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S1ML RVG

S1ML RVG

  • 厂商:

    TAIWANSEMICONDUCTOR(台半)

  • 封装:

    Sub-SMA

  • 描述:

    DIODE GEN PURP 1000V 1A SUB SMA

  • 详情介绍
  • 数据手册
  • 价格&库存
S1ML RVG 数据手册
S1AL – S1ML Taiwan Semiconductor 1A, 50V - 1000V Standard Surface Mount Rectifier FEATURES ● ● ● ● ● ● ● KEY PARAMETERS Glass passivated chip junction Ideal for automated placement Low profile package Low power loss, high efficiency Moisture sensitivity level: level 1, per J-STD-020 RoHS Compliant Halogen-free according to IEC 61249-2-21 APPLICATIONS PARAMETER VALUE UNIT IF 1 A VRRM 50 - 1000 V IFSM 30 A TJ MAX 175 °C Package Sub SMA Configuration Single die ● DC to DC converter ● Switching mode converters and inverters ● General purpose MECHANICAL DATA ● ● ● ● ● ● Case: Sub SMA Molding compound meets UL 94V-0 flammability rating Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.019g (approximately) Sub SMA ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL S1AL S1BL S1DL S1GL S1JL S1KL S1ML UNIT Marking code on the device 1AL 1BL 1DL 1GL 1JL 1KL 1ML Repetitive peak reverse voltage VRRM 50 100 200 400 600 800 1000 V Reverse voltage, total rms value VR(RMS) 35 70 140 280 420 560 700 V Forward current Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load Junction temperature IF 1 A IFSM 30 A TJ - 55 to +175 °C Storage temperature TSTG - 55 to +175 °C 1 Version: Q2108 S1AL – S1ML Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER SYMBOL TYP UNIT Junction-to-lead thermal resistance (1) RӨJL 25 °C/W Junction-to-lead thermal resistance (2) RӨJL 30 °C/W RӨJA 85 °C/W Junction-to-ambient thermal resistance Notes: 1. Part number: S1AL - S1JL 2. Part number: S1KL - S1ML ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) PARAMETER Forward voltage CONDITIONS (1) Reverse current @ rated VR IF = 1A, TJ = 25°C (2) Junction capacitance Reverse recovery time TJ = 25°C SYMBOL TYP MAX UNIT VF - 1.1 V - 5 µA - 50 µA CJ 9 - pF trr 1800 - ns IR TJ = 125°C 1MHz, VR = 4.0V IF = 0.5A, IR = 1.0A, Irr = 0.25A Notes: 1. Pulse test with PW = 0.3ms 2. Pulse test with PW = 30ms ORDERING INFORMATION ORDERING CODE(1) PACKAGE PACKING S1xL Sub SMA 10,000 / Tape & Reel Notes: 1. “x” defines voltage from 50V(S1AL) to 1000V(S1ML) 2 Version: Q2108 S1AL – S1ML Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.1 Forward Current Derating Curve Fig.2 Typical Junction Capacitance 100 CAPACITANCE (pF) 1 0 10 1 f=1.0MHz Vsig=50mVp-p 0.1 25 55 85 115 145 175 0.1 1 LEAD TEMPERATURE (°C) REVERSE VOLTAGE (V) Fig.4 Typical Forward Characteristics INSTANTANEOUS FORWARD CURRENT (A) 10 TJ=125°C 0.1 TJ=75°C TJ=25°C 0.01 10 20 30 40 50 60 70 80 90 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) 10 10 UF1DLW 1 TJ=125°C 1 0.1 TJ=25°C 0.01 0.1 0.001 0.6 0.7 0.8 0.9 0.3 0.4 0.5 Pulse width 300μs 1% duty cycle Pulse width 1.0 1.1 1.2 1.3 1.4 0.6 0.7 0.8 0.9 FORWARD VOLTAGE (V) 1.5 1 1.1 Fig.5 Maximum Non-Repetitive Forward Surge Current 40 PEAK FORWARD SURGE CURRENT (A) INSTANTANEOUS REVERSE CURRENT (uA) Fig.3 Typical Reverse Characteristics 1 10 (A) AVERAGE FORWARD CURRENT (A) 2 8.3ms single half sine wave 30 20 10 0 1 10 100 NUMBER OF CYCLES AT 60 Hz 3 Version: Q2108 1.2 S1AL – S1ML Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS Sub SMA SUGGESTED PAD LAYOUT MARKING DIAGRAM 4 P/N = Marking Code G = Green Compound YW = Date Code F = Factory Code Version: Q2108 S1AL – S1ML Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 5 Version: Q2108
S1ML RVG
物料型号:S1AL – S1ML,由台湾半导体公司生产。

器件简介:这是一系列标准表面安装整流器,具有以下特点: - 玻璃钝化芯片结 - 适合自动化放置 - 低轮廓封装 - 低功耗,高效率 - 符合RoHS标准 - 根据IEC 61249-2-21,无卤素

引脚分配:文档中没有明确指出具体的引脚分配,但通常整流器会有阳极和阴极两个引脚。

参数特性: - 正向电流(IF):1A - 反向峰值重复电压(VRRM):50V至1000V - 正向峰值浪涌电流(IFSM):30A - 最大结温(TJ MAX):175°C - 封装类型:Sub SMA - 配置:单芯片

功能详解:文档中没有提供详细的功能解释,但整流器通常用于将交流电转换为直流电。

应用信息:适用于以下应用: - DC到DC转换器 - 开关模式转换器和逆变器 - 通用

封装信息:Sub SMA封装,符合UL 94V-0可燃性等级,引脚为镀锡,可焊接。
S1ML RVG 价格&库存

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