FP1110V2-R200-R

Technical Data 10427 Effective June 2020 Supersedes August 2015 FP1110V High frequency, high current power inductors Applications Product features • Multi-phase and Vcore regulators • Voltage Regulator Modules (VRMs) • Server and desktop • Central processing unit (CPU • Graphics processing unit (GPU)) • Application specific integrated circuit (ASIC) • High power density • Data networking and storage systems • Graphics cards and battery power systems • Portable electronics • Point-of-load modules • DCR sensing circuits • Vertical design utilizes less board space • Tight tolerance DCR for sensing circuits • Inductance Range from 150 nH to 320 nH Environmental compliance and general specifications • Current range from 42 A to 90 A • • 10.7 mm x 7.5 mm and 10.5 mm x 6.2 mm footprint surface mount package in a 9.5 mm height Storage temperature range (Component): -40 °C to +125 °C • • Ferrite core material Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise) • Moisture sensitivity level (MSL): 1 • Solder reflow temperature: J-STD-020 (latest revision) compliant HALOGEN Pb HF FREE FP1110V High frequency, high current power inductors  Technical Data 10427 Effective June 2020 Product specifications OCL1 (nH) ±10% FLL2 (nH) minimum Irms3 (A) Isat14 (A) Isat25 (A) DCR (mΩ) ±5% @ +20°C K-factor6 FP1110V1-R15-R 150 108 61 90 72 0.23 278 FP1110V1-R20-R 195 140 61 70 58 0.23 278 FP1110V1-R22-R 220 158 61 64 51 0.23 278 FP1110V1-R27-R 270 173 61 55 44 0.23 278 FP1110V1-R32-R 320 230 61 42 34 0.23 278 FP1110V2-R150-R 150 108 61 89 70 0.18 328 FP1110V2-R180-R 180 130 61 72 57.5 0.18 328 FP1110V2-R200-R 200 144 61 65 52 0.18 328 FP1110V2-R220-R 220 159 61 59 47 0.18 328 FP1110V2-R270-R 270 195 61 48 38.5 0.18 328 FP1110V2-R320-R 320 230 61 40.5 32.5 0.18 328 Part number7 V1 version V2 version 1. Open circuit inductance (OCL) Test parameters: 100 kHz, 0.1 Vrms, 0.0 Adc, +25 °C 2. Full load inductance (FLL) Test parameters: 100 kHz, 0.1 Vrms, @ Isat1, @ +25 ºC 3. Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. 4. Isat1 : Peak current for approximately 20% rolloff @ +25 ºC 5. Isat : Peak current for approximately 20% rolloff @ +100 ºC 6. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), ΔI (Peak to peak ripple current in Amps). 7. Part Number Definition: FP1110Vx-Rxx(x)-R FP1110V = Product code x= Version indicator Rxx(x)= Inductance value in uH, R= decimal point -R suffix = RoHS compliant Dimensions- mm 7.5 max Recommended pad layout 9.5 max Schematic 10.7 max xxxx a 4.6 4.1 2.8 3.4 b 2.8 6.2 max 3.3 Recommended pad layout 9.5 max 10.5 max xxxx a 4.2 4.0 3.0 3.6 b 2.15 2.8 Part marking: FP1110Vx (x=Version indicator), Rxx(x)=inductance value in µH, R=decimal point xxxx= lot code DCR measured from point “a” to point “b” Soldering surfaces to be coplanar within 0.10 millimeters Traces or vias underneath the inductor is not recommended. 2 www.eaton.com/electronics Schematic Technical Data 10427 FP1110V High frequency, high current power inductors Effective June 2020  Packaging information- mm (Drawing not to scale) (Supplied in tape and reel packaging, 300 parts per 13” diameter reel 2.0 5 4.0 1. 1.75 di a 1.5 di a FP1110V1 11.5 24.0 ±0.3 10.9 20.0 Part marking 9.5 7.6 User Direction of feed FP1110V2 1.5 dia 1.75 4.0 2.0 1.5 dia 11.5 24.0 ±0.3 10.7 20.0 10.2 Part marking 2.5 6.4 User Direction of feed www.eaton.com/electronics 3 FP1110V High frequency, high current power inductors  Technical Data 10427 Effective June 2020 Temperature rise vs. total loss FP1110V2 50 50 40 40 Temperature rise (°C) Temperature rise (°C) FP1110V1 30 20 10 0 0.0 0.2 0.4 0.6 0.8 1.0 30 20 10 0 1.2 0.0 Total loss (W) 0.2 0.4 0.6 1.0 0.8 Total loss (W) Core loss vs. Bp-p FP1110V1 10 1 MHz 500 kHz 0.01 0.001 100 1000 B p-p (Gauss) 4 500 kHz www.eaton.com/electronics 10000 300 kHz 100 kHz 1 Core loss (W) Core loss (W) 0.1 1 MHz 200 kHz 200 kHz 100 kHz 1 FP1110V2 10 300 kHz 0.1 0.01 0.001 100 1000 B p-p (Gauss) 10000 Technical Data 10427 FP1110V High frequency, high current power inductors Effective June 2020  Inductance characteristics FP1110V1-R15-R 180 FP1110V1-R20-R 250 160 140 200 150 100 OCL (nH) OCL (nH) 120 80 60 -40 °C +25 °C +100 °C +125 °C 40 100 -40 °C 50 20 +25 °C +100 °C 0 0 20 40 60 80 100 120 140 0 160 Idc (A) +125 °C 0 10 20 30 40 50 60 70 80 90 100 110 120 Idc (A) FP1110V1-R27-R FP1110V1-R22-R 300 250 250 200 200 OCL (nH) OCL (nH) 150 100 150 -40 °C -40 °C +25 °C 100 +25 °C +100 °C 50 +100 °C +125 °C +125 °C 50 0 0 10 20 30 40 50 60 70 80 90 100 110 Idc (A) 0 0 10 20 30 40 Idc (A) 50 60 70 80 90 FP1110V1-R32-R 350 300 OCL(nH) 250 200 150 -40 °C 100 +25 °C +100 °C 50 0 +125 °C 0 10 20 30 40 50 60 70 80 Idc (A) www.eaton.com/electronics 5 FP1110V High frequency, high current power inductors  Technical Data 10427 Effective June 2020 Inductance characteristics FP1110V2-R150-R 180 200 160 180 160 140 140 OCL (nH) 120 OCL (nH) FP1110V2-R180-R 100 80 120 100 80 60 60 -40 °C -40 °C 40 40 +25 °C +100 °C 20 0 0 +100 °C 20 +125 °C 0 +25 °C 20 40 60 80 100 120 140 160 +125 °C 0 20 40 60 FP1110V2-R200-R 200 200 150 150 120 140 100 100 -40 °C -40 °C 50 50 +25 °C +25 °C +100 °C +100 °C +125 °C +125 °C 0 100 FP1110V2-R220-R 250 OCL (nH) OCL (nH) 250 80 Idc (A) Idc (A) 0 0 20 40 60 80 100 0 20 40 80 100 120 Idc (A) FP1110V2-R270-R 300 60 120 FP1110V2-R320-R 400 350 250 300 OCL (nH) OCL (nH) 200 150 -40 °C 100 +25 °C 50 0 -40 °C +25 °C +100 °C 50 +125 °C +100 °C +125 °C 20 40 60 Idc (A) 6 200 150 100 0 250 www.eaton.com/electronics 80 100 120 0 0 20 40 60 Idc (A) 80 100 FP1110V High frequency, high current power inductors Technical Data 10427 Effective June 2020  Solder reflow profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL Preheat A T smax Package thickness Volume mm3