RSFGL MTG

RSFAL – RSFML Taiwan Semiconductor 0.5A, 50V - 1000V Fast Recovery Surface Mount Rectifier FEATURES ● ● ● ● ● ● ● KEY PARAMETERS Glass passivated chip junction Ideal for automated placement High temperature metallurgically bonded construction Fast switching for high efficiency Moisture sensitivity level: level 1, per J-STD-020 RoHS Compliant Halogen-free according to IEC 61249-2-21 APPLICATIONS PARAMETER VALUE UNIT IF 0.5 A VRRM 50 - 1000 V IFSM 10 A TJ MAX 150 °C Package Sub SMA Configuration Single die ● DC to DC converter ● Switching mode converters and inverters ● General purpose MECHANICAL DATA ● ● ● ● ● ● Case: Sub SMA Molding compound meets UL 94V-0 flammability rating Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.019g (approximately) Sub SMA ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL Marking code on the device RSF AL RSF BL RSF DL RSF GL RSF JL RSF KL RSF ML FAL FBL FDL FGL FJL FKL FML UNIT Repetitive peak reverse voltage VRRM 50 100 200 400 600 800 1000 V Reverse voltage, total rms value VR(RMS) 35 70 140 280 420 560 700 V Forward current Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load Junction temperature IF 0.5 A IFSM 10 A TJ - 55 to +150 °C Storage temperature TSTG - 55 to +150 °C 1 Version: M2103 RSFAL – RSFML Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER SYMBOL TYP UNIT Junction-to-case thermal resistance RӨJC 32 °C/W Junction-to-ambient thermal resistance RӨJA 150 °C/W ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) PARAMETER Forward voltage CONDITIONS (1) Reverse current @ rated VR IF = 0.5A, TJ = 25°C TJ = 25°C (2) Reverse recovery time 1MHz, VR = 4.0V RSFAL RSFBL RSFDL RSFGL RSFJL TYP MAX UNIT VF - 1.3 V - 5 µA - 50 µA 4 - pF - 150 ns - 250 ns - 500 ns IR TJ = 125°C Junction capacitance SYMBOL IF = 0.5A, IR = 1.0A, Irr = 0.25A RSFKL RSFML CJ trr Notes: 1. Pulse test with PW = 0.3ms 2. Pulse test with PW = 30ms ORDERING INFORMATION ORDERING CODE(1) PACKAGE PACKING RSFxL Sub SMA 10,000 / Tape & Reel Notes: 1. “x” defines voltage from 50V(RSFAL) to 1000V(RSFML) 2 Version: M2103 RSFAL – RSFML Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.1 Forward Current Derating Curve Fig.2 Typical Junction Capacitance 10 CAPACITANCE (pF) 0.5 0.0 25 50 75 100 125 f=1.0MHz Vsig=50mVp-p 1 150 1 10 LEAD TEMPERATURE (°C) REVERSE VOLTAGE (V) Fig.4 Typical Forward Characteristics INSTANTANEOUS FORWARD CURRENT (A) 10 1 TJ=100°C 0.1 TJ=25°C 0.01 20 30 40 50 60 70 80 90 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) 10 10 UF1DLW 1 TJ=125°C 1 0.1 TJ=25°C 0.01 0.1 0.001 0.6 0.3 Pulse width 300μs 1% duty cycle Pulse width 0.8 0.4 1.0 0.5 1.2 1.4 0.6 0.7 0.8 FORWARD VOLTAGE (V) 1.6 0.9 1.8 1 1.1 Fig.5 Maximum Non-Repetitive Forward Surge Current 12 PEAK FORWARD SURGE CURRENT (A) INSTANTANEOUS REVERSE CURRENT (uA) Fig.3 Typical Reverse Characteristics 10 100 (A) AVERAGE FORWARD CURRENT (A) 1.0 8.3ms single half sine wave 10 8 6 4 2 0 1 10 100 NUMBER OF CYCLES AT 60 Hz 3 Version: M2103 1.2 RSFAL – RSFML Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.6 Reverse Recovery Time Characteristic and Test Circuit Diagram 4 Version: M2103 RSFAL – RSFML Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS Sub SMA SUGGESTED PAD LAYOUT MARKING DIAGRAM 5 P/N = Marking Code G = Green Compound YW = Date Code F = Factory Code Version: M2103 RSFAL – RSFML Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 6 Version: M2103