AFA3732Q-100L

AFA3732Q Series 1. Features of AFA3732Q Series : • • • • • • • • • • AEC-Q200 Compliant . Ferrite based SMD inductor with lower core loss. Inductance Range: 60.0nH to 300.0nH, Custom values are welcomed. High current output chokes, up to 155.0 Amp with approx. 20% roll off. Low Profile 8.00 mm Max. height . Foot Print 9.60 x 6.40 mm Max . Perfect for high density designs with limited board space. Operating frequency up to 5.0 MHz application. Operating Temperature Range -55°C to + 130°C , RoHs & HF compliance . T & R Qtys: 600 pcs , 13'' Reel ; 2. Electrical Characteristic of AFA3732Q Series: OCL 1 (nH) ± 15% ITG Part Number L @ lsat2 (nH) Min. DCR 3 (mΩ) ± 5% Isat1 4 (A) @25℃ Isat2 4 (A) @75℃ Isat3 4 (A) @100℃ Irms 5 (A) @25℃ AFA3732Q-60L 60.00 43.20 0.145 155.00 150.00 140.00 75.00 AFA3732Q-70L AFA3732Q-80L AFA3732Q-100L AFA3732Q-120L AFA3732Q-150L AFA3732Q-180L AFA3732Q-220L AFA3732Q-270L AFA3732Q-300L 70.00 80.00 100.00 120.00 150.00 180.00 220.00 270.00 300.00 50.40 57.60 72.00 86.40 108.00 129.60 158.40 194.40 216.00 0.145 0.145 0.145 0.145 0.145 0.145 0.145 0.145 0.145 124.00 118.00 95.00 78.00 60.00 54.00 38.00 30.00 26.00 120.00 110.00 88.00 71.00 54.00 50.00 36.00 28.00 24.00 115.00 102.00 82.00 67.00 52.00 46.00 34.00 26.00 22.00 75.00 75.00 75.00 75.00 75.00 75.00 75.00 75.00 75.00 3. Mechanical Dimension(Unit : mm): A B C D E F Max. Max. Max. ± 0.35 Nom. ± 0.20 xxxxx ITGYYWW 10.4 4.2 B 9.60 6.40 8.00 2.35 4.70 2.80 C Suggested Pad Layout A E a' b' a b F Notes: 3.4 Part Marking: xxx x x: xxx is inductance value in nH, x is tolerance , x is special code. ITG is Company Name , YYWW is Date Code. D 1. Open Circuit Inductance (OCL) test condition:500KHz,0.25Vrms,0Adc ,at 25 ℃. 2. L @ Isat and L @ Irms Test condition:500KHz,0.25Vrms (Ta=25 ℃). 3. The nominal DCR is measured from point "a" and "a'" to point "b" and "b'“ , as shown above on the mechanical drawing (Ta=25℃). 4. Isat1,Isat2 & Isat3 : DC current that will cause inductance to drop approximately by 20%. 5. Irms : DC current for an approximate temperature rise of 40℃ without core loss , Derating is necessary for AC currents. PCB pad layout , trace thickness and width , air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 130 ℃ under worst case operating conditions verified in the end application. ● ● New York 1 914 347 2474 ● Taipei 886 2 2698 8669 ● Kaohsiung 886 7 350 2275 Japan 81 568 85 2830 ● Shenzhen 86 755 8418 6263 ● Shanghai 86 21 5424 5141 ● Hong Kong 852 9688 9767 ● sales@ITG-Electronics.com ● www. ITG-Electronics.com Revision A.0: December 16, 2020 *Due to continuous product improvement, all specifications are subject to change without prior notice. Kindly contact an ITG field application engineer or a sales representative prior to purchase. AFA3732Q Series 4. Inductance Characteristics of AFA3732Q Series (Inductance vs Current): AFA3732Q-60L 90.0 L (nH) 25℃ 60.0 75℃ 30.0 100℃ 0.0 0.0 20.0 40.0 60.0 80.0 100.0 120.0 Direct Current (A) 140.0 160.0 180.0 200.0 AFA3732Q-70L 105.0 L (nH) 25℃ 70.0 75℃ 35.0 100℃ 0.0 0.0 20.0 40.0 60.0 80.0 100.0 Direct Current (A) 120.0 140.0 160.0 AFA3732Q-80L 120.0 L (nH) 25℃ 80.0 75℃ 40.0 100℃ 0.0 0.0 10.0 20.0 30.0 40.0 50.0 60.0 70.0 80.0 90.0 100.0 110.0 120.0 130.0 140.0 150.0 Direct Current (A) AFA3732Q-100L 150.0 25℃ L (nH) 100.0 75℃ 50.0 100℃ 0.0 0.0 ● 10.0 20.0 30.0 40.0 50.0 60.0 70.0 Direct Current (A) 80.0 90.0 100.0 110.0 120.0 ● New York 1 914 347 2474 ● Taipei 886 2 2698 8669 ● Kaohsiung 886 7 350 2275 Japan 81 568 85 2830 ● Shenzhen 86 755 8418 6263 ● Shanghai 86 21 5424 5141 ● Hong Kong 852 9688 9767 ● sales@ITG-Electronics.com ● www. ITG-Electronics.com Revision A.0: December 16, 2020 *Due to continuous product improvement, all specifications are subject to change without prior notice. Kindly contact an ITG field application engineer or a sales representative prior to purchase. AFA3732Q Series 4. Inductance Characteristics of AFA3732Q Series (Inductance vs Current): AFA3732Q-120L 150.0 L (nH) 120.0 25℃ 90.0 75℃ 60.0 100℃ 30.0 0.0 0.0 10.0 20.0 30.0 40.0 50.0 60.0 Direct Current (A) 70.0 80.0 90.0 100.0 AFA3732Q-150L 200.0 25℃ L (nH) 150.0 100.0 75℃ 50.0 100℃ 0.0 0.0 10.0 20.0 30.0 40.0 50.0 Direct Current (A) 60.0 70.0 80.0 AFA3732Q-180L 240.0 25℃ L (nH) 180.0 120.0 75℃ 60.0 100℃ 0.0 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 Direct Current (A) 45.0 50.0 55.0 60.0 65.0 AFA3732Q-220L 330.0 L (nH) 25℃ 220.0 75℃ 110.0 100℃ 0.0 0.0 ● 5.0 10.0 15.0 20.0 25.0 30.0 Direct Current (A) 35.0 40.0 45.0 50.0 ● New York 1 914 347 2474 ● Taipei 886 2 2698 8669 ● Kaohsiung 886 7 350 2275 Japan 81 568 85 2830 ● Shenzhen 86 755 8418 6263 ● Shanghai 86 21 5424 5141 ● Hong Kong 852 9688 9767 ● sales@ITG-Electronics.com ● www. ITG-Electronics.com Revision A.0: December 16, 2020 *Due to continuous product improvement, all specifications are subject to change without prior notice. Kindly contact an ITG field application engineer or a sales representative prior to purchase. AFA3732Q Series 4. Inductance Characteristics of AFA3732Q Series (Inductance vs Current): AFA3732Q-270L L (nH) 360.0 270.0 25℃ 180.0 75℃ 90.0 100℃ 0.0 0.0 5.0 10.0 15.0 30.0 35.0 40.0 AFA3732Q-300L 400.0 L (nH) 20.0 25.0 Direct Current (A) 300.0 25℃ 200.0 75℃ 100.0 100℃ 0.0 0.0 ● 4.0 8.0 12.0 16.0 20.0 Direct Current (A) 24.0 28.0 32.0 36.0 ● New York 1 914 347 2474 ● Taipei 886 2 2698 8669 ● Kaohsiung 886 7 350 2275 Japan 81 568 85 2830 ● Shenzhen 86 755 8418 6263 ● Shanghai 86 21 5424 5141 ● Hong Kong 852 9688 9767 ● sales@ITG-Electronics.com ● www. ITG-Electronics.com Revision A.0: December 16, 2020 *Due to continuous product improvement, all specifications are subject to change without prior notice. Kindly contact an ITG field application engineer or a sales representative prior to purchase. AFA3732Q Series 5.1 RELIABILITY TEST: TEST ITEMS SPECIFICATIONS TEST METHOD AND REMARKS According to J-STD-002 Method D category 3 1. Soldering temperature: 260±5℃ Solderability The electrodes shall be at least 95% covered with new solder coating 2. Solder: 99.3%Sn/0.7%Cu 3. Flux:Rosin 4. Immersion time: 5 ± 1Sec According to MIL-STD-202 Method 210 1. Preheat temperature:150℃ Resistance to Soldering Heat 1. Appearance : No damage 2. Inductance change: within ±10% of initial value 2. Preheat time:1min 3. Solder temperature:260±5℃ 4. Dipping time:10±1Sec 5. Measured at room temperature after placing for 24hours According to IEC68-2-3 Method Ca Humidity resistance 1. Appearance: No damage 2. All Electrical and mechanical parameters within tolerance 1. Temp. : 40±2℃ 2. Humidity: 93+2/-3 % RH 3. Test time: 500 ± 2H 4. The component should be stabilized at normal condition for 24 Hours before test According to IEC68-2-2 Method B(Bd) High temperature resistance 1. Appearance: No damage 2. All Electrical and mechanical parameters within tolerance 1. Temperature: 125 ± 3℃ 2. Test time: 96 +24H / -0H 3. The component should be stabilized at normal condition for 24hours before test According to IEC68-2-1 Method A(Ad) Low Temperature resistance 1. Appearance: No damage 2. All Electrical and mechanical parameters within tolerance 1. Temperature: -40 ± 3℃ 2. Test time: 96 +24H / -0H 3. The component should be stabilized at normal condition for 24hours before test According to IEC68-2-14 Method N(Nb) 1. Low-temp: -40±3℃ duration 30min Temperature cycles 1. Appearance: No damage 2. All Electrical and mechanical parameters within tolerance 2. room –temp: 25±2℃ duration 3H 3. High-temp: 125±3℃ duration 30min 4. room-temp: 25±2℃ duration3H 5. Number of cycle: 10 cycles 6. The component should be stabilized at normal condition for 24hours before test ● ● New York 1 914 347 2474 ● Taipei 886 2 2698 8669 ● Kaohsiung 886 7 350 2275 Japan 81 568 85 2830 ● Shenzhen 86 755 8418 6263 ● Shanghai 86 21 5424 5141 ● Hong Kong 852 9688 9767 ● sales@ITG-Electronics.com ● www. ITG-Electronics.com Revision A.0: December 16, 2020 *Due to continuous product improvement, all specifications are subject to change without prior notice. Kindly contact an ITG field application engineer or a sales representative prior to purchase. AFA3732Q Series 5.2 RELIABILITY TEST (AEC-Q200 Test List ): Stress NO Reference Additional Requirements Remark Test is performed except as specified in the applicable stress reference and the additional requirements in Table Not Applicable 5. 1000 hrs. at rated operating temperature (e.g. 125°C part can be stored for 1000 hrs. @ 125°C. Same applies for OK 105°C and 85°C. Unpowered. Measurement at 24±4 hours after test conclusion. 1000 cycles (-40°C to +125°C). Note: If 85°C part or 105°C part the 1000 cycles will be at that temperature. Measurement at 24±4 hours after test conclusion. 30min OK maximum dwell time at each temperature extreme. 1 min. maximum transition time. Pre- and Post-Stress Electrical Test 1 User Spec. High Temperature Exposure (Storage) 3 MIL-STD-202 Method 108 Temperature Cycling 4 JESD22 Method JA-104 Biased Humidity 7 MIL-STD-202 Method 103 1000 hours 85°C/85%RH. Unpowered. Measurement at 24±4 hours after test conclusion. OK Operational Life 8 MIL-PRF-27 1000 hrs. @ 105°C. If 85°C or 125°C part will be tested at that temperature. Measurement at 24±4 hours after test conclusion. OK External Visual 9 MIL-STD-883 Method 2009 Inspect device construction, marking and workmanship. Electrical Test not required. Follow SPEC Physical Dimension 10 JESD22 Method JB-100 Verify physical dimensions to the applicable device detail specification. Note: User(s) and Suppliers spec. Electrical Test not required. Follow SPEC Terminal Strength (Leaded) 11 MIL-STD-202 Method 211 Test leaded device lead integrity only. Conditions: A (910 g), C (1.13 kg), E (1.45 kg-mm) Not Applicable Resistance to Solvents 12 MIL-STD-202 Method 215 Note: Add Aqueous wash chemical. OKEM Clean or equivalent. Do not use banned solvents. OK Mechanical Shock 13 MIL-STD-202 Method 213 Figure 1 of Method 213. Condition C OK Vibration 14 MIL-STD-202 Method 204 5g's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8"X5" PCB, .031" thick, 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10-2000 Hz. OK Resistance to Soldering Heat 15 MIL-STD-202 Method 210 Condition B No pre-heat of samples. Note: Single Wave Solder - Procedure 2 for SMD and Procedure 1 for Leaded with solder within 1.5mm of device body. OK ESD 17 AEC-Q200-002 or ISO/DIS10605 Not Applicable Solderability 18 J-STD-002 For both Leaded & SMD. Electrical Test not required. Magnification 50X. Conditions: Leaded: Method A @ 235°C, category 3. SMD: a) Method B, 4 hrs @ 155°C dry heat @ 235°C. b) Method B @ 215°C category 3. c) Method D category 3 @ 260°C. Electrical Characterization 19 User Spec. Parametrically test per lot and sample size requirements, summary to show Min, Max, Mean and Standard deviation Follow SPEC at room as well as Min and Max operating temperatures. Flammability 20 UL-94 V-0 or V-1 Acceptable Board Flex 21 AEC-Q200-005 60 sec minimum holding time. Terminal Strength (SMD) 22 AEC-Q200-006 ● OK OK/UL Card OK OK ● New York 1 914 347 2474 ● Taipei 886 2 2698 8669 ● Kaohsiung 886 7 350 2275 Japan 81 568 85 2830 ● Shenzhen 86 755 8418 6263 ● Shanghai 86 21 5424 5141 ● Hong Kong 852 9688 9767 ● sales@ITG-Electronics.com ● www. ITG-Electronics.com Revision A.0: December 16, 2020 *Due to continuous product improvement, all specifications are subject to change without prior notice. Kindly contact an ITG field application engineer or a sales representative prior to purchase.