LDS0705-101M-R

Technical Data 4142 Effective July 2017 Supersedes March 2007 LDS0705 Shielded metalized drum core power inductors Applications • Buck or Boost Inductor Noise filtering and output filter chokes Battery Power, DC-DC converters Notebook and laptop power Hand held devices Media players , 1 3 . r e ted b to ele c . p O n e o e i d t v ti u s . l i c fe tory ble Pb eHFso f E n la t , a d ve vai rn e n e u i t a l n l i i t a t t n n n e o r u me ibl c s s o i e s c D 18 la po 20 rep 4-R o N A7 R D • • • • • SMD Device Environmental data • Product features • • • • • • 7.8 mm x 7.0 mm x 5.0 mm shielded drum core Ferrite core material Metalized core mounting utilizes board space Inductance range from 0.82 µH to 470 µH Current range from 0.368 A to 8.57 A Frequency range up to 1 MHz • • Storage temperature range (component): -40 °C to +125 °C Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise) Solder reflow temperature: J-STD-020 (latest revision) compliant HALOGEN FREE  Technical Data 4142 Effective July 2017 Product specifications Part Number Rated Inductance (µH) 0.82 1.5 2.2 3.3 4.7 6.8 8.2 10.0 15.0 22.0 33.0 47.0 68.0 82.0 100.0 150.0 220.0 330.0 470.0 LDS0705-R82M-R LDS0705-1R5M-R LDS0705-2R2M-R LDS0705-3R3M-R LDS0705-4R7M-R LDS0705-6R8M-R LDS0705-8R2M-R LDS0705-100M-R LDS0705-150M-R LDS0705-220M-R LDS0705-330M-R LDS0705-470M-R LDS0705-680M-R LDS0705-820M-R LDS0705-101M-R LDS0705-151M-R LDS0705-221M-R LDS0705-331M-R LDS0705-471M-R OCL (1) µH Irms(2) (A) Isat (3) (A) 0.861±20% 1.42±20% 2.13±20% 2.97±20% 5.08±20% 6.34±20% 7.75±20% 9.30±20% 14.78±20% 21.53±20% 32.50±20% 45.71±20% 69.76±20% 83.67±20% 98.9±20% 152.0±20% 216.5±20% 329.9±20% 467.0±20% 7.68 6.17 5.06 4.19 3.32 3.11 2.67 2.54 2.04 1.66 1.48 1.21 0.985 0.850 0.808 0.649 0.584 0.470 0.387 8.57 6.67 5.45 4.62 3.53 3.16 2.86 2.61 2.07 1.71 1.40 1.18 0.952 0.870 0.800 0.645 0.541 0.438 0.368 DCR (Ω) @+20 °C (Typical) 0.0040 0.0061 0.009 0.013 0.021 0.024 0.033 0.036 0.056 0.084 0.107 0.158 0.240 0.323 0.357 0.554 0.68 1.06 1.56 (4) K-factor: Used to determine B p-p for core loss (see graph). B p-p = K*L*∆I, B p-p(mT), K: (K factor from table), L: (Inductance in µH), ∆(Peak to peak ripple current in Amps). (5) Part Number Definition: LDS0705-xxx-R LDS0705 = Product code and size; -xxx = Inductance value in uH; R = decimal point; If no R is present, last character equals number of zeros. M = Inductance tolerance +/- 20% -R suffix = RoHS compliant Dimensions- mm BOTTOM VIEW TOP VIEW RECOMMENDED PCB LAYOUT SIDE VIEW 2.0 2.0 Typ. XX X 7.0±0.2 5.0 Max. SCHEMATIC 1 7.0 2 7.8±0.2 3.0 Marking: xxx = Inductance in uH. R = decimal point. If no R is present last character equals number of zeros. wwllyy = Date code, R = Revision level. Do not route traces or vias underneath the inductor Packaging information- mm Parts packaged on 13" Diameter reel, 1,000 parts per reel. 2 24.8 19.3 15.8 13.4 10.2 9.2 8.3 7.6 6.0 5.0 4.0 3.4 2.8 2.5 2.3 1.9 1.6 1.3 1.1 , 1 3 . r e ted b to ele c . p O n e o e i d t v ti u s . l i c fe tory ble e so f E n la t , a d ve vai rn e n e u i t a l n l i i t a t t n n n e o r u me ibl c s s o i e s c D 18 la po 20 rep 4-R o N A7 R D (1) Open Circuit Inductance Test Parameters: 100 kHz, 0.1 V, 0.0 Adc. (2) Irms: DC current for an approximate ∆T of 30 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. (3) Isat Amperes peak for approximately 15% rolloff (@+25 °C) wwllyy R K-factor (4) www.eaton.com/electronics LDS0705 Shielded metalized drum core power inductors Technical Data 4142 Effective July 2017 Temperature rise vs. total loss 90 80 Temperature Rise (°C) 70 60 50 40 30 , 1 3 . r e ted b to ele c . p O n e o e i d t v ti u s . l i c fe tory ble e so f E n la t , a d ve vai rn e n e u i t a l n l i i t a t t n n n e o r u me ibl c s s o i e s c D 18 la po 20 rep 4-R o N A7 R D 20 10 0 0 0.1 0.2 0.3 0.4 0.5 Tot al Loss (W) 0.6 0.7 0.8 0.9 1 Core loss vs Bp-p 100 1 MHz 500 kHz 10 300 kHz 200 kHz 1 Core Loss (W) 100 kHz 50 kHz 0.1 0.01 0.001 0.0001 1 10 100 1000 Bp-p (mT) Inductance characteristics OCL vs. Isat 120% 110% 100% 90% % of OCL 80% -40 70% 60% 25 50% 40% 85 30% 20% 10% 0% 0% 20% 40% 60% 80% 100% 120% 140% 160% 180% 200% % of Isat www.eaton.com/electronics 3 LDS0705 Shielded metalized drum core power inductors Technical Data 4142 Effective July 2017 Solder Reflow Profile TP tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL Preheat A t TC -5°C Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 220°C 220°C , 1 3 . r e ted b to ele c . p O n e o e i d t v ti u s . l i c fe tory ble e so f E n la t , a d ve vai rn e n e u i t a l n l i i t a t t n n n e o r u me ibl c s s o i e s c D 18 la po 20 rep 4-R o N A7 R D 25°C T smax Table 2 - Lead (Pb) Free Solder (T c) Tsmin Volume Package mm3 Thickness 2000 260°C 245°C 245°C Time Reference JDEC J-STD-020 Profile Feature Preheat and Soak • Temperature min. (Tsmin) • Temperature max. (Tsmax) • Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Standard SnPb Solder 100°C Lead (Pb) Free Solder 150°C 150°C 200°C 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 60-150 Seconds 217°C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6°C/ Second Max. 6°C/ Second Max. 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4142 July 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners.