MBRS15H45CT MNG

MBRS15H45CT Taiwan Semiconductor 15A, 45V Schottky Barrier Surface Mount Rectifier FEATURES ● ● ● ● ● ● ● KEY PARAMETERS Low power loss, high efficiency Ideal for automated placement Guard ring for overvoltage protection High surge current capability Moisture sensitivity level: level 1, per J-STD-020 RoHS Compliant Halogen-free according to IEC 61249-2-21 APPLICATIONS PARAMETER VALUE UNIT IF 15 A VRRM 45 V IFSM 150 A TJ MAX 175 °C 2 Package TO-263AB (D PAK) Configuration Dual dies ● Switching mode power supply (SMPS) ● Adapters ● DC to DC converters MECHANICAL DATA ● ● ● ● ● ● 2 Case: TO-263AB (D PAK) Molding compound meets UL 94V-0 flammability rating Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 2 whisker test Polarity: As marked Weight: 1.35g (approximately) 2 TO-263AB (D PAK) ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL Marking code on the device MBRS15H45CT UNIT MBRS15H45CT Repetitive peak reverse voltage VRRM 45 V Reverse voltage, total rms value VR(RMS) 31 V IF 15 A IFSM 150 A Forward current Surge peak forward current, 8.3ms single half sine wave superimposed on rated load Peak repetitive forward current (Rated VR, Square wave, 20KHz) (1) Peak repetitive reverse surge current IFRM 15 A IRRM 1 A Critical rate of rise of off-state voltage dv/dt 10,000 V/µs Junction temperature TJ -55 to +175 °C Storage temperature TSTG -55 to +175 °C Notes: 1. tp = 2.0μs, 1.0KHz 1 Version: H2103 MBRS15H45CT Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER SYMBOL TYP UNIT RӨJC 2 °C/W Junction-to-case thermal resistance ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) PARAMETER CONDITIONS SYMBOL IF = 7.5A, TJ = 25°C Forward voltage per diode IF = 15.0A, TJ = 25°C (1) IF = 7.5A, TJ = 125°C VF IF = 15.0A, TJ = 125°C Reverse current @ rated VR per diode (2) TJ = 25°C IR TJ = 125°C TYP MAX UNIT 0.64 0.68 V 0.76 0.80 V 0.55 0.60 V 0.67 0.70 V - 30 µA - 10 mA Notes: 1. Pulse test with PW = 0.3ms 2. Pulse test with PW = 30ms ORDERING INFORMATION ORDERING CODE MBRS15H45CT PACKAGE 2 TO-263AB (D PAK) 2 PACKING 800 / Tape & Reel Version: H2103 MBRS15H45CT Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.1 Forward Current Derating Curve Fig.2 Typical Junction Capacitance 10000 15 CAPACITANCE (pF) 10 5 0 1000 100 f=1.0MHz Vsig=50mVp-p 10 25 50 75 100 125 150 175 0.1 1 CASE TEMPERATURE (°C) INSTANTANEOUS FORWARD CURRENT (A) TJ=125°C 10 1 0.1 TJ=25°C 0.01 20 30 40 50 60 70 80 90 100 100 10 10 1 UF1DLW TJ=125°C TJ=125°C 0.1 TJ=25°C TJ=25°C 1 0.01 0.1 0.001 0.2 Pulse width 300μs 1% duty cycle Pulse width 0.3 0.4 0.5 0.3 0.4 0.5 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) 0.6 0.7 0.8 0.9 1.0 0.6 0.7 0.8 0.9 1.1 1 1.1 FORWARD VOLTAGE (V) Fig.5 Maximum Non-Repetitive Forward Surge Current 180 PEAK FORWARD SURGE CURRENT (A) INSTANTANEOUS REVERSE CURRENT (μA) Fig.4 Typical Forward Characteristics 1000 10 100 REVERSE VOLTAGE (V) Fig.3 Typical Reverse Characteristics 100 10 (A) AVERAGE FORWARD CURRENT (A) 20 8.3ms single half sine wave 150 120 90 60 30 0 1 10 100 NUMBER OF CYCLES AT 60 Hz 3 Version: H2103 1.2 MBRS15H45CT Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.6 Typical Transient Thermal Impedance TRANSIENT THERMAL IMPEDANCE (°C/W) 100 10 1 0.1 0.01 0.1 1 10 PULSE DURATION (s) 4 Version: H2103 MBRS15H45CT Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS 2 TO-263AB (D PAK) SUGGESTED PAD LAYOUT MARKING DIAGRAM 5 P/N = Marking Code G = Green Compound YWW = Date Code F = Factory Code Version: H2103 MBRS15H45CT Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 6 Version: H2103