1PGSMC5359HR7G

1PGSMC5348 – 1PGSMC5369 Taiwan Semiconductor 5W, 11V - 51V Surface Mount Zener Diode FEATURES ● ● ● ● ● ● KEY PARAMETERS Photo Glass passivated chip junction Ideal for automated placement Low inductance Moisture sensitivity level: level 1, per J-STD-020 RoHS Compliant Halogen-free according to IEC 61249-2-21 APPLICATIONS ● ● ● ● PARAMETER VALUE UNIT VZ 11 - 51 V PD 5 W TJ MAX 175 °C Package DO-214AB (SMC) Configuration Single die Switching mode power supply (SMPS) Adapters Lighting application On-board DC/DC converter MECHANICAL DATA ● ● ● ● ● ● Case: DO-214AB (SMC) Molding compound meets UL 94V-0 flammability rating Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.210g (approximately) DO-214AB (SMC) ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER DC power dissipation at TL = 75°C, measure at zero lead length (Note 1) derate above 75°C Junction temperature SYMBOL VALUE UNIT PD 5 W TJ -55 to +175 °C TSTG -55 to +175 °C SYMBOL TYP UNIT Junction-to-lead thermal resistance RӨJL 20 °C/W Junction-to-ambient thermal resistance RӨJA 55 °C/W Junction-to-case thermal resistance RӨJC 22 °C/W Storage temperature Notes: 1. Mounted on 16mm x 16mm Cu pad test board THERMAL PERFORMANCE PARAMETER Thermal Performance Note: Units mounted on PCB (16mm x 16mm Cu pad test board) 1 Version: D2102 1PGSMC5348 – 1PGSMC5369 Taiwan Semiconductor ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) Device Marking Code Device (Note 1) Nominal Zener Voltage Test Leakage Maximum DC Zener Impedance Current Current Zener Current VZ @ IZT V Min Nom Max IZT mA ZZT @ IZT Ω ZZK @ IZK Ω mA IR @ VR μA V IZM mA 1PGSMC5348 P348B 10.45 11 11.55 125 3 125 1 5 8.4 430 1PGSMC5349 P349B 11.40 12 12.60 100 3 150 1 2 9.1 395 1PGSMC5350 P350B 12.35 13 13.65 100 3 150 1 1 9.9 365 1PGSMC5351 P351B 13.30 14 14.70 100 3 150 1 1 10.6 345 1PGSMC5352 P352B 14.25 15 15.75 75 3 150 1 1 11.5 315 1PGSMC5353 P353B 15.20 16 16.80 75 3 150 1 1 12.2 295 1PGSMC5354 P354B 16.15 17 17.85 70 3 150 1 0.5 12.9 280 1PGSMC5355 P355B 17.10 18 18.90 65 3 150 1 0.5 13.7 264 1PGSMC5356 P356B 18.05 19 19.95 65 3 150 1 0.5 14.4 250 1PGSMC5357 P357B 19.00 20 21.00 65 3 150 1 0.5 15.2 237 1PGSMC5358 P358B 20.90 22 23.10 50 4 150 1 0.5 16.7 216 1PGSMC5359 P359B 22.80 24 25.20 50 4 180 1 0.5 18.2 198 1PGSMC5360 P360B 23.75 25 26.25 50 4 180 1 0.5 19.0 190 1PGSMC5361 P361B 25.65 27 28.35 50 5 180 1 0.5 20.6 176 1PGSMC5362 P362B 26.60 28 29.40 50 6 180 1 0.5 21.2 170 1PGSMC5363 P363B 28.50 30 31.50 40 8 180 1 0.5 22.8 158 1PGSMC5364 P364B 31.35 33 34.65 40 10 180 1 0.5 25.1 144 1PGSMC5365 P365B 34.20 36 37.80 30 11 200 1 0.5 27.4 132 1PGSMC5366 P366B 37.05 39 40.95 30 14 200 1 0.5 29.7 122 1PGSMC5367 P367B 40.85 43 45.15 30 20 200 1 0.5 32.7 110 1PGSMC5368 P368B 44.65 47 49.35 25 25 200 1 0.5 35.8 100 1PGSMC5369 P369B 48.45 51 53.55 25 27 200 1 0.5 38.8 93 Notes: 1. Tolerance and type number designation the type numbers listed indicate a tolerance of 5% ORDERING INFORMATION ORDERING CODE(1) PACKAGE PACKING 1PGSMC53x DO-214AB (SMC) 3,000 / Tape & Reel Notes: 1. “x” defines voltage from 11V(1PGSMC5348) to 51V(1PGSMC5369) 2 Version: D2102 1PGSMC5348 – 1PGSMC5369 Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.1 Steady State Power Derating Fig.2 Typical Junction Capacitance 6 1000 1PGSMC5349 4 CAPACITANCE (pF) PD - Power Dissipation (W) 5 3 2 1 1PGSMC5359 100 1PGSMC5366 1PGSMC5369 Heat sink 16mm x 16mm Cu pad test board f=1.0MHz Vsig=50mVp-p 10 0 25 50 75 100 125 150 1 175 10 100 REVERSE VOLTAGE (V) LEAD TEMPERATURE (°C) Fig.3 Typical Zener Impedance Zz - DYNAMIC IMPEDANCE (Ω) 1000 100 1PGSMC5349 10 1PGSMC5359 1PGSMC5366 1 1PGSMC5369 0.1 1 10 100 1000 Iz - ZENER TEST CURRENT (mA) 3 Version: D2102 1PGSMC5348 – 1PGSMC5369 Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DO-214AB (SMC) SUGGESTED PAD LAYOUT MARKING DIAGRAM 4 P/N = Marking Code G = Green Compound YW = Date Code F = Factory Code Version: D2102 1PGSMC5348 – 1PGSMC5369 Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 5 Version: D2102