TMPC0302H-2R2MG

厂商：
TAI-TECH(台庆)
封装：
SMD,3.5x3.2mm
描述：
功率电感 2.2µH ±20% 65mΩ IND_3.5X3.2MM_SM

数据手册：

下载TMPC0302H-2R2MG.pdf

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数据手册
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TMPC0302H-2R2MG 数据手册

TAI-TECH P1 SMD Power Inductor TMPC0302H-Serise(G) ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 14/05/19 新發行楊祥忠詹偉特徐允珮備註 TAI-TECH P2 SMD Power Inductor TMPC0302H-Serise(G) 1. Features 1. Carbonyl Powder. 2. Compact design. 3. High current，low DCR，high efficiency. Halogen Pb Halogen-free Pb-free 4. Very low acoustic noise and very low leakage flux noise. 5. High reliability. 6. 100% Lead(Pb)-Free and RoHS compliant. 2. Applications Note PC power system，incl. IMVP-6 DC/DC converter . 3. Dimensions Dr. MOS application C A D Recommend PC Board Pattern E 　1.0 H B L G Series TMPC0302H A(mm) 3.5±0.2 B(mm) C(mm) 3.2±0.2 1.8±0.2 D(mm) 0.7±0.2 E(mm) L(mm) G(mm) H(mm) 1.2±0.2 4.1 1.9 1.45 4. Part Numbering TMPC 0302 H A B C - A: Series B: Dimension C: Type D: Inductance E: Inductance Tolerance 1R0 MG D E BxC Carbonyl Powder. 1R0=1.00uH M=±20%,Y=±30%, 印字:黑色,單向印字,1.0 中間打點. . 5. Specification Part Number Inductance L0 (uH)±20% @ 0 A I rms (A) Typ. I sat (A) Typ. DCR(mΩ) Typ.@25℃ DCR(mΩ) Max.@25℃ TMPC0302H-R47MG 0.47 7.0 9.0 19.7 23 TMPC0302H-R68MG 0.68 5.5 7.0 25.5 29 TMPC0302H-1R0MG 1.00 4.0 5.0 32 38 TMPC0302H-1R5MG 1.50 3.8 4.0 42 50 TMPC0302H-2R2MG 2.20 3.5 3.7 65 75 TMPC0302H-3R3MG 3.30 3.0 3.5 125 145 TMPC0302H-4R7MG 4.70 2.6 3.0 172 200 TMPC0302H-5R6MG 5.60 2.2 2.6 205 238 TMPC0302H-6R8MG 6.80 1.9 2.2 260 300 TMPC0302H-8R2MG 8.20 1.6 1.9 340 390 TMPC0302H-100MG 10.0 1.4 1.6 366 422 Note: 1. Test frequency : L : 100KHz /1.0V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument : L/Q: HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER. 4. Heat Rated Current (Irms) will cause the coil temperature rise approximately Δt of 40℃ (keep 1min.). 5. Saturation Current (Isat) will cause L0 to drop 30% typical. (keep quickly). 6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. TAI-TECH P3 6. Material List NO Items 1 Core 2 Wire 3 Solder Plating Materials Carbonyl Powder. Polyester Wire or equivalent. 100% Pb free solder 7. Reliability and Test Condition Item Performance Operating temperature -40~+125℃ Storage temperature and Humidity range -40~+125℃(For products in unopened tape package, less than 40℃) 50~60%RH (Product without taping) Test Condition Electrical Performance Test Inductance Refer to standard electrical characteristics list. DCR HP4284A,CH11025,CH3302,CH1320,CH1320S LCR Meter. CH16502,Agilent33420A Micro-Ohm Meter. Saturation Current (Isat) △L30% typical. Saturation DC Current (Isat) will cause L0 to drop △L(%)(keep quickly). Heat Rated Current (Irms) Approximately △T≦40℃ Heat Rated Current (Irms) will cause the coil temperature rise △T(℃) without core loss. 1.Applied the allowed DC current(keep 1 min.). 2.Temperature measured by digital surface thermometer Reliability Test Temperature:125±2℃. Duration:500±8hrs. Measured at room temperature after placing for 2 to 3hrs. (MIL-STD-202 Method 108) Temperature:-40±2℃. Duration:500±8hrs. Measured at room temperature after placing for 2 to 3hrs. (JESD22-A119) Humidity:90~95%. Temperature:40±2℃. Duration:500±8hrs. Measured at room temperature after placing for 2 to 3hrs (AEC-Q200-REV C) High Temperature Exposure Test Low Temperature Life Test Biased Humidity Test Thermal shock test Electric specifications should be satisfied Condition for 1 cycle Step1:-40+0 / -2℃ 15±1 min. Step2:Room temperature within ≦0.2 min. Step3:+125+2 / -0℃ 15±1min. Number of cycles:300 Measured at room temperature after placing for 2 to 3 hrs. (AEC-Q200) Vibration test Frequency: 10-2000-10Hz for 20 min. Amplitude: Parts mounted within 2" from any secure point. Directions and times: X, Y, Z directions for 20 min. This cycle shall be performed 12 times in each of three mutually perpendicular directions (Total 12hours). (MIL-STD-202 Method 204 D Test condition B) Reflow test Pre-heat：150±5℃ Duration：5 minutes Temperature：260±5℃，20~40 seconds (IPC/JEDEC J-STD-020C) Solder test Terminals should be covered by over 95% solder on visual inspection After dip into flux，dip into solder 235±5℃，4±1seconds Flux 、solder for lead free (ANSI /J-STD-002C Method B) TAI-TECH P4 8. Soldering and Mounting (1) Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. TAIPAQ terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. (2) Solder re-flow: Recommended temperature profiles for re-flow soldering in Figure 1. (3) Soldering Iron: Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150℃ ‧355℃ tip temperature (max) ‧Never contact the ceramic with the iron tip ‧1.0mm tip diameter (max) Iron Soldering Reflow Soldering SOLDERING 20~40s TEMPERATURE(°C) TP(260° C / 40s max.) 217 60~150s 200 150 PRE-HEATING NATURAL COOLING 60~180s SOLDERING within 4~5s TEMPERATURE(°C) PRE-HEATING ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧Limit soldering time to 4~5sec. 350 150 Gradual cooling Over 60s 480s max. NATURAL COOLING 25 TIME( sec.) Reflow times: 3 times max. Fig.1 TIME(sec.) Iron Soldering times: 1 times max. Fig.2 TAI-TECH P5 9. Packaging Information (1) Reel Dimension COVER TAPE Type A(mm) B(mm) C(mm) D(mm) 13”x12mm 12.0±0.5 100±2 13.5±0.5 330 C B D 2.0±0.5 A EMBOSSED CARRIER (2) Tape Dimension Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) W(mm) F(mm) TMPC 0302 3.9±0.1 3.6±0.1 2.3±0.1 8.0±0.1 12±0.3 5.5±0.1 t(mm) 0.35±0.05 (3) Packaging Quantity TMPC 0302 Chip / Reel 3000 Inner box 6000 Carton 24000 (4) Tearing Off Force F Top cover tape The force for tearing off cover tape is 10 to 130 grams in the arrow direction under the following conditions(referenced ANSI/EIA-481-C-2003 of 4.11 stadnard). 165° to180° Base tape Room Temp. (℃) Room Humidity (%) Room atm (hPa) Tearing Speed mm/min 5~35 45~85 860~1060 300 Application Notice ‧Storage Conditions To maintain the solderability of terminal electrodes: 1. TAIPAQ products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: Less than 40℃ and 60% RH. 3. Recommended products should be used within 12 months form the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air. ‧Transportation 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. TAI-TECH P6 10. Typical Performance Curves 1.6 29.6 0.6 30 1.2 22.2 0.4 20 0.8 14.8 0.2 10 0.4 7.4 0.32 20 0.16 10 0 7.2 0 9 1.4 2.4 72 1.6 48 24 0.5 3 0.8 0 0 0 3.2 TMPC0302H-2R2 96 6 4 1.4 10 6.4 20 4.8 15 3.2 10 1.6 0 1.2 1.8 2.4 30 0 0 0.7 2.1 2.8 3.5 TMPC0302H-6R8 6 30 6 30 4 20 4 20 5 2 10 2 10 0 0 0 0 3 0 0.52 1.04 1.56 2.08 2.6 TMPC0302H-100 24 12 12 4.8 16 8 8 2.4 8 4 4 0 0 1.9 20 0 0 0.32 0.64 0.96 DC CURRENT(A) 1.28 1.6 50 0 0 0.44 0.88 1.32 DC CURRENT(A) 7.2 1.52 1.4 40 16 1.14 1.2 8 16 0.76 60 40 32 DC CURRENT(A) 2.4 8 9.6 0.38 90 DC CURRENT(A) 20 0 3.6 0 40 0 150 120 7 DC CURRENT(A) TMPC0302H-8R2 4.5 10 TEMP. RISE(oC) INDUCTANCE (uH) INDUCTANCE (uH) 5.6 TMPC0302H-5R6 DC CURRENT(A) 12 3.6 50 TEMP. RISE(oC) INDUCTANCE (uH) INDUCTANCE (uH) 25 0.6 4.2 2.7 4.8 DC CURRENT(A) TMPC0302H-4R7 0 2.8 1.8 TMPC0302H-3R3 6 120 0 0 DC CURRENT(A) 8 0.9 DC CURRENT(A) 3.2 1 2.4 0 0 7 12 9 1.6 5.6 4 1.5 0.8 4.2 15 TEMP. RISE(oC) INDUCTANCE (uH) INDUCTANCE (uH) 2 0 2.8 DC CURRENT(A) TMPC0302H-1R5 2.5 0 0 0 TEMP. RISE(oC) INDUCTANCE (uH) 5.4 TEMP. RISE(oC) INDUCTANCE (uH) 3.6 DC CURRENT(A) TEMP. RISE(oC) 1.8 TEMP. RISE(oC) 30 1.76 2.2 TEMP. RISE(oC) 0.48 37 TEMP. RISE(oC) 40 40 TEMP. RISE(oC) INDUCTANCE (uH) INDUCTANCE (uH) 0.8 0.64 0 TMPC0302H-1R0 2 1 0 TMPC0302H-R68 50 50 TEMP. RISE(oC) INDUCTANCE (uH) TMPC0302H-R47 0.8

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TMPC0302H-2R2MG

1. 物料型号：文档描述了TAI-TECH SMD功率电感器的型号为TMPC0302H系列(G)。

2. 器件简介： - 采用碳粉材料。 - 紧凑设计。 - 高电流、低直流电阻(DCR)、高效率。 - 极低的声学噪声和极低的漏磁噪声。 - 无卤素、无铅，符合RoHS标准。 - 高可靠性。

3. 引脚分配：文档提供了电感器的尺寸和推荐PCB布线图。

4. 参数特性： - 列出了不同型号的电感器的电感值、典型额定电流、饱和电流、25°C时的典型直流电阻和最大直流电阻。

5. 功能详解：文档详细描述了电感器的特点，如使用环境、测试频率、测试数据的环境温度参考、测试仪器等。

6. 应用信息：适用于PC电源系统，包括IMVP-6规范的DC/DC转换器和Dr. MOS应用。

7. 封装信息：提供了电感器的尺寸数据和封装类型。

8. 可靠性和测试条件：包括工作温度、存储温度和湿度范围、电气性能测试、可靠性测试等。

9. 焊接和安装：推荐使用温和活化的松香助焊剂，建议使用再流焊接系统，如果必须手工焊接，推荐使用热风焊接工具。

10. 包装信息：提供了卷轴尺寸、胶带尺寸、包装数量和撕离力等信息。