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RS1BL MHG

RS1BL MHG

  • 厂商:

    TAIWANSEMICONDUCTOR(台半)

  • 封装:

    Sub-SMA

  • 描述:

    DIODE GEN PURP 100V 800MA SUBSMA

  • 详情介绍
  • 数据手册
  • 价格&库存
RS1BL MHG 数据手册
RS1AL – RS1ML Taiwan Semiconductor 0.8A, 50V - 1000V Fast Recovery Surface Mount Rectifier FEATURES ● ● ● ● ● ● KEY PARAMETERS Glass passivated chip junction Ideal for automated placement Fast switching for high efficiency Moisture sensitivity level: level 1, per J-STD-020 RoHS Compliant Halogen-free according to IEC 61249-2-21 APPLICATIONS ● DC to DC converter ● Switching mode converters and inverters ● General purpose PARAMETER VALUE UNIT IF 0.8 A VRRM 50 - 1000 V IFSM 30 A TJ MAX 150 °C Package Sub SMA Configuration Single die MECHANICAL DATA ● ● ● ● ● ● Case: Sub SMA Molding compound meets UL 94V-0 flammability rating Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.019g (approximately) Sub SMA ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL Marking code on the device RS 1AL RS 1BL RS 1DL RS 1GL RS 1JL RS 1KL RS 1ML RAL RBL RDL RGL RJL RKL RML UNIT Repetitive peak reverse voltage VRRM 50 100 200 400 600 800 1000 V Reverse voltage, total rms value VR(RMS) 35 70 140 280 420 560 700 V Forward current Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load Junction temperature IF 0.8 A IFSM 30 A TJ - 55 to +150 °C Storage temperature TSTG - 55 to +150 °C 1 Version: N2103 RS1AL – RS1ML Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER SYMBOL TYP UNIT Junction-to-lead thermal resistance RӨJL 32 °C/W Junction-to-ambient thermal resistance RӨJA 105 °C/W ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) PARAMETER Forward voltage CONDITIONS (1) Reverse current @ rated VR IF = 0.8A, TJ = 25°C TJ = 25°C (2) Reverse recovery time 1MHz, VR = 4.0V RS1AL RS1BL RS1DL RS1GL RS1JL TYP MAX UNIT VF - 1.3 V - 5 µA - 50 µA 10 - pF - 150 ns - 250 ns - 500 ns IR TJ = 125°C Junction capacitance SYMBOL IF = 0.5A, IR = 1.0A, Irr = 0.25A RS1KL RS1ML CJ trr Notes: 1. Pulse test with PW = 0.3ms 2. Pulse test with PW = 30ms ORDERING INFORMATION ORDERING CODE(1) PACKAGE PACKING RS1xL Sub SMA 10,000 / Tape & Reel Notes: 1. “x” defines voltage from 50V(RS1AL) to 1000V(RS1ML) 2 Version: N2103 RS1AL – RS1ML Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.1 Forward Current Derating Curve Fig.2 Typical Junction Capacitance 100 0.8 CAPACITANCE (pF) 0.6 0.4 10 0.2 0.0 25 50 75 100 125 f=1.0MHz Vsig=50mVp-p 1 150 1 10 LEAD TEMPERATURE (°C) REVERSE VOLTAGE (V) Fig.4 Typical Forward Characteristics INSTANTANEOUS FORWARD CURRENT (A) 10 TJ=125°C TJ=100°C 0.1 0.01 TJ=25°C 0.001 10 20 30 40 50 60 70 80 90 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) 10 10 UF1DLW 1 TJ=125°C TJ=125°C 1 0.1 TJ=25°C TJ=25°C 0.01 0.1 0.001 0.4 0.6 0.8 1.0 0.3 0.4 0.5 0.6 Pulse width 300μs 1% duty cycle Pulse width 1.2 0.7 1.4 0.8 FORWARD VOLTAGE (V) 1.6 0.9 1.8 1 1.1 Fig.5 Maximum Non-Repetitive Forward Surge Current 40 PEAK FORWARD SURGE CURRENT (A) INSTANTANEOUS REVERSE CURRENT (uA) Fig.3 Typical Reverse Characteristics 1 100 (A) AVERAGE FORWARD CURRENT (A) 1.0 8.3ms single half sine wave 30 20 10 0 1 10 100 NUMBER OF CYCLES AT 60 Hz 3 Version: N2103 1.2 RS1AL – RS1ML Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.6 Reverse Recovery Time Characteristic and Test Circuit Diagram 4 Version: N2103 RS1AL – RS1ML Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS Sub SMA SUGGESTED PAD LAYOUT MARKING DIAGRAM 5 P/N = Marking Code G = Green Compound YW = Date Code F = Factory Code Version: N2103 RS1AL – RS1ML Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 6 Version: N2103
RS1BL MHG
物料型号:RS1AL-RS1ML 器件简介:0.8A, 50V - 1000V快恢复表面贴装整流器,具有玻璃钝化芯片结构,适合自动化放置,快速开关以提高效率。 引脚分配:文档中未明确列出引脚分配,但通常整流器有两个引脚,阳极和阴极。 参数特性:包括重复峰值反向电压(VRRM)从50V到1000V,正向电流(IF)为0.8A,峰值正向浪涌电流(IFSM)为30A,最大结温(TJMAX)为150°C。 功能详解:文档提供了热性能参数、电气规格、特性曲线和测试电路图。 应用信息:适用于DC-DC转换器、开关模式转换器和逆变器、通用用途。 封装信息:封装类型为Sub SMA,符合UL 94V-0可燃性等级,终端为镀锡的引线,符合J-STD-002的可焊性,符合JESD 201的2级晶须测试。
RS1BL MHG 价格&库存

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