SLG59M1730C

SLG59M1730C An Ultra-small 33 mΩ, 1.0 A pFET Load Switch with Controlled Inrush Current Profile  General Description Pin Configuration Pin A1 Index Mark 1 Using a proprietary MOSFET design, the SLG59M1730C achieves a low RDSON across the entire input voltage range. Through the application of Renesas’s proprietary CuFET technology, the SLG59M1730C’s can be used in applications up to 1 A with a very-small 0.64 mm2 WLCSP form factor. ON A VIN B SLG59M1730C Operating from a 2.5 V to 5.5 V power supply, the SLG59M1730C is a self-powered, high-performance 33 mΩ, 1.0 A single-channel pFET load switch with a controlled VIN inrush current profile. The SLG59M1730C’s low supply current and controlled VIN inrush current profile makes it an ideal pFET integrated load switch in small form-factor personal health monitor and watch applications. 2 GND VOUT 4L WLCSP (Laser Marking View) Features • Integrated 1 A Continuous IDS pFET Load Switch • Low Typical RDSON: • 33 mΩ at VIN = 5.5 V • 45.1 mΩ at VIN = 3.3 V • 56.1 mΩ at VIN = 2.5 V • Input Voltage: 2.5 V to 5.5 V • Low Typical No-load Supply Current: 0.004 µA • Integrated VOUT Discharge Resistor • Operating Temperature: -40 °C to 85 °C • Low θJA, 4-pin 0.8 mm x 0.8 mm, 0.4 mm pitch 4L WLCSP Packaging • Pb-Free / Halogen-Free / RoHS compliant Block Diagram 1.0 A VIN VOUT CIN 30 µF CLOAD 30 µF In-rush Current Limiting ON ON OFF ©2022 Renesas Electronics Corporation 000-0059M1730-105 Rev 1.05 Revised February 14, 2022 SLG59M1730C  Pin Description Pin # Pin Name Type Pin Description Input A low-to-high transition on this pin initiates the operation of the SLG59M1730C. ON is an asserted HIGH, level-sensitive CMOS input with VIL < 0.3 V and VIH > 0.85 V. As the ON pin input circuit does not have an internal pull-down resistor, connect this pin to a general-purpose output (GPO) of a microcontroller, an application processor, or a system controller – do not allow this pin to be open-circuited. In order to activate the SLG59M1730C’s controlled inrush current control circuitry, ON shall be toggled HIGH only after VIN is higher than the SLG59M1730C’s VSUCC(TH) specification. A1 ON B1 VIN Input terminal connection of the p-channel MOSFET. Connect a 10 µF (or larger) MOSFET low-ESR capacitor from this pin to ground. Capacitors used at VIN should be rated at 10 V or higher. B2 VOUT Output terminal connection of the p-channel MOSFET. For optimal operation of the MOSFET SLG59M1730C controlled inrush current profile, connect a 30 µF (or smaller) capacitor from this pin to ground. Capacitors used at VOUT should be rated at 10 V or higher. A2 GND GND Ground connection. Connect this pin to system analog or power ground plane. Ordering Information Part Number Type Production Flow SLG59M1730C WLCSP 4L Industrial, -40 °C to 85 °C SLG59M1730CTR WLCSP 4L (Tape and Reel) Industrial, -40 °C to 85 °C 000-0059M1730-105 Page 2 of 18 SLG59M1730C  Absolute Maximum Ratings Parameter VIN VOUT to GND ON to GND TS Description Conditions Min. Typ. Max. Unit -- -- 6 V Load Switch Output Voltage to GND -0.3 -- VIN V ON Pin Voltage to GND -0.3 -- VIN V Load Switch Input Voltage -65 -- 140 °C ESDHBM ESD Protection Human Body Model 2000 -- -- V ESDCDM ESD Protection Charged Device Model 1000 -- -- V MSL θJA WDIS Storage Temperature Moisture Sensitivity Level Package Thermal Resistance, Junction-to-Ambient 1 0.8 x 0.8 mm 4L WLCSP; Determined using a 1 in2, 2 oz .copper pad under each VIN and VOUT terminal and FR4 pcb material. Package Power Dissipation MOSFET IDSPK Peak Current from VIN to VOUT Maximum pulsed switch current, pulse width < 1 ms, 1% duty cycle -- 110 -- °C/W -- -- 0.5 W -- -- 1.5 A Note: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Electrical Characteristics TA = -40 °C to 85 °C (unless otherwise stated) Parameter VIN IIN ION_LKG Description Conditions Load Switch Input Voltage -40 °C to 85 °C Load Switch Current (Pin B1) See Note 1 ON Pin Input Leakage 000-0059M1730-105 Min. Typ. Max. Unit 2.5 -- 5.5 V When OFF, VIN = 5.5 V, No load -- 0.110 1.270 µA When OFF, VIN = 5.0 V, No load -- 0.031 0.880 µA When OFF, VIN = 3.8 V, No load -- 0.006 0.440 µA When OFF, VIN = 3.3 V, No load -- 0.004 0.420 µA When OFF, VIN = 2.5 V, No load -- 0.003 0.390 µA When ON, ON = VIN = 5.5 V, No load -- 0.006 0.220 µA When ON, ON = VIN =5.0 V, No load -- 0.004 0.190 µA When ON, ON = VIN = 3.8V, No load -- 0.003 0.110 µA When ON, ON = VIN = 3.3 V, No load -- 0.003 0.100 µA When ON, ON = VIN = 2.5 V, No load -- 0.002 0.070 µA When ON, ON = 1.8 V, VIN = 5.5 V, No load -- 0.900 1.100 µA When ON, ON = 1.8 V, VIN = 5.0 V, No load -- 0.660 0.830 µA When ON, ON = 1.8 V, VIN = 3.8 V, No load -- 0.210 0.330 µA When ON, ON = 1.8 V, VIN = 3.3 V, No load -- 0.100 0.220 µA When ON, ON = 1.8 V, VIN = 2.5 V, No load -- 0.005 0.110 µA -- -- 0.1 µA Page 3 of 18 SLG59M1730C  Electrical Characteristics (continued) TA = -40 °C to 85 °C (unless otherwise stated) Parameter RDSON RDSON Description ON Resistance @ TA 25°C ON Resistance @ TA 85°C MOSFET IDS Current from VIN to VOUT VSUCC(TH) Conditions Min. Typ. Max. @ 5.5 V, IDS = 100 mA -- 33 41 mΩ @ 3.3 V, IDS = 100 mA -- 45.1 55 mΩ @ 2.5 V, IDS = 100 mA -- 56.1 69 mΩ @ 5.5 V, IDS = 100 mA -- 40.2 49 mΩ @ 3.3 V, IDS = 100 mA -- 54.5 66 mΩ @ 2.5 V, IDS = 100 mA -- 68.2 82 mΩ Continuous -- -- 1.0 A -- 0.9 x VIN -- V ON ≥ VON_VIH; VIN Inrush Current Start-up Control See Timing Diagram on Page 5 and Threshold Voltage Note 1 Unit Rise Time Charging Current 10% VOUT to 90% VOUT ↑; VIN = 5.0 V, CLOAD = 30 µF, See Note 1 11 16.5 25 mA Slew Rate 10% VOUT to 90% VOUT ↑; VIN = 5.0 V, CLOAD = 30 µF 0.36 0.54 0.8 V/ms 10% VOUT to 90% VOUT ↑ VIN = 5.0 V, CLOAD = 30 µF, no RLOAD 5 7.6 11 ms 10% VOUT to 90% VOUT ↑ VIN = 2.5 V, CLOAD = 30 µF, no RLOAD 2.5 3.8 5.5 ms VON_VIH to 90% VOUT ↑ VIN = 5 V, CLOAD = 30 µF, No RLOAD 6 8.6 12 ms VON_VIH to 90% VOUT ↑ VIN = 2.5 V, CLOAD = 30 µF, No RLOAD 3 4.3 6 ms OFF Delay Time VON_VIL to VOUT Fall, VIN = 5 V, RLOAD=10 Ω, no CLOAD -- 4.5 -- µs Output Load Capacitance CLOAD connected from VOUT to GND -- -- 30 µF RDIS Discharge Resistance VIN = 2.5 V to 5.5 V, VOUT = 0.4 V Input Bias 53 90 150 Ω ON_VIH Initial Turn On Voltage 0.85 -- VIN V ON_VIL Low Input Voltage on ON pin -0.3 0 0.3 V IRISE VOUT(SR) TRISE TTotal_ON TOFF_Delay CLOAD Rise Time Total Turn On Time Notes: 1. Rise of ON pin must only occur after VIN reaches VSUCC(TH) in order to have proper in-rush current limiting and start-up. 000-0059M1730-105 Page 4 of 18 SLG59M1730C  TTotal_ON, TON_Delay and Slew Rate Measurement VSUCC(TH) VIN ON* VON_VIH VON_VIL TOFF_Delay TTotal_ON 90% VOUT 90% VOUT VOUT 10% VOUT 10% VOUT TRISE TFALL * VIN ≥ 90% Nominal Voltage before Asserting ON Signal RDSON vs. Temperature and VIN 000-0059M1730-105 Page 5 of 18 SLG59M1730C  IIN when ON vs. VIN and Temperature IIN when ON = 1.8 V vs. VIN and Temperature 000-0059M1730-105 Page 6 of 18 SLG59M1730C  IIN when OFF vs. VIN and Temperature TRISE vs. CLOAD, Temperature, and VIN 000-0059M1730-105 Page 7 of 18 SLG59M1730C  TTotal_ON vs. CLOAD, Temperature, and VIN VIN vs. Max IDS, Safe Operation Area 8 7 6 5 VIN (V) 4 SOA Boundary 3 2 1 0 0 0.5 1 1.5 2 Max IDS (A) 000-0059M1730-105 Page 8 of 18 SLG59M1730C  Typical Turn-on Waveforms Figure 1. Typical Turn ON operation waveform for VIN = 2.5 V, CLOAD = 30 μF Figure 2. Typical Turn ON operation waveform for VIN = 5 V, CLOAD = 30 μF 000-0059M1730-105 Page 9 of 18 SLG59M1730C  Typical Turn-off Waveforms Figure 3. Typical Turn OFF operation waveform for VIN = 2.5 V, no CLOAD , RLOAD = 10 Ω Figure 4. Typical Turn OFF operation waveform for VIN = 2.5 V, CLOAD = 30 μF, RLOAD = 10 Ω 000-0059M1730-105 Page 10 of 18 SLG59M1730C  Figure 5. Typical Turn OFF operation waveform for VIN = 5 V, no CLOAD , RLOAD = 10 Ω Figure 6. Typical Turn OFF operation waveform for VIN = 5 V, CLOAD = 30 μF, RLOAD = 10 Ω 000-0059M1730-105 Page 11 of 18 SLG59M1730C  Applications Information SLG59M1730C Nominal Operation During VIN power-up operation, the SLG59M1730C’s internal inrush current Start-up Control circuit is activated once VIN reaches 90% of its nominal voltage (Please see VSUCC(TH) specification). Once VIN has reached this threshold (within the SLG59M1730C’s nominal input range of 2.5 V to 5.5 V), the ON pin can be toggled LOW-to-HIGH to close the switch. Nominal power-off sequence is performed in reverse: that is, the ON pin is toggled HIGH-to-LOW to open the switch before VIN is powered down/turned OFF. SLG59M1730C VIN Inrush Current Limit on Startup During startup, the current passing through the power FET is internally limited to a maximum specified by IRISE in the EC table. To prevent incomplete start-up, the SLG59M1730C shall be powered up only with a capacitive load CLOAD attached to the VOUT pin. After VOUT ramps up to its nominal voltage, a resistive load (RLOAD) can be applied to the integrated load SWITCH. Slew Rate Calculation During the rise of VOUT, the SLG59M1730C limits the output current to IRISE. With a capacitor CLOAD attached to VOUT, the equation below provides the nominal value for the slew rate: Slew Rate = IRISE CLOAD Power Dissipation Considerations The junction temperature of the SLG59M1730C depends on factors such as board layout, ambient temperature, external air flow over the package, load current, and the RDSON-generated voltage drop across each power MOSFET. While the primary contributor to the increase in the junction temperature of the SLG59M1730C is the power dissipation of its power MOSFETs, its power dissipation and the junction temperature in nominal operating mode can be calculated using the following equations: PDTOTAL = RDSON x IDS2 where: PDTOTAL = Total package power dissipation, in Watts (W) RDSON= Power MOSFET ON resistance, in Ohms (Ω) IDS = Output current, in Amps (A) and TJ= PDTOTAL x ΘJA + TA where: TJ = Die junction temperature, in Celsius degrees (°C) ΘJA = Package thermal resistance, in Celsius degrees per Watt (°C/W) – highly dependent on pcb layout TA = Ambient temperature, in Celsius degrees (°C) In nominal operating mode, the SLG59M1730C’s power dissipation can also be calculated by taking into account the voltage drop across the switch (VIN - VOUT) and the magnitude of the switch’s output current (IDS): PDTOTAL = (VIN - VOUT) x IDS or PDTOTAL = (VIN – (RLOAD x IDS)) x IDS where: PDTOTAL = Total package power dissipation, in Watts (W) VIN = Switch input Voltage, in Volts (V) RLOAD = Output Load Resistance, in Ohms (Ω) IDS = Switch output current, in Amps (A) VOUT = Switch output voltage, or RLOAD x IDS 000-0059M1730-105 Page 12 of 18 SLG59M1730C  Package Top Marking System Definition Pin 1 Identifier NN N Serial Number Line 1 Serial Number Line 2 NN -Part Serial Number Field Line 1 where each “N” character can be A-Z and 0-9 N - Part Serial Number Field Line 2 where each “N” character can be A-Z and 0-9 000-0059M1730-105 Page 13 of 18 SLG59M1730C  Package Drawing and Dimensions 4 Pin WLCSP Green Package 0.8 x 0.8 mm 000-0059M1730-105 Page 14 of 18 SLG59M1730C  SLG59M1730C 4 Pin WLCSP PCB Landing Pattern 000-0059M1730-105 Page 15 of 18 SLG59M1730C  Recommended Reflow Soldering Profile For successful reflow of the SLG59M1730C a recommended thermal profile is illustrated below: Note: This reflow profile is for classification/preconditioning and are not meant to specify board assembly profile. Actual board assembly profiles should be developed based on specific process needs and board designs and should not exceed parameters depicted on figure above. Please see more information on IPC/JEDEC J-STD-020: latest revision for reflow profile based on package volume of 0.352 mm3 (nominal). 000-0059M1730-105 Page 16 of 18 SLG59M1730C  Tape and Reel Specifications Max Units Leader (min) Nominal Reel & Package # of Package Size Hub Size Length Type Pins per Reel per Box Pockets [mm] [mm] [mm] WLCSP 4L 0.8 x 0.8 mm 0.4P Green 4 0.8 x 0.8 x 0.44 3000 3000 178/60 100 400 Trailer (min) Pockets Length [mm] Tape Width [mm] 100 400 8 Part Pitch [mm] 4 Carrier Tape Drawing and Dimensions Pocket BTM Pocket BTM Pocket Package Length Width Depth Type WLCSP 4L 0.8 x 0.8 mm 0.4P Green Index Hole Pitch Pocket Index Hole Pitch Diameter Index Hole Index Hole to Tape to Pocket Edge Center Tape Tape Width Thickness A0 B0 K0 P0 P1 D0 E F W T 0.87 0.87 0.56 4 2 1.5 1.75 3.5 8 0.2 Note: 1.Orientation in carrier: Pin1 is at upper left corner (Quadrant 1). 000-0059M1730-105 Refer to EIA-481 specification Page 17 of 18 SLG59M1730C  Revision History Date Version 2/14/2022 1.05 Renesas rebranding Fixed typos 10/24/2017 1.04 Updated IIN specifications Updated Charts 7/24/2017 1.03 Updated Tape and Reel Specification 5/5/2 017 1.02 Updated EC Table 3/28/2017 1.01 Fixed typos Updated PCB Landing Pattern 3/1/2017 1.00 Production Release 000-0059M1730-105 Change Page 18 of 18 IMPORTANT NOTICE AND DISCLAIMER RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. 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