ES3G R7G

ES3A – ES3J Taiwan Semiconductor 3A, 50V - 600V Super Fast Surface Mount Rectifier FEATURES ● ● ● ● ● ● KEY PARAMETERS Glass passivated chip junction Ideal for automated placement Super fast recovery time for high efficiency Moisture sensitivity level: level 1, per J-STD-020 RoHS Compliant Halogen-free according to IEC 61249-2-21 PARAMETER VALUE UNIT IF 3 A VRRM 50 - 600 V IFSM 100 A TJ MAX 150 °C APPLICATIONS ● High frequency rectification ● Freewheeling application ● Switching mode converters and inverters in computer, and telecommunication. Package DO-214AB (SMC) Configuration Single die MECHANICAL DATA ● ● ● ● ● ● Case: DO-214AB (SMC) Molding compound meets UL 94V-0 flammability rating Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.210g (approximately) DO-214AB (SMC) ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL ES3A ES3B ES3C ES3D ES3F ES3G ES3H ES3J UNIT Marking code on the device ES3A ES3B ES3C ES3D ES3F ES3G ES3H ES3J Repetitive peak reverse voltage VRRM 50 100 150 200 300 400 500 600 V Reverse voltage, total rms value VR(RMS) 35 70 105 140 210 280 350 420 V Forward current Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load Junction temperature IF 3 A IFSM 100 A TJ - 55 to +150 °C Storage temperature TSTG - 55 to +150 °C 1 Version: N2102 ES3A – ES3J Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER SYMBOL TYP UNIT Junction-to-lead thermal resistance RӨJL 12 °C/W Junction-to-ambient thermal resistance RӨJA 47 °C/W ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) PARAMETER Forward voltage CONDITIONS ES3A ES3B ES3C ES3D ES3F ES3G ES3H ES3J (1) Reverse current @ rated VR TJ = 25°C (2) Junction capacitance IF = 3A, TJ = 25°C Reverse recovery time 1MHz, VR = 4.0V IF = 0.5A, IR = 1.0A, Irr = 0.25A TYP MAX UNIT - 0.95 V - 1.30 V - 1.70 V - 10 µA - 500 µA 45 - pF 30 - pF - 35 ns VF IR TJ = 100°C ES3A ES3B ES3C ES3D ES3F ES3G ES3H ES3J SYMBOL CJ trr Notes: 1. Pulse test with PW = 0.3ms 2. Pulse test with PW = 30ms ORDERING INFORMATION ORDERING CODE(1) PACKAGE PACKING ES3x DO-214AB (SMC) 3,000 / Tape & Reel Notes: 1. “x” defines voltage from 50V(ES3A) to 600V(ES3J) 2 Version: N2102 ES3A – ES3J Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.1 Forward Current Derating Curve Fig.2 Typical Junction Capacitance 90 75 3 CAPACITANCE (pF) 2 1 60 45 ES3A - ES3D 30 ES3F - ES3J 15 0 f=1.0MHz Vsig=50mVp-p 0 25 50 75 100 125 150 1 10 LEAD TEMPERATURE (°C) REVERSE VOLTAGE (V) Fig.4 Typical Forward Characteristics INSTANTANEOUS FORWARD CURRENT (A) 1000 100 TJ=125°C 10 TJ=75°C 1 TJ=25°C 0.1 20 30 40 50 60 70 80 90 100 1010 ES3F - ES3G UF1DLW 1 ES3A - ES3D TJ=125°C 1 0.1 TJ=25°C ES3H - ES3J 0.01 0.1 0.001 0.4 0.6 0.8 1.0 0.3 0.4 0.5 0.6 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Pulse width 300μs 1% duty cycle Pulse width 1.2 0.7 1.4 0.8 1.6 0.9 1.8 1 1.1 FORWARD VOLTAGE (V) Fig.5 Maximum Non-Repetitive Forward Surge Current 110 PEAK FORWARD SURGE CURRENT (A) INSTANTANEOUS REVERSE CURRENT (μA) Fig.3 Typical Reverse Characteristics 10 100 (A) AVERAGE FORWARD CURRENT (A) 4 100 8.3ms single half sine wave 90 80 70 60 50 40 30 20 10 0 1 10 100 NUMBER OF CYCLES AT 60 Hz 3 Version: N2102 1.2 ES3A – ES3J Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.6 Typical Transient Thermal Impedance TRANSIENT THERMAL IMPEDANCE (°C/W) 100 10 1 0.01 0.1 1 10 100 PULSE DURATION (s) Fig.7 Reverse Recovery Time Characteristic and Test Circuit Diagram 4 Version: N2102 ES3A – ES3J Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DO-214AB (SMC) SUGGESTED PAD LAYOUT MARKING DIAGRAM 5 P/N = Marking Code G = Green Compound YW = Date Code F = Factory Code Version: N2102 ES3A – ES3J Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 6 Version: N2102