TSD20H100CW – TSD20H200CW
Taiwan Semiconductor
20A, 100V - 200V Trench Schottky Surface Mount Rectifier
FEATURES
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KEY PARAMETERS
Patented Trench Schottky technology
Excellent high temperature stability
Low forward voltage
Low power loss/ high efficiency
High forward surge capability
RoHS Compliant
Halogen-free according to IEC 61249-2-21
APPLICATIONS
PARAMETER
VALUE
UNIT
IF
20
A
VRRM
100 - 200
V
IFSM
100
A
TJ MAX
150
°C
2
Package
TO-263AB (D PAK)
Configuration
Dual dies
● Switching mode power supply (SMPS)
● Adapters
● DC to DC converters
MECHANICAL DATA
●
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2
Case: TO-263AB (D PAK)
Molding compound meets UL 94V-0 flammability rating
Terminal: Matte tin plated leads, solderable per J-STD-002
Meet JESD 201 class 1A whisker test
Polarity: As marked
Weight: 1.60g (approximately)
2
TO-263AB (D PAK)
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
PARAMETER
SYMBOL
Marking code on the device
Repetitive peak reverse voltage
VRRM
Reverse voltage, total rms value
VR(RMS)
Forward current
Surge peak forward current, 8.3ms single
half sine wave superimposed on rated load
Critical rate of rise of off-state voltage
TSD20H TSD20H TSD20H TSD20H
UNIT
100CW 120CW 150CW 200CW
TSD20H TSD20H TSD20H TSD20H
100CW
120CW
150CW
200CW
100
120
150
200
V
70
84
105
140
V
IF
20
A
IFSM
100
A
dv/dt
10,000
V/µs
Junction temperature
TJ
- 55 to +150
°C
Storage temperature
TSTG
- 55 to +150
°C
1
Version: G2103
TSD20H100CW – TSD20H200CW
Taiwan Semiconductor
THERMAL PERFORMANCE
PARAMETER
SYMBOL
TYP
UNIT
Junction-to-lead thermal resistance
RӨJL
3.8
°C/W
Junction-to-case thermal resistance
RӨJC
2.8
°C/W
ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted)
PARAMETER
CONDITIONS
SYMBOL
TYP
MAX
UNIT
0.57
-
V
0.62
-
V
0.72
-
V
TSD20H200CW
0.77
-
V
TSD20H100CW
0.67
0.79
V
0.78
0.87
V
0.81
0.90
V
0.83
0.93
V
0.50
-
V
0.53
-
V
0.58
-
V
TSD20H200CW
0.62
-
V
TSD20H100CW
0.59
0.68
V
0.63
0.72
V
0.66
0.75
V
0.68
0.78
V
-
200
µA
-
100
µA
-
25
mA
-
15
mA
TSD20H100CW
TSD20H120CW
TSD20H150CW
TSD20H120CW
TSD20H150CW
Forward voltage per
diode
(1)
IF = 5A, TJ = 25°C
IF = 10A, TJ = 25°C
TSD20H200CW
VF
TSD20H100CW
TSD20H120CW
TSD20H150CW
TSD20H120CW
TSD20H150CW
Reverse current @
rated VR per diode
(2)
TSD20H200CW
TSD20H100CW
TSD20H120CW
TSD20H150CW
TSD20H200CW
TSD20H100CW
TSD20H120CW
TSD20H150CW
TSD20H200CW
IF = 5A, TJ = 125°C
IF = 10A, TJ = 125°C
TJ = 25°C
IR
TJ = 125°C
Notes:
1. Pulse test with PW = 0.3ms
2. Pulse test with PW = 30ms
ORDERING INFORMATION
ORDERING CODE(1)
TSD20HxCW
PACKAGE
2
TO-263AB (D PAK)
PACKING
800 / Tape & Reel
Notes:
1. "x" defines voltage from 100V(TSD20H100CW) to 200V(TSD20H200CW)
2
Version: G2103
TSD20H100CW – TSD20H200CW
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.1 Forward Current Derating Curve
Fig.2 Typical Junction Capacitance
10000
20
TSD20H100CW
CAPACITANCE (pF)
15
10
1000
TSD20H120CW
TSD20H200CW
100
5
TSD20H150CW
0
f=1.0MHz
Vsig=50mVp-p
10
0
25
50
75
100
CASE TEMPERATURE
125
150
0.1
1
10
REVERSE VOLTAGE (V)
(oC)
Fig.4 Typical Forward Characteristics
100
TSD20H100CW
10
1
INSTANTANEOUS FORWARD CURRENT (A)
INSTANTANEOUS REVERSE CURRENT (mA)
Fig.3 Typical Reverse Characteristics
TJ=150oC
TJ=125oC
TJ=100oC
0.1
0.01
0.001
TJ=25oC
0.0001
10
20
30
40
50
60
70
80
90
100
100
100
10
TSD20H100CW
10
1
0.1
1
UF1DLW
TJ=150oC
TJ=125°C
TJ=125oC
TJ=25°C
(A)
AVERAGE FORWARD CURRENT (A)
25
TJ=100oC
0.01
0.1
TJ=25oC
Pulse width
0.001
0.01 0.3
0.0
0.4
0.5
0.2
0.6
0.4
0.7
0.8
0.9
0.6
0.8
1
1.1
1.0
FORWARD VOLTAGE (V)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
3
Version: G2103
1.2
TSD20H100CW – TSD20H200CW
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.6 Typical Forward Characteristics
TSD20H120CW
TJ
1
TJ=125oC
0.1
TJ
=100oC
0.01
0.001
TJ=25oC
0.0001
TJ=150oC
TJ=125°C
0.1
1
TJ=25oC
0.3
0.01
INSTANTANEOUS FORWARD CURRENT (A)
INSTANTANEOUS REVERSE CURRENT (mA)
TJ=150oC
TJ=100oC
0.001
TJ=25oC
0.0001
30
40
50
60
70
80
90
0.4
0.5
0.2
0.6
0.7
0.4
0.8
0.9
0.6
1
0.8
1.1
1.2
1
Fig.8 Typical Forward Characteristics
0.1
20
Pulse width
0.001
FORWARD VOLTAGE (V)
TJ=125oC
10
TJ=100oC
0
10
0.01
TJ=25°C
TJ=125oC
0.01
0.1
Fig.7 Typical Reverse Characteristics
1
UF1DLW
101
10
20
30
40
50
60
70
80
90 100
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
TSD20H150CW
TSD20H120CW
100
10
TSD20H150CW
UF1DLW
10 1
TJ=150oC
TJ=125°C
TJ=100oC
0.01
0.1
TJ=25oC
0.001
0.01
0.3
0
100
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
TJ=25°C
TJ=125oC
0.1
1
(A)
10
=150oC
100
10
(A)
100
INSTANTANEOUS FORWARD CURRENT (A)
INSTANTANEOUS REVERSE CURRENT (mA)
Fig.5 Typical Reverse Characteristics
0.4
0.2
0.5
0.6
0.4
0.7
0.8
Pulse width
0.9
0.6
0.8
1
1.1
1
FORWARD VOLTAGE (V)
4
Version: G2103
1.2
TSD20H100CW – TSD20H200CW
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.10 Typical Forward Characteristics
10
INSTANTANEOUS FORWARD CURRENT (A)
INSTANTANEOUS REVERSE CURRENT (mA)
Fig.9 Typical Reverse Characteristics
TSD20H200CW
TJ=150oC
1
TJ=125oC
0.1
0.01
TJ=100oC
0.001
0.0001
TJ=25oC
0.00001
10
20
30
40
50
60
70
80
90
100
100
10 TSD20H200CW
UF1DLW
10 1
TJ=150oC
TJ=125°C
0.1
1
TJ=100oC
0.01
0.1
TJ=25oC
0.001
0.01
0.3
0
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
TJ=25°C
TJ=125oC
0.4
0.2
0.5
0.6
0.4
0.7
0.8
Pulse width
0.9
0.6
0.8
1
1.1
1
FORWARD VOLTAGE (V)
5
Version: G2103
1.2
TSD20H100CW – TSD20H200CW
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
2
TO-263AB (D PAK)
SUGGESTED PAD LAYOUT
MARKING DIAGRAM
6
P/N
= Marking Code
G
= Green Compound
YWW
= Date Code
F
= Factory Code
Version: G2103
TSD20H100CW – TSD20H200CW
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability
for application assistance or the design of Purchasers’ products.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
7
Version: G2103
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