SM1608A-R33MHF

SM1608A Series 1. Features of SM1608A series: • • • • • • • Molded Inductor in 4.75 x 4.45mm foot print. High saturation current from distributed gap metal dust core. Low profile: 2.00mm Max. Height. Ideal for DC/DC converters, PDA, Notebook and Server Application. Operating Temperature Range: -55˚C to 125˚C (ambient + self-temperature rise) . T & R Qtys: 3000 pcs , 13'' Reel and Plastic tape: 12mm wide, 8mm pocket spacing. RoHS and HF compliant. 2. Electrical Characteristics of SM1608A series: ITG Part Number SM1608A-R020MHF SM1608A-R10MHF SM1608A-R18MHF SM1608A-R22MHF SM1608A-R33MHF SM1608A-R47MHF SM1608A-R56MHF SM1608A-R68MHF SM1608A-1R0MHF SM1608A-1R2MHF SM1608A-1R5MHF SM1608A-2R2MHF SM1608A-3R3MHF SM1608A-4R7MHF SM1608A-6R8MHF SM1608A-100MHF SM1608A-220MHF Inductance(OCL) 1 DCR DCR Isat 2 Irms 3 (uH) ± 20% 0.020+20%/-30% 0.10 0.18 0.22 0.33 0.47 0.56 0.68 1.00 1.20 1.50 2.20 3.30 4.70 6.80 10.00 22.00 (mΩ) Typ. @25℃ 0.355 3.65 4.50 5.00 7.10 10.50 10.90 11.70 19.20 23.00 25.30 40.20 70.60 103.40 162.80 256.30 330.00 (mΩ) Max. @25℃ 0.43 4.20 5.20 5.80 8.20 12.00 12.55 13.50 22.00 26.50 29.00 46.00 81.00 114.00 179.00 282.00 363.00 (A) @25℃ 78.00 22.00 21.00 12.50 12.00 9.50 9.50 9.00 7.00 7.00 5.50 5.00 4.00 3.00 2.50 2.00 1.65 (A) @25℃ 40.00 13.00 13.00 9.50 9.00 7.50 7.30 7.00 6.00 6.00 5.00 4.50 3.30 2.80 2.40 1.60 1.25 Marking 20A R10 R18 R22 R33 R47 R56 R68 1R0 1R2 1R5 2R2 3R3 4R7 6R8 100 220 3. Mechanical Dimensions of SM1608A series (unit: mm): E A B XXX F E' D D' Top View SM1608A F 5.20 G 2.20 H 2.50 H Bottom View G Recommend PCB Layout C Pad Dimension Part Marking: xxx: inductance value in uH(R: decimal point). Front View Type A B SM1608A 4.40 ± 0.35 4.20 ± 0.25 C D D’ E E’ 1.80 ± 0.20 1.50 ± 0.30 2.50 ± 0.20 0.80 ± 0.30 1.00 ± 0.10 Notes: 1. Test conditions: 100KHz, 1.0V, 25˚C ambient temperature . 2. Isat: DC current that causes inductance to drop 30% (Typ.) from OCL (Ta=25℃). 3. Irms: DC current for an approximate temperature rise of 40℃ without core loss. Derating is necessary for AC currents. PCB pad layout,trace thickness and width,air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating conditions as verified in the end application. ● ● New York 1 914 347 2474 ● Taipei 886 2 2698 8669 ● Kaohsiung 886 7 350 2275 Japan 81 568 85 2830 ● Shenzhen 86 755 8418 6263 ● Shanghai 86 21 5424 5141 ● Hong Kong 852 9688 9767 ● sales@ITG-Electronics.com ● www.ITG-Electronics.com Revision C.2: April 12 , 2022 *Due to continuous product improvement, all specifications are subject to change without prior notice. Kindly contact an ITG field application engineer or a sales representative prior to purchase. SM1608A Series 4. Inductance vs. Current vs. Temperature Rise Characteristics of SM1608A Series : 0.080 40 DC Current (Amp.) SM1608A-R18MHF 0.11 60 40 0.04 20 0.00 0 3 6 9 12 15 18 21 24 27 30 0.264 0.198 0.132 TEMP RISE(℃) INDUCTANCE(μH) TEMP RISE(℃) 0.088 INDUCTANCE(μH) 0 2 4 6 8 10 12 14 16 18 20 DC Current (Amp.) 20 0 0.000 100 60 40 20 0.044 0 2 4 6 8 10 12 14 16 18 20 0 DC Current (Amp.) 100 0.470 80 0.376 60 40 20 0.066 0.000 0.132 DC Current (Amp.) SM1608A-R33MHF 40 80 0 SM1608A-R47MHF 0.282 TEMP RISE(℃) 0.188 INDUCTANCE(μH) 60 40 20 0.094 0.000 100 80 INDUCTANCE(μH) 0.330 0 SM1608A-R22MHF INDUCTANCE(μH) 0.176 TEMP RISE(℃) 80 INDUCTANCE(μH) 0 3 6 9 12 15 18 21 24 27 30 60 DC Current (Amp.) 0.14 TEMP RISE(℃) INDUCTANCE(μH) 0.020 0.220 0.07 TEMP RISE(℃) 0.040 0.000 TEMP RISE(℃) INDUCTANCE(μH) 0.060 100 0.18 INDUCTANCE(μH) 100 90 80 70 60 50 40 30 20 0 0 0.000 10 20 80 TEMP RISE(℃) INDUCTANCE(μH) 0.004 100 TEMP RISE(℃) TEMP RISE(℃) 0.008 SM1608A-R10MHF TEMP RISE(℃) 80 60 0.012 ● 0.100 TEMP RISE(℃) INDUCTANCE(μH) 0.016 100 INDUCTANCE(μH) SM1608A-R020MHF 0.020 0 2 4 6 8 10 12 14 16 DC Current (Amp.) 0 ● New York 1 914 347 2474 ● Taipei 886 2 2698 8669 ● Kaohsiung 886 7 350 2275 Japan 81 568 85 2830 ● Shenzhen 86 755 8418 6263 ● Shanghai 86 21 5424 5141 ● Hong Kong 852 9688 9767 ● sales@ITG-Electronics.com ● www.ITG-Electronics.com Revision C.2: April 12 , 2022 *Due to continuous product improvement, all specifications are subject to change without prior notice. Kindly contact an ITG field application engineer or a sales representative prior to purchase. SM1608A Series 4. Inductance vs. Current vs. Temperature Rise Characteristics of SM1608A Series : 40 0.112 20 SM1608A-1R0MHF INDUCTANCE(μH) 0.80 0.60 0.40 TEMP RISE(℃) INDUCTANCE(μH) 1.50 INDUCTANCE(μH) 1.20 0.90 0 1 2 3 4 5 6 7 8 9 10 DC Current (Amp.) SM1608A-1R5MHF TEMP RISE(℃) INDUCTANCE(μH) 0.136 20 100 1.20 80 0.96 60 40 0 2 4 6 8 10 12 14 0 2.20 80 1.76 20 0 60 TEMP RISE(℃) 40 INDUCTANCE(μH) 20 0.24 100 0.30 100 80 0.48 0.00 60 SM1608A-1R2MHF 0.72 0 40 0 1 2 3 4 5 6 7 8 9 10 DC Current (Amp.) 40 DC Current (Amp.) 0.60 0.00 60 INDUCTANCE(μH) 0.272 0.000 20 0.20 0.00 0 0.408 TEMP RISE(℃) 4 6 8 10 12 14 16 DC Current (Amp.) 80 TEMP RISE(℃) 0 1 2 3 4 5 6 7 8 9 10 DC Current (Amp.) SM1608A-2R2MHF 100 80 TEMP RISE(℃) 1.32 0 TEMP RISE(℃) 2 TEMP RISE(℃) 1.00 0 100 TEMP RISE(℃) 0.224 0.000 ● 60 INDUCTANCE(μH) INDUCTANCE(μH) 0.544 INDUCTANCE(μH) 0.336 80 SM1608A-R68MHF INDUCTANCE(μH) TEMP RISE(℃) 0.680 TEMP RISE(℃) INDUCTANCE(μH) 0.448 100 TEMP RISE(℃) SM1608A-R56MHF 0.560 60 INDUCTANCE(μH) 0.88 40 0.44 20 0.00 0 1 2 3 4 5 6 7 DC Current (Amp.) 8 0 ● New York 1 914 347 2474 ● Taipei 886 2 2698 8669 ● Kaohsiung 886 7 350 2275 Japan 81 568 85 2830 ● Shenzhen 86 755 8418 6263 ● Shanghai 86 21 5424 5141 ● Hong Kong 852 9688 9767 ● sales@ITG-Electronics.com ● www.ITG-Electronics.com Revision C.2: April 12 , 2022 *Due to continuous product improvement, all specifications are subject to change without prior notice. Kindly contact an ITG field application engineer or a sales representative prior to purchase. SM1608A Series 4. Inductance vs. Current vs. Temperature Rise Characteristics of SM1608A Series : 0 1 4.08 2.72 SM1608A-220MHF 20 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 DC Current (Amp.) SM1608A-100MHF 100 80 6 60 TEMP RISE(℃) 4 40 INDUCTANCE(μH) 20 2 0 0 0 0.5 1 1.5 2 2.5 3 DC Current (Amp.) 3.5 0 100 17.60 13.20 60 TEMP RISE(℃) 8.80 40 2 20 1.75 1.5 1.25 1 0.25 0 4.40 0.75 INDUCTANCE(μH) TEMP RISE(℃) 80 0.5 INDUCTANCE(μH) 8 0 0 0.5 1 1.5 2 2.5 3 3.5 4 DC Current (Amp.) 22.00 0.00 80 20 1.36 40 INDUCTANCE(μH) 0.94 10 40 INDUCTANCE(μH) 60 TEMP RISE(℃) 1.88 100 60 TEMP RISE(℃) 2.82 0.00 TEMP RISE(℃) 5.44 0 ● 0 6 SM1608A-6R8MHF 6.8 INDUCTANCE(μH) 2 3 4 5 DC Current (Amp.) 80 TEMP RISE(℃) 20 100 TEMP RISE(℃) 40 INDUCTANCE(μH) 0.66 0.00 3.76 60 TEMP RISE(℃) 1.32 80 SM1608A-4R7MHF INDUCTANCE(μH) 1.98 4.70 TEMP RISE(℃) INDUCTANCE(μH) 2.64 100 INDUCTANCE(μH) SM1608A-3R3MHF 3.30 0 DC Current (Amp.) ● New York 1 914 347 2474 ● Taipei 886 2 2698 8669 ● Kaohsiung 886 7 350 2275 Japan 81 568 85 2830 ● Shenzhen 86 755 8418 6263 ● Shanghai 86 21 5424 5141 ● Hong Kong 852 9688 9767 ● sales@ITG-Electronics.com ● www.ITG-Electronics.com Revision C.2: April 12 , 2022 *Due to continuous product improvement, all specifications are subject to change without prior notice. Kindly contact an ITG field application engineer or a sales representative prior to purchase. SM1608A Series 5.PACKAGE SPECIFICATION.(UNIT:mm): (1).ENCAPSOLATION MODE: P0 P2 P1 E1 D0 D1 F Marking TOP VIEW T W B0 A0 K0 User Direction of Feed BOTTOM VIEW (2).DIMENSION(mm): W A0 B0 K0 P1 12.0±0.30 4.5±0.10 4.8±0.10 2.50±0.15 8.0±0.10 P0 P2 4.0±0.10 2.0±0.10 (3).REEL SIZE: D0 D1 F E1 T 1.5±0.10 1.5+0.10/-0 5.5±0.10 1.75±0.10 0.35±0.05 (4).PACKAGE MODE: (5).PACKAGING LIST: No. Packing Part Dimension (mm) Material Quantity 1 2 Reel Bag 330 450 X 360 X 0.075 Plastic Plastic 3000PCS / Reel 1Reel / Bag 3 Small Box 340 X 335 X 45 Paper 2Bag / Small Box 4 Middle Box 356 X 350 X 226 Paper 4Small Boxes / Middle Box 5 Outer Box 378 X 362 X 252 Paper 1Middle Box / Outer Box (6).WEIGHT: N.W: 0.20g/pcs (APPROX), TOTAL 4.80Kg(APPROX), G.W: TOTAL 8.75Kg(APPROX). (7).Storage conditions: 20℃~35℃ ,75%RH (Max.). ● ● New York 1 914 347 2474 ● Taipei 886 2 2698 8669 ● Kaohsiung 886 7 350 2275 Japan 81 568 85 2830 ● Shenzhen 86 755 8418 6263 ● Shanghai 86 21 5424 5141 ● Hong Kong 852 9688 9767 ● sales@ITG-Electronics.com ● www.ITG-Electronics.com Revision C.2: April 12 , 2022 *Due to continuous product improvement, all specifications are subject to change without prior notice. Kindly contact an ITG field application engineer or a sales representative prior to purchase. SM1608A Series 6.RELIABILITY TEST: 6.1 Mechanical Reliability Item Specification and Requirement Test Method and Remarks Solderability According to J-STD-002 Method D category 3 The surface of terminal immersed shall 1. Preheating: 160 ± 10 ℃ be minimum of 95% covered with a new 2.Solder: 99.3%Sn/0.7%Cu , Flux: Rosin coating of solder 3. Retention time: 255 ± 5 ℃ for 5 ± 0.5 seconds Resistance to Soldering Heat Inductance change: Within ±10% Without mechanical damage such as break According to MIL-STD-202 Method 210 condition J 1.Solder: 99.3%Sn/0.7%Cu 2.Reflow Peak 235 ± 5℃(30±5s)/Time above 183℃(90~120s) Vibration Inductance change: Within ± 10% Without mechanical damage such as break According to MIL-STD-202 Method 204 5g's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8"X5" PCB, .031" thick, 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10-2000 Hz. Shock Inductance change: Within ±10% Without mechanical damage such as break According to MIL-STD-202 Method 213 1. Peak value: 100 G 2. Duration of pulse: 11ms 3. 3 times in each positive and negative direction of 3 mutual perpendicular directions. 6.2 Endurance Reliability Thermal Shock According to IEC68-2-14 Method N(Nb) 1. Repeat 100 cycles as follow: (-55 ± 2 ℃; 30 ± 3 min) →(Room temp., 5 min) Inductance change: Within ± 10% → (+125 ± 2 ℃, 30 ± 3 min) Without distinct damage in appearance → (Room temp., 1 min) 2. Recovery: 48 + 4 / -0 hours of recovery under the standard condition after the test. High Temperature & Humidity Inductance change: Within ± 10% Without distinct damage in appearance Low Temperature Store Inductance change: Within ± 10% According to IEC68-2-1 Method A(Ad) Without distinct damage in appearance Store temperature: -55 ± 2 ℃,1000 + 4 / -0 hours High Temperature Store Inductance change: Within ± 10% According to MIL-STD-202 Method 108 Without distinct damage in appearance Store temperature: +125 ± 2 ℃,1000 + 4 / -0 hours ● According to MIL-STD-202 Method 103 240 hours 85°C/85%RH. Unpowered. Measurement at 24±4 hours after test conclusion. ● New York 1 914 347 2474 ● Taipei 886 2 2698 8669 ● Kaohsiung 886 7 350 2275 Japan 81 568 85 2830 ● Shenzhen 86 755 8418 6263 ● Shanghai 86 21 5424 5141 ● Hong Kong 852 9688 9767 ● sales@ITG-Electronics.com ● www.ITG-Electronics.com Revision C.2: April 12 , 2022 *Due to continuous product improvement, all specifications are subject to change without prior notice. Kindly contact an ITG field application engineer or a sales representative prior to purchase. SM1608A Series Soldering Reflow Chart Stage Precaution Recommended temperature profile Temperature profile can be referenced after confirming of adhesion , temperature of resistance to soldering heat , component size , soldering etc. sufficient . Reflow soldering Note: please refer to the latest IPC/JEDEC J-STD-020: “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices" ● ● New York 1 914 347 2474 ● Taipei 886 2 2698 8669 ● Kaohsiung 886 7 350 2275 Japan 81 568 85 2830 ● Shenzhen 86 755 8418 6263 ● Shanghai 86 21 5424 5141 ● Hong Kong 852 9688 9767 ● sales@ITG-Electronics.com ● www.ITG-Electronics.com Revision C.2: April 12 , 2022 *Due to continuous product improvement, all specifications are subject to change without prior notice. Kindly contact an ITG field application engineer or a sales representative prior to purchase.