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TPH3208LDG

TPH3208LDG

  • 厂商:

    TRANSPHORM

  • 封装:

    PowerDFN3

  • 描述:

    CASCODEGANFET650V20APQFN88

  • 数据手册
  • 价格&库存
TPH3208LDG 数据手册
TPH3208L Series Not recommended for new designs 650V GaN FET PQFN Series Description Features The TPH3208L Series 650V, 110mΩ Gallium Nitride (GaN) FETs are normally-off devices. They combine state-of-the-art high voltage GaN HEMT and low voltage silicon MOSFET technologies—offering superior reliability and performance. Transphorm GaN offers improved efficiency over silicon, through lower gate charge, lower crossover loss, and smaller reverse recovery charge. Related Literature  AN0009: Recommended External Circuitry for GaN FETs  AN0003: Printed Circuit Board Layout and Probing Product Series and Ordering Information Package Package Configuration TPH3208LDG 8 x 8mm PQFN Drain TPH3208LSG 8 x 8mm PQFN Source Part Number* *  JEDEC qualified GaN technology  Dynamic RDS(on)eff production tested  Robust design, defined by — Intrinsic lifetime tests — Wide gate safety margin — Transient over-voltage capability  Very low QRR  Reduced crossover loss  RoHS compliant and Halogen-free packaging Benefits  Enables AC-DC bridgeless totem-pole PFC designs — Increased power density — Reduced system size and weight — Overall lower system cost  Achieves increased efficiency in both hard- and softswitched circuits  Easy to drive with commonly-used gate drivers Applications     Add “-TR” suffix for tape and reel; see page 15 Datacom Broad industrial PV inverter Servo motor Key Specifications TPH3208LDG 8x8 PQFN (bottom view) TPH3208LSG 8x8 PQFN (bottom view) D S S D G G VDSS (V) 650 V(TR)DSS (V) 800 RDS(on)eff (mΩ) max* 130 QRR (nC) typ 54 QG (nC) typ 10 * Dynamic on-resistance; see Figures 19 and 20 Cascode Schematic Symbol May 17, 2018 tph3208l.6 Cascode Device Structure © 2018 Transphorm Inc. Subject to change without notice. 1 TPH3208L Series Absolute Maximum Ratings (Tc=25°C unless otherwise stated.) Symbol VDSS V(TR)DSS VGSS PD ID IDM Parameter Limit Value Unit Drain to source voltage (TJ = -55°C to 150°C) 650 Transient drain to source voltage a 800 Gate to source voltage ±18 Maximum power dissipation @TC=25°C 96 W Continuous drain current @TC=25°C b 20 A Continuous drain current @TC=100°C b 13 A Pulsed drain current (pulse width: 10µs) 80 A V (di/dt)RDMC Reverse diode di/dt, repetitive c 1250 A/µs (di/dt)RDMT Reverse diode di/dt, transient d 2500 A/µs Case -55 to +150 °C Junction -55 to +150 °C -55 to +150 °C 260 °C Typical Unit TC TJ TS TSOLD Operating temperature Storage temperature Soldering peak temperature e Notes: a. In off-state, spike duty cycle D
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