ESH3B – ESH3D
Taiwan Semiconductor
3A, 100V - 200V Ultra Fast Surface Mount Rectifier
FEATURES
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KEY PARAMETERS
Glass passivated chip junction
Ideal for automated placement
Low profile package
Ultra Fast recovery time for high efficiency
Moisture sensitivity level: level 1, per J-STD-020
RoHS Compliant
Halogen-free according to IEC 61249-2-21
PARAMETER
VALUE
UNIT
IF
3
A
VRRM
100 - 200
V
IFSM
125
A
TJ MAX
175
°C
APPLICATIONS
Package
DO-214AB (SMC)
Configuration
Single die
● High frequency rectification
● Freewheeling application
● Switching mode converters and inverters in computer
and telecommunication.
MECHANICAL DATA
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Case: DO-214AB (SMC)
Molding compound meets UL 94V-0 flammability rating
Terminal: Matte tin plated leads, solderable per J-STD-002
Meet JESD 201 class 2 whisker test
Polarity: Indicated by cathode band
Weight: 0.200g (approximately)
DO-214AB (SMC)
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
PARAMETER
SYMBOL
Marking code on the device
ESH3B
ESH3C
ESH3D
ESH3B
ESH3C
ESH3D
UNIT
Repetitive peak reverse voltage
VRRM
100
150
200
V
Reverse voltage, total rms value
VR(RMS)
70
105
140
V
Forward current
Peak forward surge current, 8.3ms single half
sine-wave superimposed on rated load
Junction temperature
IF
3
A
IFSM
125
A
TJ
- 55 to +175
°C
Storage temperature
TSTG
- 55 to +175
°C
1
Version: I2102
ESH3B – ESH3D
Taiwan Semiconductor
THERMAL PERFORMANCE
PARAMETER
SYMBOL
TYP
UNIT
Junction-to-lead thermal resistance
RӨJL
12
°C/W
Junction-to-ambient thermal resistance
RӨJA
47
°C/W
ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted)
PARAMETER
Forward voltage
CONDITIONS
(1)
Reverse current @ rated VR
IF = 3A, TJ = 25°C
(2)
Junction capacitance
Reverse recovery time
TJ = 25°C
SYMBOL
TYP
MAX
UNIT
VF
-
0.9
V
-
5
µA
-
150
µA
CJ
45
-
pF
trr
-
20
ns
IR
TJ = 125°C
1MHz, VR = 4.0V
IF = 0.5A, IR = 1.0A,
Irr = 0.25A
Notes:
1. Pulse test with PW = 0.3ms
2. Pulse test with PW = 30ms
ORDERING INFORMATION
ORDERING CODE(1)
PACKAGE
PACKING
ESH3x
DO-214AB (SMC)
3,000 / Tape & Reel
Notes:
1. “x” defines voltage from 100V(ESH3B) to 200V(ESH3D)
2
Version: I2102
ESH3B – ESH3D
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.1 Forward Current Derating Curve
Fig.2 Typical Junction Capacitance
60
50
3
CAPACITANCE (pF)
2
1
40
30
20
10
0
25
50
75
100
125
150
f=1.0MHz
Vsig=50mVp-p
0
175
0.1
1
LEAD TEMPERATURE (°C)
INSTANTANEOUS FORWARD CURRENT (A)
TJ=125°C
TJ=75°C
10
1
TJ=25°C
0.1
10
20
30
40
50
60
70
80
100
Fig.4 Typical Forward Characteristics
1000
90
100
10 10
UF1DLW
1
TJ=125°C
1
0.1
TJ=25°C
0.01
0.1
0.001
0.4
0.3
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Pulse width 300μs
1% duty cyclePulse width
0.6
0.4
0.5
0.8
0.6
0.7
1.0
0.8
0.9
1.2
1
1.1
FORWARD VOLTAGE (V)
Fig.5 Maximum Non-Repetitive Forward Surge Current
150
PEAK FORWARD SURGE CURRENT (A)
INSTANTANEOUS REVERSE CURRENT (μA)
Fig.3 Typical Reverse Characteristics
100
10
REVERSE VOLTAGE (V)
(A)
AVERAGE FORWARD CURRENT (A)
4
8.3ms single half sine wave
125
100
75
50
25
0
1
10
100
NUMBER OF CYCLES AT 60 Hz
3
Version: I2102
1.2
ESH3B – ESH3D
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.6 Reverse Recovery Time Characteristic and Test Circuit Diagram
4
Version: I2102
ESH3B – ESH3D
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DO-214AB (SMC)
SUGGESTED PAD LAYOUT
MARKING DIAGRAM
5
P/N
= Marking Code
G
= Green Compound
YW
= Date Code
F
= Factory Code
Version: I2102
ESH3B – ESH3D
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability
for application assistance or the design of Purchasers’ products.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
6
Version: I2102
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