SLG59M1495V
Ultra-small 80 mΩ, 1.0 A
Load Switch with Discharge
General Description
Pin Configuration
ON
1
The product is packaged in an ultra-small 1.0 x 1.0 mm
package.
D
2
SLG59M1495V
The SLG59M1495V is designed for load switching
applications. The part comes with one 80 mΩ 1.0 A rated
MOSFET controlled by a single ON control pin. The
MOSFET’s ramp rate is adjustable depending on the input
current level of the ON pin.
4
GND
3
S
Features
•
•
•
•
•
•
•
4-pin STDFN
(Top View)
One 80 mΩ 1.0 A MOSFET
One integrated VGS Charge Pump
User selectable ramp rate with external resistor
Integrated Discharge Resistor
Over Temperature Protection
Pb-Free / Halogen-Free / RoHS compliant
STDFN 4L, 1.0 x 1.0 x 0.55 mm
Block Diagram
S
D
1.0 A
Charge
Pump Out
Current Detect
Slew Rate Control
ON
©2022 Renesas Electronics Corporation
000-0059M1495-104
CMOS Input
Rev 1.04
Revised February 4, 2022
SLG59M1495V
Pin Description
Pin #
Pin Name
Type
Pin Description
1
ON
Input
Turns on MOSFET. Configurable slew rate control depending on input
current.
2
D
MOSFET
Drain of Power MOSFET
3
S
MOSFET
Source of Power MOSFET
4
GND
GND
Ground
Ordering Information
Part Number
Type
Production Flow
SLG59M1495V
STDFN 4L
Extended Commercial, -20 °C to 70 °C
SLG59M1495VTR
STDFN 4L (Tape and Reel)
Extended Commercial, -20 °C to 70 °C
Application Diagram
Current
Controls
Ramp Rate
ON
3.3 V
R1
SLG59M1495V
Control
IC
D
GND
S
Adjustable Ramp Rate vs. ON Pin Current (5.5 V, 25 °C)
I_ON
TSLEW (typ)
20 µA
0.56 V/ms
50 µA
1.34 V/ms
100 µA
2.53 V/ms
150 µA
3.71 V/ms
200 µA
4.68 V/ms
250 µA
5.63 V/ms
Adjustable Slew Rate (ON Pin 2)
SLG59M1495V has a built in configurable slew control feature. The configurable slew control uses current detection method on
Pin 2. When ON voltage rise above ON_VIH_INI (1.2 V typical), the slew control circuit will measure the current flowing into Pin
2. Based on the current flowing into pin 2, different slew rates will be selected by the internal control circuit. See I_ON vs. Tslew
table on page 2. The slew rate is configurable by selecting a different R1 resistor value as shown on application diagram on page
2. Calculating the R1 value depends on both the desired slew rate, and the VOH level of the device driving the ON Pin 2.
ON_Current = (GPIO_VOH – ON_VREF (1.05 V typical)) / R1
000-0059M1495-104
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SLG59M1495V
Absolute Maximum Ratings
Parameter
Description
VD
Power Supply
TS
Storage Temperature
ESDHBM
ESDM
Conditions
Min.
Typ.
Max.
Unit
--
--
6
V
-65
--
150
°C
ESD Protection
Human Body Model
2000
--
--
V
ESD Protection
Machine Model
400
--
--
V
MSL
Moisture Sensitivity Level
WDIS
Package Power Dissipation
1
MOSFET IDSPK Peak Current from Drain to Source For no more than 1 ms with 1% duty cycle
--
--
0.5
W
--
--
1.5
A
Note: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
Electrical Characteristics
TA = -20 to 70 °C (unless otherwise stated)
Parameter
VD
IDD
RDSON
IDS
TDelay_ON
Description
Conditions
Min.
Typ.
Max.
Power Supply Voltage
-20 to 70°C
2.5
--
5.5
V
when OFF
--
0.1
1
µA
Power Supply Current (PIN 2)
Static Drain to Source
ON Resistance
when ON, No load
--
18
30
µA
TA 25°C MOSFET
--
80
100
mΩ
TA 70°C MOSFET
--
100
110
mΩ
Operating Current
VD = 2.5 V to 5.5 V
--
--
1.0
A
ON pin Delay Time
50% ON to Ramp Begin
Input Current (PIN 1) = 20 µA,
VD = 5 V, Source_Cap = 10 µF,
RL = 20 Ω
0
2.4
4.0
ms
Configurable 1
50% ON to 90% VS
TTotal_ON
Total Turn On Time
Example: Input Current (PIN 1) = 20
µA, VD = 5 V, Source_Cap = 10 µF, RL
= 20 Ω
--
RDIS
ON_VREF
ON_VIH_INI
ON_VIL
ON_R
Slew Rate
Example: Input Current (PIN 1) = 20
µA, VD = 5 V, Source_Cap = 10 µF, RL
= 20 Ω
11.7
ms
--
Configurable 1
10% VS to 90% VS
TSLEWRATE
Unit
--
0.56
ms
V/ms
--
V/ms
Discharge Resistance
100
150
300
Ω
ON Pin Reference Voltage2
0.99
1.05
1.10
V
Initial Turn On Voltage
Internal Charge Pump ON
1.2
--
VDD
V
Low Input Voltage on ON pin
Internal Charge Pump OFF
-0.3
0
0.3
V
100
--
--
MΩ
THERMON
Thermal shutoff turn-on temperature
Input Impedance on ON pin
--
120
--
°C
THERMOFF
Thermal shutoff turn-off temperature
--
100
--
°C
THERMTIME Thermal shutoff time
TDelay_OFF
TFALL
--
--
1
ms
OFF Delay Time
50% ON to VS Fall, VD = 5 V,
RL = 20 Ω, no CL
--
6.5
20
µs
VS Fall Time
90% VS to 10% VS, VD = 5 V,
RL = 20 Ω, no CL
--
1.2
2
µs
Notes:
1. Refer to table for configuration details.
2. Voltage before ON pin resistor needs to be higher than 1.2 V to generate required ION
000-0059M1495-104
Page 3 of 9
SLG59M1495V
Slew Rate vs. ON Current
Slew Rate (V/ms) Vs. ON Current, T = 25C
10%VS to 90%VS, RL = 20 ohm, CL = 10uF
7.00
6.00
5.00
VD = 2.5V
V/ms
4.00
VD = 3.3V
3.00
VD = 5V
VD = 5.25V
2.00
VD = 5.5V
1.00
0.00
0
50
100
150
200
250
ON Current (uA)
TTotal_ON vs. On Current
Ttotal_on vs ON Current. 50%ON to 90%VS, T = 25C, RL =
20 ohm, CL = 10uF
14.00
12.00
Ttota
al_on (ms)
10.00
VD = 2.5V
8.00
VD = 3.3V
6.00
VD = 5V
VD = 5.25V
4.00
VD = 5.5V
2.00
0.00
0
50
100
150
200
250
ON Current (uA)
000-0059M1495-104
Page 4 of 9
SLG59M1495V
TTotal_ON, TON_Delay and Slew Rate Measurement
ON
50% ON
50% ON
TOFF_DELAY
90% VS
VS
90% VS
TON_DELAY
10% VS
10% VS
Slew Rate (V/ms)
TFALL
TTotal_ON
SLG59M1495V Layout Suggestion
Note: All dimensions shown in micrometers (µm)
000-0059M1495-104
Page 5 of 9
SLG59M1495V
Package Top Marking System Definition
NN
Pin 1 Identifier
+
Serial Number Line 1
Serial Number Line 2
NN -Part Serial Number Field Line 1
where each “N” character can be A-Z and 0-9
+ - Part Serial Number Field Line 2
where “+” character can be +, -, =, or blank
000-0059M1495-104
Page 6 of 9
SLG59M1495V
Package Drawing and Dimensions
4 Lead STDFN Package 1.0 x 1.0 mm
000-0059M1495-104
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SLG59M1495V
Tape and Reel Specifications
Max Units
Leader (min)
Nominal
Reel &
Package # of
Package Size
Hub Size
Length
Type
Pins
per Reel per Box
Pockets
[mm]
[mm]
[mm]
STDFN 4L
Green
4
1.0 x 1.0 x 0.55
8000
8000
178 / 60
200
400
Trailer (min)
Pockets
Length
[mm]
Tape
Width
[mm]
200
400
8
Part
Pitch
[mm]
2
Carrier Tape Drawing and Dimensions
Pocket BTM Pocket BTM
Package
Length
Width
Type
STDFN 4L
Green
Pocket
Depth
Index Hole
Pitch
Pocket
Pitch
Index Hole
Diameter
Index Hole Index Hole
to Tape
to Pocket Tape Width
Edge
Center
A0
B0
K0
P0
P1
D0
E
F
W
1.16
1.16
0.63
4
2
1.5
1.75
3.5
8
Refer to EIA-481 specification
Recommended Reflow Soldering Profile
Please see IPC/JEDEC J-STD-020: latest revision for reflow profile based on package volume of 0.55 mm3 (nominal). More
information can be found at www.jedec.org.
000-0059M1495-104
Page 8 of 9
SLG59M1495V
Revision History
Date
Version
2/4/2022
1.04
Updated Company name and logo
Fixed typos
11/20/2017
1.03
Updated Package Marking Definition
Updated Layout Suggestion
11/30/2015
1.02
Added MSL information
9/9/2015
1.01
Updated Abs Max Ratings with ESD for Machine Model
Updated Conditions in Electrical Characteristics Table
000-0059M1495-104
Change
Page 9 of 9
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