1SMB5926 – 1SMB5956
Taiwan Semiconductor
3W, 11V - 200V Surface Mount Zener Diode
FEATURES
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KEY PARAMETERS
Ideal for automated placement
Glass passivated chip junction
Low inductance
Moisture sensitivity level: level 1, per J-STD-020
RoHS Compliant
Halogen-free according to IEC 61249-2-21
PARAMETER
VALUE
UNIT
VZ
11 - 200
V
Test current IZT
1.9 - 34.1
mA
Ptot
3
W
TJ MAX
150
°C
APPLICATIONS
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Switching mode power supply (SMPS)
Adapters
Lighting application
On-board DC/DC converter
Package
DO-214AA (SMB)
Configuration
Single die
MECHANICAL DATA
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Case: DO-214AA (SMB)
Molding compound meets UL 94V-0 flammability rating
Terminal: Matte tin plated leads, solderable per J-STD-002
Meet JESD 201 class 2 whisker test
Polarity: Indicated by cathode band
Weight: 0.100g (approximately)
DO-214AA (SMB)
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
PARAMETER
SYMBOL
VALUE
UNIT
3
W
40
mW/°C
550
mW
4.4
mW/°C
DC power dissipation at TL=75°C, measure at
zero lead length (Note 1) derate above 75°C
PD
DC power dissipation at TA=25°C
Derate above 25°C
PD
Junction temperature
TJ
-55 to +150
°C
Storage temperature
TSTG
-55 to +150
°C
SYMBOL
TYP
UNIT
Junction-to-lead thermal resistance
RӨJL
25
°C/W
Junction-to-ambient thermal resistance
RӨJA
226
°C/W
Note:
1. Mounted on Cu-Pad size 5mm x 5mm on PCB
THERMAL PERFORMANCE
PARAMETER
1
Version: M2102
1SMB5926 – 1SMB5956
Taiwan Semiconductor
ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted)
Device
(Note 1)
Device
Marking
Code
Nominal Zener
Voltage
Test
current
Vz@IZT
IZT
ZZT @ IZT
V
Nom
(Note 2)
mA
Ω
Min
Zener Impedance
(Note 3)
ZZK@IZK
Ω
mA
Leakage
Current
Maximum
DC
Zener
Current
IR@VR
IZM
μA
V
mA(DC)
Max
1SMB5926
926B
10.45
11
11.55
34.1
5.5
550 0.25
1
8.4
136
1SMB5927
927B
11.40
12
12.60
31.2
6.5
550 0.25
1
9.1
125
1SMB5928
928B
12.35
13
13.65
28.8
7.0
550 0.25
1
9.9
115
1SMB5929
929B
14.25
15
15.75
25.0
9.0
600 0.25
1
11.4
100
1SMB5930
930B
15.20
16
16.80
23.4
10.0
600 0.25
1
12.2
94
1SMB5931
931B
17.10
18
18.90
20.8
12.0
650 0.25
1
13.7
83
1SMB5932
932B
19.00
20
21.00
18.7
14.0
650 0.25
1
15.2
75
1SMB5933
933B
20.90
22
23.10
17.0
17.5
650 0.25
1
16.7
68
1SMB5934
934B
22.80
24
25.20
15.6
19
700 0.25
1
18.2
63
1SMB5935
935B
25.65
27
28.35
13.9
23
700 0.25
1
20.6
56
1SMB5936
936B
28.50
30
31.50
12.5
26
750 0.25
1
22.8
50
1SMB5937
937B
31.35
33
34.65
11.4
33
800 0.25
1
25.1
45
1SMB5938
938B
34.20
36
37.80
10.4
38
850 0.25
1
27.4
42
1SMB5939
939B
37.05
39
40.95
9.6
45
900 0.25
1
29.7
38
1SMB5940
940B
40.85
43
45.15
8.7
53
950 0.25
1
32.7
35
1SMB5941
941B
44.65
47
49.35
8.0
67
1000 0.25
1
35.8
32
1SMB5942
942B
48.45
51
53.55
7.3
70
1100 0.25
1
38.8
29
1SMB5943
943B
53.20
56
58.80
6.7
86
1300 0.25
1
42.6
27
1SMB5944
944B
58.90
62
65.10
6.0
100
1500 0.25
1
47.1
24
1SMB5945
945B
64.60
68
71.40
5.5
120
1700 0.25
1
51.7
22
1SMB5946
946B
71.25
75
78.75
5.0
140
2000 0.25
1
56.0
20
1SMB5947
947B
77.90
82
86.10
4.6
160
2500 0.25
1
62.2
18
1SMB5948
948B
86.45
91
95.55
4.1
200
3000 0.25
1
69.2
16
1SMB5949
949B
95.00
100 105.00
3.7
250
3100 0.25
1
76.0
15
1SMB5950
950B
104.50 110 115.50
3.4
300
4000 0.25
1
83.6
13
1SMB5951
951B
114.00 120 126.00
3.1
360
4500 0.25
1
91.2
12
1SMB5952
952B
123.50 130 136.50
2.9
450
5000 0.25
1
98.8
11
1SMB5953
953B
142.50 150 157.50
2.5
600
6000 0.25
1
114.0
10
1SMB5954
954B
152.00 160 168.00
2.3
700
6500 0.25
1
121.6
9
1SMB5955
955B
171.00 180 189.00
2.1
900
7000 0.25
1
136.8
8
1SMB5956
956B
190.00 200 210.00
1.9
1200
8000 0.25
1
152.0
7
Notes:
1. Tolerance and type number designation the type numbers listed indicate a tolerance of 5%
2. Zener voltage (Vz) measurement: Nominal Zener voltage is measured with the device junction in thermal
equilibrium with ambient temperature 25°C
3. Zener impedance (Zz) derivation : ZZT and ZZK are measured by dividing the AC voltage drop across the device
by the AC current applied.
4. The specified limits are for Iz(AC) = 0.1 Iz(DC) with the AC frequency = 60Hz
2
Version: M2102
1SMB5926 – 1SMB5956
Taiwan Semiconductor
ORDERING INFORMATION
ORDERING CODE(1)
PACKAGE
PACKING
1SMB59x
DO-214AA (SMB)
3,000 / Tape & Reel
Notes:
1. "x" defines voltage from 11V(1SMB5926) to 200V(1SMB5956)
3
Version: M2102
1SMB5926 – 1SMB5956
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.1 Steady State Power Derating
Fig.2 Maximum Surge Power
MAXIMUM POWER DISSIPATION (W)
4
1000
PEAK SURGE POWER (W)
3
TL
2
1
TA
0
0
25
50
75
100
125
100
10
150
0
TEMPERATURE(°C)
100
Fig.4 Zener Voltage vs. Temperature Coefficient
100
TEMPERATURE COEFFICIENT (mV/°C)
TEMPERATURE COEFFICIENT (mV/°C)
10
PULSE WIDTH(ms)
Fig.3 Zener Voltage vs. Temperature Coefficient
10
9
8
7
6
5
4
3
2
1
0
-1
-2
-3
-4
1
Vz@IZT
2
3
4
5
6
7
8
9
10
11
Vz@IZT
10
10
12
100
ZENER VOLTAGE (V)
ZENER VOLTAGE(V)
4
Version: M2102
1SMB5926 – 1SMB5956
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.5 Vz = 3.3V - 10 V
Fig.6 Vz = 12V - 82 V
100
ZENER CURRENT (mA)
ZENER CURRENT (mA)
100
10
1
10
1
0.1
0.1
0
1
2
3
4
5
6
7
8
9
0
10
10
ZENER VOLTAGE (V)
Fig.7 Effect Of Zener Voltage
20
30 40 50 60 70
ZENER VOLTAGE (V)
90
100
Fig.8 Effect Of Zener Current
1000
1000
DYNAMIC IMPEDANCE (Ω)
Vz=150V
DYNAMIC IMPEDANCE (Ω)
80
Iz(dc) = 1mA
100
10mA
10
100
Iz(rms)=0.1 Iz(dc)
91V
62V
10
22V
12V
20mA
1
6.8V
1
10
100
0.1
1
10
100
1000
ZENER CURRENT(mA)
ZENER VOLTAGE(V)
5
Version: M2102
1SMB5926 – 1SMB5956
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.9 Capacitance Curve
Fig.10 Typical Pulse Rating Curve
10
1000
100
PEAK POWER (KW)
CAPACITANCE(pF)
MEASURED@
ZERO BIAS
MEASURED @ Vz/2
10
1
10
NONREPETITIVE
EXPONENTIAL
PULSE WAVEFORM
1
0.1
0.01
100
0.01
0.1
BREAKDOWN VOLTAGE (V)
1
10
PULSE WIDTH (ms)
Fig.11 Pulse Waveform
Fig.12 Pulse Waveform
120
Pulse width(td) is defined
as the point where the peak
current decays to 50% of IPPM
120
110
PEAK PULSE CURRENT (%)
PEAK PULSE CURRENT (%)
140
Rise time tr=10μs to 100%
100
Peak value
IPPM
80
Half value-IPPM/2
60
40
10/1000μs, waveform
20
0.5
90
0.9 IPEAK
80
70
60
0.5 IPEAK
50
40
30
t = 8μs
20
10
td
0
0
8/20 μs WAVEFORM
AS DEFINED BY ANSI
C62.1 AND IEC 801.5
100
1
1.5
2
2.5
0.1 IPEAK
0
3
0
TIME (ms)
0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0.1
TIME(ms)
6
Version: M2102
1SMB5926 – 1SMB5956
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DO-214AA (SMB)
SUGGESTED PAD LAYOUT
MARKING DIAGRAM
7
P/N
= Marking Code
G
= Green Compound
YW
= Date Code
F
= Factory Code
Version: M2102
1SMB5926 – 1SMB5956
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability
for application assistance or the design of Purchasers’ products.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
8
Version: M2102
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