SS24MHRSG

SS22MH – SS24MH Taiwan Semiconductor 2A, 20V - 40V Schottky Barrier Surface Mount Rectifier FEATURES ● ● ● ● ● ● ● KEY PARAMETERS AEC-Q101 qualified Very low profile - typical height of 0.68mm Low power loss, high efficiency Ideal for automated placement Moisture sensitivity level: level 1, per J-STD-020 RoHS Compliant Halogen-free according to IEC 61249-2-21 APPLICATIONS ● ● ● ● ● PARAMETER VALUE UNIT IF 2 A VRRM 20 - 40 V IFSM 25 A TJ MAX 150 °C Package Micro SMA Configuration Single die Low voltage, high freq. inverter DC/DC converter Freewheeling diodes Reverse battery protection Car lighting MECHANICAL DATA ● ● ● ● ● ● Case: Micro SMA Molding compound meets UL 94V-0 flammability rating Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.006g (approximately) Micro SMA ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL Marking code on the device SS22MH SS23MH SS24MH D E F UNIT Repetitive peak reverse voltage VRRM 20 30 40 V Reverse voltage, total rms value VR(RMS) 14 21 28 V Forward current Surge peak forward current 8.3ms single half sine wave superimposed on rated load Junction temperature IF 2 A IFSM 25 A TJ -55 to +150 °C Storage temperature TSTG -55 to +150 °C 1 Version: A2103 SS22MH – SS24MH Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER SYMBOL TYP UNIT Junction-to-lead thermal resistance RӨJL 15 °C/W Junction-to-ambient thermal resistance RӨJA 105 °C/W Junction-to-case thermal resistance RӨJC 20 °C/W ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) PARAMETER Forward voltage CONDITIONS IF = 2A, TJ = 25°C (1) Reverse current @ rated VR IF = 2A, TJ = 125°C (2) Junction capacitance TJ = 25°C SYMBOL VF IR TJ = 125°C 1MHz, VR = 4.0V CJ TYP MAX UNIT - 0.60 V - 0.55 V - 150 µA - 15 mA 35 - pF Notes: 1. Pulse test with PW = 0.3ms 2. Pulse test with PW = 30ms ORDERING INFORMATION ORDERING CODE(1) PACKAGE PACKING SS2xMH Micro SMA 12,000 / Tape & Reel Notes: 1. “x” defines voltage from 20V(SS22MH) to 40V(SS24MH) 2 Version: A2103 SS22MH – SS24MH Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.1 Forward Current Derating Curve Fig.2 Typical Junction Capacitance 1000 CAPACITANCE (pF) 2 1 0 100 10 f=1.0MHz Vsig=50mVp-p 1 25 50 75 100 125 150 0.1 1 LEAD TEMPERATURE (°C) INSTANTANEOUS FORWARD CURRENT (A) TJ=150°C 1 TJ=125°C SS22MH SS23MH-SS24MH 0.01 0.001 TJ=25°C 0.0001 10 20 30 40 50 60 70 80 90 100 10 10 UF1DLW TJ=150°C 1 TJ=125°C TJ=125°C TJ=25°C 10.1 TJ=25°C 0.01 Pulse width 300μs 1% duty cycle Pulse width 0.1 0.001 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) 1.1 FORWARD VOLTAGE (V) Fig.5 Maximum Non-Repetitive Forward Surge Current 30 PEAK FORWARD SURGE CURRENT (A) INSTANTANEOUS REVERSE CURRENT (mA) Fig.4 Typical Forward Characteristics 100 0.1 100 REVERSE VOLTAGE (V) Fig.3 Typical Reverse Characteristics 10 10 (A) AVERAGE FORWARD CURRENT (A) 3 8.3ms single half sine wave 25 20 15 10 5 0 1 10 100 NUMBER OF CYCLES AT 60 Hz 3 Version: A2103 1.2 SS22MH – SS24MH Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.6 Typical Transient Thermal Impedance TRANSIENT THERMAL IMPEDANCE (°C/W) 1000 100 10 1 0.1 1 10 100 PULSE DURATION (s) 4 Version: A2103 SS22MH – SS24MH Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS Micro SMA SUGGESTED PAD LAYOUT MARKING DIAGRAM P/N YW 5 = Marking Code = Data Code Version: A2103 SS22MH – SS24MH Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 6 Version: A2103