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BZD17C13P RUG

BZD17C13P RUG

  • 厂商:

    TAIWANSEMICONDUCTOR(台半)

  • 封装:

    Sub-SMA

  • 描述:

    DIODE ZENER 13V 800MW SUB SMA

  • 详情介绍
  • 数据手册
  • 价格&库存
BZD17C13P RUG 数据手册
BZD17C11P – BZD17C220P Taiwan Semiconductor 0.8W, 11V - 220V Zener Diode FEATURES ● ● ● ● ● ● ● ● KEY PARAMETERS Silicon zener diodes Low profile surface-mount package Zener and surge current specification Low leakage current Excellent stability Moisture sensitivity level: level 1, per J-STD-020 RoHS Compliant Halogen-free according to IEC 61249-2-21 PARAMETER VALUE UNIT VZ 11 - 220 V Test current IZT 4 - 50 mA Ptot 0.8 W TJ MAX 175 °C Package Sub SMA Configuration Single die APPLICATIONS ● Voltage regulating ● Reference voltage ● Protection circuit MECHANICAL DATA ● ● ● ● ● ● Case: Sub SMA Molding compound meets UL 94V-0 flammability rating Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.019g (approximately) Sub SMA ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL VALUE UNIT VF 1.2 V 2.3 W 0.8 W PZSM 300 W Junction temperature TJ - 55 to +175 °C Storage temperature TSTG - 55 to +175 °C Forward voltage @ IF = 0.2A TL = 80°C Power dissipation TA = 25°C Non-repetitive peak pulse power dissipation 100μs square pulse (2) (1) Ptot Notes: 1. Mounted on Cu-Pad size 5mm x 5mm 2. TJ = 25°C prior to surge 1 Version: L2103 BZD17C11P – BZD17C220P Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER Junction-to-lead thermal resistance Junction-to-ambient thermal resistance (1) SYMBOL TYP UNIT RӨJL 30 °C/W RӨJA 180 °C/W Notes: 1. Mounted on Cu-Pad size 5mm x 5mm ORDERING INFORMATION ORDERING CODE(1) PACKAGE PACKING BZD17CxP Sub SMA 10,000 / Tape & Reel Notes: 1. “x” defines voltage from 11V(BZD17C11P) to 220V(BZD17C220P) ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) Working Voltage Part number Marking code VZ @ IZT Differential Resistance Temperature Coefficient Test Current rdif @ IZ αZ @ IZ IZT IR VR mA μA V (1) o Ω V %/ C Min Max Typ Max Min Max Reverse Current@ Reverse Voltage Max BZD17C11P J2 10.4 11.6 4 7 0.05 0.10 50 4.0 8.2 BZD17C12P J3 11.4 12.7 4 7 0.05 0.10 50 3.0 9.1 BZD17C13P J4 12.4 14.1 5 10 0.05 0.10 50 2.0 10 BZD17C15P J5 13.8 15.6 5 10 0.05 0.10 25 1.0 11 BZD17C16P J6 15.3 17.1 6 15 0.06 0.11 25 1.0 12 BZD17C18P J7 16.8 19.1 6 15 0.06 0.11 25 1.0 13 BZD17C24P K0 22.8 25.6 7 15 0.06 0.11 25 1.0 18 BZD17C27P K1 25.1 28.9 7 15 0.06 0.11 25 1.0 20 BZD17C33P K3 31 35 8 15 0.06 0.11 25 1.0 24 BZD17C36P K4 34 38 21 40 0.06 0.11 10 1.0 27 BZD17C39P K5 37 41 21 40 0.06 0.11 10 1.0 30 BZD17C43P K6 40 46 24 45 0.07 0.12 10 1.0 33 BZD17C47P K7 44 50 24 45 0.07 0.12 10 1.0 36 BZD17C51P K8 48 54 25 60 0.07 0.12 10 1.0 39 BZD17C62P L0 58 66 25 80 0.08 0.13 10 1.0 47 BZD17C68P L1 64 72 25 80 0.08 0.13 10 1.0 51 BZD17C75P L2 70 79 30 100 0.08 0.13 10 1.0 56 BZD17C100P L5 94 106 60 200 0.09 0.13 4 1.0 75 BZD17C120P L7 114 127 150 300 0.09 0.13 4 1.0 91 BZD17C180P M1 168 191 280 450 0.09 0.13 4 1.0 130 BZD17C200P M2 188 212 350 750 0.09 0.13 4 1.0 150 BZD17C220P M3 208 233 430 900 0.09 0.13 4 1.0 160 Notes: 1. Pulse test: tp ≦5ms. 2 Version: L2103 BZD17C11P – BZD17C220P Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.1 Power Dissipation vs. Ambient Temperature Fig.2 Typical Junction Capacitance 1000 TL 2.0 C12P CAPACITANCE (pF) POWER DISSIPATION(W) 2.4 1.6 1.2 TA 0.8 100 C27P 0.4 C200P 0.0 25 55 85 115 145 10 175 0 TEMPERATURE (°C) 1 2 3 REVERSE VOLTAGE (V) 1010 1 UF1DLW TJ=125°C TJ=25°C 10.1 (A) INSTANTANEOUS FORWARD CURRENT (A) Fig.3 Typical Forward Characteristics 0.01 0.1 0.001 0.7 0.3 Pulse width 0.4 0.8 0.5 0.9 0.6 0.7 1.0 0.8 0.9 1.1 1 1.1 1.2 FORWARD VOLTAGE (V) 3 Version: L2103 BZD17C11P – BZD17C220P Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS Sub SMA SUGGESTED PAD LAYOUT MARKING DIAGRAM 4 P/N = Marking Code G = Green Compound YW = Date Code F = Factory Code Version: L2103 BZD17C11P – BZD17C220P Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 5 Version: L2103
BZD17C13P RUG AI解析
物料型号:BZD17C11P – BZD17C220P,由台湾半导体公司生产。

器件简介:这些是硅齐纳二极管,具有低轮廓的表面安装封装,具备齐纳电压和浪涌电流规格,低漏电流,出色的稳定性,符合RoHS标准,并且不含卤素。

引脚分配:文档中提到了阳极和阴极的标记,但没有提供具体的引脚分配图。

参数特性: - 工作电压(Vz):11V 至 220V - 测试电流(Izr):4mA 至 50mA - 总功率(Ptot):0.8W - 最大结温(TJMAX):175°C - 封装类型:Sub SMA - 配置:单片

功能详解:这些齐纳二极管适用于电压调节、参考电压和保护电路。

应用信息:适用于电压调节、参考电压和保护电路。

封装信息:Sub SMA封装,符合UL 94V-0可燃性等级,终端采用镀锡的引线,可焊性符合J-STD-002标准,符合JESD 201类2须测试。

绝对最大额定值和热性能参数也在文档中给出,包括正向电压、功耗、结温、存储温度、结到引线的热阻和结到环境的热阻等。

订购信息提供了订购代码、封装类型和包装信息。

电气规格详细列出了不同工作电压下的参数,包括最小和最大值,以及测试电流和反向电流等。

特性曲线图展示了在不同环境温度下功耗与温度的关系、典型结电容和典型正向特性。

封装尺寸图提供了详细的尺寸信息和建议的焊盘布局。
*介绍内容由AI识别生成
BZD17C13P RUG 价格&库存

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