD2018 Series Surface Mount PTC Devices Tape And Reel Specifications (mm) Governing Specifications EIA 481-1 W 12.0 ± 0.2 P0 4.0 ± 0.10 P1 8.0 ± 0.10 P2 2.0 ± 0.05 A0 4.40 ± 0.10 B0 5.50 ± 0.10 B1max. 8.20 D0 1.50 + 0.1, -0 F 5.5 ± 0.05 E1 1.75 ± 0.10 E2min. 10.25 T 0.6 T1max. 0.1 K0 1.36 ± 0.1 Leader min. 390 Trailer min. 160 Reel Dimensions 　 A max. 178 N min. 50 W1 12.4 ± 0.5 W2 18.4 ± 0.5 Storage And Handling ● Storage conditions：40°C max, 70% R.H. ● Devices may not meet specified performance if storage conditions are exceeded.Technology Corp. JDT FUSE Industrial Corp. www.jdtfuse.com P1 P2 D0 P0 E1 F W T D2 K0 A0 B0 H W4 W3 D C W2 W F W1 H1 Page 6/7 ASMD2018 Series Surface Mount PTC Devices Part Number System ASMD 2018 - Special Voltage Rating(Optional) Holding Current Rating Device Dimensions: Length/width(Unit:1/100 inch) Size 5045 mm / 2018 inch Surface Mount Device Cross Reference Cross Reference Model Tyco / PolySwitch® Littelfuse / POLY-FUSE® Polytronics / EVERFUSE® ASMD2018-030 SMD030F-2018 2016L030 SMD2016P030TF ASMD2018-050 decaSMDC050F/60 2016L050 SMD2016P050TF ASMD2018-100 SMD100F-2018 2016L100 SMD2016P100TF ASMD2018-100-33V - 2016L100/33 SMD2016P100TF/33 ASMD2018-150 SMD150F-2018 2016L150 SMD2016P150TF ASMD2018-200 SMD200F-2018 2016L200 SMD2016P200TF “PolySwitch” is a registered trademark of Tyco Electronics. “POLY-FUSE” is a registered trademark of Littelfuse,Inc. “EVERFUSE” is a registered trademark of Polytronics Technology Corp. JDT FUSE Industrial Corp. www.jdtfuse.com Page 7/7