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SLG59M1571V

SLG59M1571V

  • 厂商:

    DIALOGSEMICONDUCTOR(戴乐格)

  • 封装:

    UFDFN4

  • 描述:

    A 1 MM, LOW-VOLTAGE, 0.85 VD, R

  • 数据手册
  • 价格&库存
SLG59M1571V 数据手册
SLG59M1571V Ultra-small 14.6 mΩ 1.0 A GreenFET Load Switch with Discharge and Reverse Blocking  General Description Pin Configuration ON 1 Features VIN 2 • • • • • • • • One 14.6 mΩ 1.0 A MOSFET Reverse Blocking VIN = 0.85 V to 1.9 V One integrated VGS Charge Pump Integrated Discharge Resistor Over Temperature Protection Pb-Free / Halogen-Free / RoHS compliant STDFN 4L, 1.0 x 1.0 x 0.55 mm SLG59M1571V The SLG59M1571V is designed for load switching applications. The part comes with one 14.6 mΩ 1.0 A rated MOSFET with Reverse Blocking and is controlled by a single ON control pin. The product is packaged in an ultra-small 1.0 x 1.0 mm package. 4 GND 3 VOUT 4-pin STDFN (Top View) Block Diagram VOUT VIN 1.0 A Reverse Blocking Charge Pump Out ON ©2022 Renesas Electronics Corporation 000-0059M1571-102 CMOS Input Rev 1.02 Revised February 14, 2022 SLG59M1571V  Pin Description Pin # Pin Name Type Pin Description 1 ON Input Turns on MOSFET. 2 VIN MOSFET Power Input MOSFET 3 VOUT MOSFET Power Output MOSFET 4 GND GND Ground Ordering Information Part Number Type Production Flow SLG59M1571V STDFN 4L Industrial, -40 °C to 85 °C SLG59M1571VTR STDFN 4L (Tape and Reel) Industrial, -40 °C to 85 °C 000-0059M1571-102 Page 2 of 8 SLG59M1571V  Absolute Maximum Ratings Parameter Description VIN Power Supply TS Storage Temperature ESDHBM WDIS ESD Protection Conditions Human Body Model Min. Typ. Max. Unit -- -- 2.5 V -65 -- 150 °C 2000 -- -- V -- -- 0.5 W -- -- 1.5 A Package Power Dissipation MOSFET IDSPK Peak Current from Drain to Source For no more than 1 ms with 1% duty cycle Note: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Electrical Characteristics TA = -40 °C to 85 °C (unless otherwise stated) Parameter Description Conditions Min. Typ. Max. Unit VIN Power Supply Voltage -40 °C to 85 °C 0.85 -- 1.9 V IDD Power Supply Current (PIN 2) when OFF, VOUT = 1.9 V -- 0.4 3 µA when ON, No load -- 27 40 µA when OFF, VOUT = 1.9 V, VIN = 0 V -- 1.1 4 µA TA 25°C MOSFET -- 14.6 17 mΩ TA 85°C MOSFET -- 17.2 20 mΩ Operating Current VD = 0.85 V to 1.9 V -- -- 1.0 A TON_Delay ON pin Delay Time 50% ON to Ramp Begin VIN = 1.2 V, Source_Cap = 10 µF, RL = 20 Ω -- 90 200 µs TTotal_ON Total Turn On Time VIN = 1.2 V, Source_Cap = 10 µF, RL = 20 Ω -- 310 500 µs Slew Rate VIN = 1.2 V, Source_Cap = 10 µF, RL = 20 Ω -- 4.7 -- V/ms Full Operating Range 50 -- 120 Ω VIN = 1.2 V @ -40 °C to 85 °C 54 67 80 Ω -- VD V IREV_LKG RDSON IDS TSLEWRATE Reverse Leakage Measured from Pin3 to Pin2 Static Drain to Source ON Resistance RDIS Discharge Resistance ON_VIH Initial Turn On Voltage Internal Charge Pump ON 0.85 ON_VIL Low Input Voltage on ON pin Internal Charge Pump OFF -0.3 0 0.3 V ON_R Input Impedance on ON pin 100 -- -- MΩ Thermal shutoff turn-on temperature -- 120 -- °C THERMOFF Thermal shutoff turn-off temperature -- 100 -- °C THERMTIME Thermal shutoff time -- -- 1 ms -- 12 16 µs THERMON TDelay_OFF OFF Delay Time 000-0059M1571-102 50% ON to VS Fall, VIN = 1.2 V, RL = 20 Ω Page 3 of 8 SLG59M1571V  TTotal_ON, TON_Delay and Slew Rate Measurement ON 50% ON 50% ON TOFF_DELAY 90% VOUT VOUT 90% VOUT TON_DELAY 10% VOUT 10% VOUT Slew Rate (V/ms) TFALL TTotal_ON SLG59M1571V Layout Suggestion Note: All dimensions shown in micrometers (µm) 000-0059M1571-102 Page 4 of 8 SLG59M1571V  Package Top Marking System Definition NN Pin 1 Identifier + Serial Number Line 1 Serial Number Line 2 NN -Part Serial Number Field Line 1 where each “N” character can be A-Z and 0-9 + - Part Serial Number Field Line 2 where “+” character can be +, -, =, or blank 000-0059M1571-102 Page 5 of 8 SLG59M1571V  Package Drawing and Dimensions 4 Lead STDFN Package 1.0 x 1.0 mm IC Net Weight: 0.0016 g 000-0059M1571-102 Page 6 of 8 SLG59M1571V  Tape and Reel Specifications Max Units Leader (min) Nominal Reel & Package # of Package Size Hub Size Length Type Pins per Reel per Box Pockets [mm] [mm] [mm] STDFN 4L Green 4 1.0 x 1.0 x 0.55 8000 8000 178 / 60 200 400 Trailer (min) Pockets Length [mm] Tape Width [mm] 200 400 8 Part Pitch [mm] 2 Carrier Tape Drawing and Dimensions Pocket BTM Pocket BTM Package Length Width Type STDFN 4L Green Pocket Depth Index Hole Pitch Pocket Pitch Index Hole Diameter Index Hole Index Hole to Tape to Pocket Tape Width Edge Center A0 B0 K0 P0 P1 D0 E F W 1.16 1.16 0.63 4 2 1.5 1.75 3.5 8 Refer to EIA-481 specification Recommended Reflow Soldering Profile Please see IPC/JEDEC J-STD-020: latest revision for reflow profile based on package volume of 0.55 mm3 (nominal). More information can be found at www.jedec.org. 000-0059M1571-102 Page 7 of 8 SLG59M1571V  Revision History Date Version 2/14/2022 1.02 Renesas rebranding Fixed typos 11/20/2017 1.01 Updated Package Marking Definition Updated Layout Suggestion 000-0059M1571-102 Change Page 8 of 8 IMPORTANT NOTICE AND DISCLAIMER RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for developers skilled in the art designing with Renesas products. You are solely responsible for (1) selecting the appropriate products for your application, (2) designing, validating, and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. Renesas grants you permission to use these resources only for development of an application that uses Renesas products. Other reproduction or use of these resources is strictly prohibited. No license is granted to any other Renesas intellectual property or to any third party intellectual property. Renesas disclaims responsibility for, and you will fully indemnify Renesas and its representatives against, any claims, damages, costs, losses, or liabilities arising out of your use of these resources. Renesas' products are provided only subject to Renesas' Terms and Conditions of Sale or other applicable terms agreed to in writing. No use of any Renesas resources expands or otherwise alters any applicable warranties or warranty disclaimers for these products. (Rev.1.0 Mar 2020) Corporate Headquarters Contact Information TOYOSU FORESIA, 3-2-24 Toyosu, Koto-ku, Tokyo 135-0061, Japan www.renesas.com For further information on a product, technology, the most up-to-date version of a document, or your nearest sales office, please visit: www.renesas.com/contact/ Trademarks Renesas and the Renesas logo are trademarks of Renesas Electronics Corporation. All trademarks and registered trademarks are the property of their respective owners. © 2021 Renesas Electronics Corporation. All rights reserved.
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