2N7638-GA
Normally – OFF Silicon Carbide
Junction Transistor
VDS
VDS(ON)
ID
RDS(ON)
Features
Package
RoHS Compliant
250 °C maximum operating temperature
Temperature independent switching performance
Gate oxide free SiC switch
Suitable for connecting an anti-parallel diode
Positive temperature coefficient for easy paralleling
Low gate charge
Low intrinsic capacitance
=
=
=
=
650 V
1.4 V
8A
180 mΩ
D
S
G
G
D
S
SMD0.5 / TO – 276 (Hermetic Package)
Advantages
Applications
Low switching losses
Higher efficiency
High temperature operation
High short circuit withstand capability
Down Hole Oil Drilling, Geothermal Instrumentation
Hybrid Electric Vehicles (HEV)
Solar Inverters
Switched-Mode Power Supply (SMPS)
Power Factor Correction (PFC)
Induction Heating
Uninterruptible Power Supply (UPS)
Motor Drives
Maximum Ratings at Tj = 250 °C, unless otherwise specified
Parameter
Drain – Source Voltage
Continuous Drain Current
Gate Peak Current
Reverse Gate – Source Voltage
Reverse Drain – Source Voltage
Power Dissipation
Operating and Storage Temperature
Symbol
VDS
ID
IGM
VGS
VDS
Ptot
Tj, Tstg
Conditions
Values
650
8
5
30
40
11
-55 to 250
VGS = 0 V
TC = 158 °C
TC = 25 °C
Unit
V
A
A
V
V
W
°C
Electrical Characteristics at Tj = 250 °C, unless otherwise specified
Parameter
Symbol
Conditions
min.
Values
typ.
2.1
3.7
4.8
80
50
1.4
2.6
3.9
180
330
490
3
2.7
110
80
10
40
100
100
400
600
max.
Unit
On Characteristics
Drain – Source On Voltage
VDS(ON)
Drain – Source On Resistance
RDS(ON)
Gate Forward Voltage
VGS(FWD)
DC Current Gain
β
ID = 8 A, IG = 250 mA, Tj = 25 °C
ID = 8 A, IG = 500 mA, Tj = 175 °C
ID = 8 A, IG = 500 mA, Tj = 250 °C
ID = 8 A, IG = 250 mA, Tj = 25 °C
ID = 8 A, IG = 500 mA, Tj = 175 °C
ID = 8 A, IG = 500 mA, Tj = 250 °C
IG = 500 mA, Tj = 25 °C
IG = 500 mA, Tj = 250 °C
VDS = 5 V, ID = 10 A, Tj = 25 °C
VDS = 5 V, ID = 10 A, Tj = 250 °C
V
mΩ
V
Off Characteristics
Drain Leakage Current
Nov 2013
IDSS
VR = 650 V, VGS = 0 V, Tj = 25 °C
VR = 650 V, VGS = 0 V, Tj = 175 °C
VR = 650 V, VGS = 0 V, Tj = 250 °C
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2N7638-GA
Electrical Characteristics at Tj = 250 °C, unless otherwise specified
Parameter
Symbol
Conditions
Ciss
Coss
Crss
VDS = 35 V, VGS = 0 V,
f = 1 MHz, Tvj = 25 °C
min.
Values
typ.
max.
Unit
Dynamic Characteristics
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
720
88
88
pF
pF
pF
11
28
76
38
34
64
98
12
30
73
58
43
82
125
ns
ns
ns
ns
µJ
µJ
µJ
ns
ns
ns
ns
µJ
µJ
µJ
1
°C/W
Switching Characteristics
Turn On Delay Time
Rise Time
Turn Off Delay Time
Fall Time
Turn-On Energy Per Pulse
Turn-Off Energy Per Pulse
Total Switching Energy
Turn On Delay Time
Rise Time
Turn Off Delay Time
Fall Time
Turn-On Energy Per Pulse
Turn-Off Energy Per Pulse
Total Switching Energy
td(on)
tr
td(off)
tf
Eon
Eoff
Ets
td(on)
tr
td(off)
tf
Eon
Eoff
Ets
VDD = 400 V, ID = 10 A,
RG(on) = RG(off) = 32 Ω,
VGS = -8/15 V ,Tj = 175 ºC
Refer to Figure 10 for gate drive
current waveforms
VDD = 400 V, ID = 10 A,
RG(on) = RG(off) = 32 Ω,
VGS = -8/15 V ,Tj = 250 ºC
Refer to Figure 10 for gate drive
current waveforms
Thermal Characteristics
Thermal resistance, junction - case
RthJC
Figure 1: Typical Output Characteristics at 25 °C
Nov 2013
Figure 2: Typical Output Characteristics at 175 °C
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2N7638-GA
Figure 3: Typical Output Characteristics at 250 °C
Figure 4: Typical Gate Source I-V Characteristics vs.
Temperature
Figure 5: Normalized On-Resistance and Current Gain vs.
Temperature
Figure 6: Typical Blocking Characteristics
Figure 7: Typical Capacitance vs Drain-Source Voltage
Figure 8: Typical Turn On Energy Losses and Switching
Times vs. Temperature
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Figure 9: Typical Turn Off Energy Losses and Switching
Times vs. Temperature
Figure 10: Typical Gate-Source Switching Waveforms
Package Dimensions:
SMD-0.5/TO-276
PACKAGE OUTLINE
NOTE
1. CONTROLLED DIMENSION IS INCH. DIMENSION IN BRACKET IS MILLIMETER.
2. DIMENSIONS DO NOT INCLUDE END FLASH, MOLD FLASH, MATERIAL PROTRUSIONS
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Revision History
Date
Revision
Comments
2013/11/18
1
Updated Electrical Characteristics
2012/08/24
0
Initial release
Supersedes
Published by
GeneSiC Semiconductor, Inc.
43670 Trade Center Place Suite 155
Dulles, VA 20166
GeneSiC Semiconductor, Inc. reserves right to make changes to the product specifications and data in this document without notice.
GeneSiC disclaims all and any warranty and liability arising out of use or application of any product. No license, express or implied to any
intellectual property rights is granted by this document.
Unless otherwise expressly indicated, GeneSiC products are not designed, tested or authorized for use in life-saving, medical, aircraft
navigation, communication, air traffic control and weapons systems, nor in applications where their failure may result in death, personal
injury and/or property damage.
Nov 2013
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SPICE Model Parameters
Copy the following code into a SPICE software program for simulation of the 2N7638-GA device.
*
MODEL OF GeneSiC Semiconductor Inc.
*
*
$Revision:
1.0
$
*
$Date:
06-SEP-2013
$
*
*
GeneSiC Semiconductor Inc.
*
43670 Trade Center Place Ste. 155
*
Dulles, VA 20166
*
http://www.genesicsemi.com/index.php/hit-sic/sjt
*
*
COPYRIGHT (C) 2013 GeneSiC Semiconductor Inc.
*
ALL RIGHTS RESERVED
*
* These models are provided "AS IS, WHERE IS, AND WITH NO WARRANTY
* OF ANY KIND EITHER EXPRESSED OR IMPLIED, INCLUDING BUT NOT LIMITED
* TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A
* PARTICULAR PURPOSE."
* Models accurate up to 2 times rated drain current.
*
.model 2N7638 NPN
+ IS
3.73E-46
+ ISE
5.50E-28
+ EG
3.2
+ BF
103
+ BR
0.55
+ IKF
900
+ NF
1
+ NE
2.021
+ RB
0.26
+ RE
0.1
+ RC
0.09
+ CJC
2.77E-10
+ VJC
3.023103628
+ MJC
0.460762158
+ CJE
8.23E-10
+ VJE
2.945448229
+ MJE
0.498044294
+ XTI
3
+ XTB
-0.35
+ TRC1
1.20E-02
+ VCEO
650
+ ICRATING 8
+ MFG
GeneSiC_Semiconductor
*
* End of 2N7638-GA SPICE Model
Nov 2013
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