HS1AL – HS1ML
Taiwan Semiconductor
1A, 50V - 1000V High Efficient Surface Mount Rectifier
FEATURES
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KEY PARAMETERS
Glass passivated chip junction
Ideal for automated placement
Low profile Package
Low power loss, high efficiency
Moisture sensitivity level: level 1, per J-STD-020
RoHS Compliant
Halogen-free according to IEC 61249-2-21
PARAMETER
VALUE
UNIT
IF
1
A
VRRM
50 - 1000
V
IFSM
30
A
TJ MAX
150
°C
APPLICATIONS
Package
Sub SMA
Configuration
Single die
● DC to DC converter
● Switching mode converters and inverters
● Freewheeling application
MECHANICAL DATA
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Case: Sub SMA
Molding compound meets UL 94V-0 flammability rating
Terminal: Matte tin plated leads, solderable per J-STD-002
Meet JESD 201 class 1A whisker test
Polarity: Indicated by cathode band
Weight: 0.019g (approximately)
Sub SMA
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
PARAMETER
SYMBOL
Marking code on the device
HS
1AL
HS
1BL
HS
1DL
HS
1FL
HS
1GL
HS
1JL
HS
1KL
HS
UNIT
1ML
HAL
HBL
HDL
HFL
HGL
HJL
HKL
HML
Repetitive peak reverse voltage
VRRM
50
100
200
300
400
600
800
1000
V
Reverse voltage, total rms value
VR(RMS)
35
70
140
210
280
420
560
700
V
Forward current
Peak forward surge current,
8.3ms single half sine-wave
superimposed on rated load
Junction temperature
IF
1
A
IFSM
30
A
TJ
- 55 to +150
°C
Storage temperature
TSTG
- 55 to +150
°C
1
Version: C2103
HS1AL – HS1ML
Taiwan Semiconductor
THERMAL PERFORMANCE
PARAMETER
Junction-to-ambient thermal resistance
SYMBOL
TYP
UNIT
RӨJA
100
°C/W
ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted)
PARAMETER
Forward voltage
CONDITIONS
HS1AL
HS1BL
HS1DL
HS1FL
HS1GL
HS1JL
HS1KL
HS1ML
(1)
Reverse current @ rated VR
TJ = 25°C
(2)
Junction capacitance
Reverse recovery time
IF = 1A, TJ = 25°C
VF
IR
TJ = 125°C
HS1AL
HS1BL
HS1DL
HS1FL
HS1GL
HS1JL
HS1KL
HS1ML
HS1AL
HS1BL
HS1DL
HS1FL
HS1GL
HS1JL
HS1KL
HS1ML
SYMBOL
1MHz, VR = 4.0V
IF = 0.5A, IR = 1.0A,
Irr = 0.25A
TYP
MAX
UNIT
-
0.95
V
-
1.30
V
-
1.70
V
-
5
µA
-
150
µA
20
-
pF
15
-
pF
-
50
ns
-
75
ns
CJ
trr
Notes:
1. Pulse test with PW = 0.3ms
2. Pulse test with PW = 30ms
ORDERING INFORMATION
ORDERING CODE(1)
PACKAGE
PACKING
HS1xL
Sub SMA
10,000 / Tape & Reel
Notes:
1. “x” defines voltage from 50V(HS1AL) to 1000V(HS1ML)
2
Version: C2103
HS1AL – HS1ML
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.1 Forward Current Derating Curve
Fig.2 Typical Junction Capacitance
50
40
CAPACITANCE (pF)
1
HS1AL-HS1GL
30
HS1JL - HS1ML
20
10
0
25
50
75
100
125
f=1.0MHz
Vsig=50mVp-p
0
150
0.1
1
LEAD TEMPERATURE (°C)
INSTANTANEOUS FORWARD CURRENT (A)
10
TJ=125°C
0.1
TJ=25°C
0.001
10
20
30
40
50
60
70
80
90
100
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
10 10
UF1DLW
1
HS1AL - HS1DL
TJ=125°C
HS1GL
1
0.1
TJ=25°C
HS1JL - HS1ML
0.01
0.1
0.001
0.4
0.3
Pulse width 300μs
1% duty cycle
Pulse width
0.6
0.4
0.8
0.5
1.0
1.2
0.6
0.7
0.8
FORWARD VOLTAGE (V)
1.4
0.9
1.6
1
1.1
Fig.5 Maximum Non-Repetitive Forward Surge Current
40
PEAK FORWARD SURGE CURRENT (A)
INSTANTANEOUS REVERSE CURRENT (uA)
Fig.4 Typical Forward Characteristics
100
0.01
100
REVERSE VOLTAGE (V)
Fig.3 Typical Reverse Characteristics
1
10
(A)
AVERAGE FORWARD CURRENT (A)
2
8.3ms single half sine wave
30
20
10
0
1
10
100
NUMBER OF CYCLES AT 60 Hz
3
Version: C2103
1.2
HS1AL – HS1ML
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.6 Reverse Recovery Time Characteristic and Test Circuit Diagram
4
Version: C2103
HS1AL – HS1ML
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
Sub SMA
SUGGESTED PAD LAYOUT
MARKING DIAGRAM
5
P/N
= Marking Code
G
= Green Compound
YW
= Date Code
F
= Factory Code
Version: C2103
HS1AL – HS1ML
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf
assumes no responsibility or liability for any errors or inaccuracies.
Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability
for application assistance or the design of Purchasers’ products.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
6
Version: C2103
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