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BLM8G0710S-60PBGY

BLM8G0710S-60PBGY

  • 厂商:

    AMPLEON(安谱隆)

  • 封装:

    SOT-1211-2

  • 描述:

    FET RF 2CH 65V 957.5MHZ 16HSOP

  • 数据手册
  • 价格&库存
BLM8G0710S-60PBGY 数据手册
BLM8G0710S-60PB; BLM8G0710S-60PBG LDMOS 2-stage power MMIC Rev. 3 — 13 September 2018 Product data sheet 1. Product profile 1.1 General description The BLM8G0710S-60PB(G) is a dual section, 2-stage power MMIC using Ampleon’s state of the art GEN8 LDMOS technology. This multiband device is perfectly suited as general purpose driver or small cell final in the frequency range from 700 MHz to 1000 MHz. Available in gull wing or straight lead outline. Table 1. Performance Typical RF performance at Tcase = 25 °C. Test signal: 3GPP test model 1; 64 DPCH; PAR = 9.9 dB at 0.01% probability on CCDF; per section unless otherwise specified in a class-AB production circuit. Test signal single carrier W-CDMA f VDS PL(AV) Gp ηD ACPR5M (MHz) (V) (W) (dB) (%) (dBc) 957.5 28 6 34.7 26 40 1.2 Features and benefits          Designed for broadband operation (frequency 700 MHz to 1000 MHz) High section-to-section isolation enabling multiple combinations Integrated temperature compensated bias Biasing of individual stages is externally accessible Integrated ESD protection Excellent thermal stability High power gain On-chip matching for ease of use For RoHS compliance see the product details on the Ampleon website 1.3 Applications  RF power MMIC for W-CDMA base stations in the 700 MHz to 1000 MHz frequency range. Possible circuit topologies are the following as also depicted in Section 8.1:  Dual section or single ended  Doherty  Quadrature combined  Push-pull BLM8G0710S-60PB(G) LDMOS 2-stage power MMIC 2. Pinning information 2.1 Pinning pin 1 index VDS(A1) VGS(A2) VGS(A1) RF_IN_A n.c. n.c. n.c. n.c. n.c. n.c. RF_IN_B VGS(B1) VGS(B2) VDS(B1) 1 2 3 4 5 6 7 16 RF_OUT_ VDS(A2) 8 9 10 11 12 13 14 15 RF_OUT_ VDS(B2) amp00601 Transparent top view The exposed backside of the package is the ground terminal of the device. Fig 1. Pin configuration 2.2 Pin description Table 2. Pin description Symbol Pin Description VDS(A1) 1 drain-source voltage of section A, driver stage (A1) VGS(A2) 2 gate-source voltage of section A, final stage (A2) VGS(A1) 3 gate-source voltage of section A, driver stage (A1) RF_IN_A 4 RF input section A n.c. 5 not connected n.c. 6 not connected n.c. 7 not connected n.c. 8 not connected n.c. 9 not connected n.c. 10 not connected RF_IN_B 11 RF input section B VGS(B1) 12 gate-source voltage of section B, driver stage (B1) VGS(B2) 13 gate-source voltage of section B, final stage (B2) VDS(B1) 14 drain-source voltage of section B, driver stage (B1) BLM8G0710S-60PB_S-60PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 3 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 2 of 21 BLM8G0710S-60PB(G) LDMOS 2-stage power MMIC Table 2. Pin description …continued Symbol Pin Description RF_OUT_B/VDS(B2) 15 RF output section B / drain-source voltage of section B, final stage (B2) RF_OUT_A/VDS(A2) 16 RF output section A / drain-source voltage of section A, final stage (A2) GND flange RF ground 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BLM8G0710S-60PB - plastic, heatsink small outline package; 16 leads (flat) SOT1211-3 plastic, heatsink small outline package; 16 leads SOT1212-3 BLM8G0710S-60PBG - 4. Block diagram VDS(A1) RF_IN_A RF_OUT_A / VDS(A2) VGS(A1) VGS(A2) TEMPERATURE COMPENSATED BIAS VGS(B1) VGS(B2) TEMPERATURE COMPENSATED BIAS RF_IN_B RF_OUT_B / VDS(B2) VDS(B1) aaa-009323 Fig 2. Block diagram 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDS VGS Tstg storage temperature Min Max Unit drain-source voltage - 65 V gate-source voltage 0.5 +13 V 65 +150 C - 225 C - 150 C Tj junction temperature Tcase case temperature [1] Conditions [1] Continuous use at maximum temperature will affect the reliability. For details refer to the online MTF calculator. BLM8G0710S-60PB_S-60PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 3 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 3 of 21 BLM8G0710S-60PB(G) LDMOS 2-stage power MMIC 6. Thermal characteristics Table 5. Thermal characteristics Measured for total device. Symbol Rth(j-c) [1] Parameter Conditions Value Unit final stage; Tcase = 90 C; PL = 5 W [1] thermal resistance from junction to case 0.9 K/W driver stage; Tcase = 90 C; PL = 5 W [1] 3.7 K/W When operated with a CW signal. 7. Characteristics Table 6. DC characteristics Tcase = 25 °C; per section unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 65 - - V Final stage V(BR)DSS drain-source breakdown voltage VGS = 0 V; ID = 482 A VGSq gate-source quiescent voltage VDS = 28 V; ID = 240 mA 1.5 2 2.7 V VDS = 28 V; ID = 240 mA [1] 1.7 2.65 3.6 V [1] - 1 - % IDq/T quiescent drain current variation with temperature 40 C  Tcase  +85 C IDSS drain leakage current VGS = 0 V; VDS = 28 V - - 1.4 A IDSX drain cut-off current VGS = 5.65 V; VDS = 10 V - 8.3 - A IGSS gate leakage current VGS = 1.0 V; VDS = 0 V - - 140 nA Driver stage V(BR)DSS drain-source breakdown voltage VGS = 0 V; ID = 120.6 A 65 - - V VGSq gate-source quiescent voltage VDS = 28 V; ID = 60 mA 1.5 2 2.7 V VDS = 28 V; ID = 60 mA [2] 1.7 2.65 3.6 V [2] - 1 - % IDq/T quiescent drain current variation with temperature 40 C  Tcase  +85 C IDSS drain leakage current VGS = 0 V; VDS = 28 V - - 1.4 A IDSX drain cut-off current VGS = 5.65 V; VDS = 10 V - 2.1 - A IGSS gate leakage current VGS = 1.0 V; VDS = 0 V - - 140 nA [1] In production circuit with 1.3 k gate feed resistor. [2] In production circuit with 1.2 k gate feed resistor. Table 7. RF Characteristics Typical RF performance at Tcase = 25 °C; VDS = 28 V; IDq1 = 60 mA (driver stage); IDq2 = 240 mA (final stage); PL(AV) = 6 W; unless otherwise specified, measured in an Ampleon wideband straight lead production circuit. Symbol Parameter Test signal: single carrier W-CDMA Gp D power gain drain efficiency Conditions Min Typ Max Unit f = 730.5 MHz - 35.6 - dB f = 957.5 MHz 33.2 34.7 36.2 dB f = 730.5 MHz - 23.4 - % f = 957.5 MHz 21 26 - % [1] BLM8G0710S-60PB_S-60PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 3 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 4 of 21 BLM8G0710S-60PB(G) LDMOS 2-stage power MMIC Table 7. RF Characteristics …continued Typical RF performance at Tcase = 25 °C; VDS = 28 V; IDq1 = 60 mA (driver stage); IDq2 = 240 mA (final stage); PL(AV) = 6 W; unless otherwise specified, measured in an Ampleon wideband straight lead production circuit. Symbol Parameter Conditions Min Typ Max Unit RLin input return loss f = 957.5 MHz - 17 10 dB ACPR5M adjacent channel power ratio (5 MHz) f = 730.5 MHz - 39.5 - f = 957.5 MHz - 40 34.5 dBc output peak-to-average ratio f = 730.5 MHz - 8 - dB f = 957.5 MHz 6.7 8 - dB PARO Test signal: CW dBc [2] s21 phase response difference between sections 10 - +10 deg s212 insertion power gain difference between sections 0.5 - +0.5 dB [1] 3GPP test model 1; 64 DPCH; PAR = 9.9 dB at 0.01% probability on CCDF. [2] f = 957.5 MHz. 8. Application information Table 8. Typical performance Test signal: 1-tone pulsed CW; RF performance at Tcase = 25 °C; VDS = 28 V; IDq = 600 mA unless otherwise specified, measured in an Ampleon wideband f = 700 MHz to 1000 MHz class AB application circuit. Symbol Parameter PL(1dB) Conditions Min Typ Max Unit output power at 1 dB gain compression f = 800 MHz - 74 - W D drain efficiency at PL(1dB); f = 800 MHz - 58.4 - % Gp power gain PL(AV) = 11.2 W; f = 800 MHz - 36.5 - dB Bvideo video bandwidth 2-tone CW; PL(AV) = 40 W; f = 881.5 MHz - 154 - MHz Gflat gain flatness PL(AV) = 11.2 W; f = 700 MHz to 1000 MHz - 0.3 - dB G/T gain variation with temperature f = 800 MHz - 0.03 - dB/C s122 isolation between sections A and B; PL(AV) = 8 W; f = 800 MHz - 24.5 - dB K Rollett stability factor T = 40 C; f = 0.1 GHz to 3 GHz - >1.2 - BLM8G0710S-60PB_S-60PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 3 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 5 of 21 BLM8G0710S-60PB(G) LDMOS 2-stage power MMIC 40 mm 10 μF Ferrite 120 pF 1.2 kΩ 1.3 kΩ 10 μF 10 μF 40 mm BLM8G0710S-60PB 10 μF 100 Ω 10 μF 10 μF 4.3 pF 3.9 pF 4.7 pF 4.3 pF 3.9 pF 10 μF 1.3 kΩ 1.2 kΩ 120 pF Ferrite 10 μF amp00006 Printed-Circuit Board (PCB): Rogers 4350; thickness = 0.508 mm. Fig 3. Component layout for class-AB application circuit BLM8G0710S-60PB_S-60PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 3 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 6 of 21 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx BLM8G0710S-60PB_S-60PBG Product data sheet VGS VDS 28 V BLM8G0710S-60PB Single ended class AB compact board schematics 700 MHz - 1000 MHz 10 —F 50 V Ferrite 10 —F 50 V VDS 28 V 1.3 kȍ 10 —F 6.3 V 120 pF 0805 VDS(A1) 1 BLM8G0710S-60PB PathA VGS(A2) 2 VGS(A1) 3 1.2 kȍ 10 —F 6.3 V RF_IN_A 4 n.c. n.c. RF in 5 16 6 7 100 ȍ n.c. n.c. n.c. 10 —F 6.3 V Driver RF power FET Final RF power FET Driver RF power FET Final RF power FET 4.3 pF 0805 3.9 pF 0805 4.3 pF 0805 4.7 pF 3.9 pF 0805 0805 RF out 8 15 9 10 RF_IN_B 11 1.2 kȍ Final clamped RF sense FET Driver clamped RF sense FET Final clamped RF sense FET VGS(B1) 12 VGS(B2) 13 1.3 kȍ VDS(B1) 14 7 of 21 © Ampleon Netherlands B.V. 2018. All rights reserved. BLM8G0710S-60PB PathB 10 —F 50 V 120 pF 0805 Ferrite 10 —F 50 V amp00007 Fig 4. Electrical schematic LDMOS 2-stage power MMIC 10 —F 6.3 V BLM8G0710S-60PB(G) Rev. 3 — 13 September 2018 All information provided in this document is subject to legal disclaimers. n.c. Driver clamped RF sense FET BLM8G0710S-60PB(G) LDMOS 2-stage power MMIC 8.1 Possible circuit topologies -3 dB / Φ-0° In A Out A In Out -3 dB / Φ-0° In B Out B amp00514 Fig 5. Dual section or single ended Splitter In Combiner -3 dB / Φ-0° λ/4 λ/4 -3 dB / Φ-90° Out amp00603 Fig 6. Doherty 3 dB Coupler 3 dB Coupler In -3 dB / Φ-0° -3 dB / Φ-90° Out amp00515 Fig 7. Quadrature combined BLM8G0710S-60PB_S-60PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 3 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 8 of 21 BLM8G0710S-60PB(G) LDMOS 2-stage power MMIC Splitter In Combiner -3 dB / Φ-0° λ/2 λ/2 -3 dB / Φ-180° Out amp00516 Fig 8. Push-pull 8.2 Ruggedness in class-AB operation The BLM8G0710S-60PB and BLM8G0710S-60PBG are capable of withstanding a load mismatch corresponding to VSWR = 30 : 1 through all phases under the following conditions: VDS = 32 V; IDq1 = 60 mA; IDq2 = 192 mA; Pi = 13 dBm, Pi is measured at CW and corresponding to PL(3dB) under ZS = 50 ; f = 840 MHz. 8.3 Impedance information Table 9. Typical impedance tuned for maximum output power Measured load-pull data per section; test signal: pulsed CW; Tcase = 25 °C; VDS = 28 V; IDq1 = 60 mA; IDq2 = 240 mA; tp = 100 μs; δ = 10 %; ZS = 50 Ω. Typical values unless otherwise specified. tuned for maximum output power tuned for maximum power added efficiency f ZL Gp(max) PL ηadd AM-PM ZL conversion Gp(max) PL ηadd AM-PM conversion (MHz) (Ω) (dB) (dBm) (%) (deg) (Ω) (dB) (dBm) (%) (deg) BLM8G0710S-60PB 700 3.0 + j2.1 36.1 47.2 55.1 2.4 4.2 + j5.2 37.6 45.3 65.7 1.5 720 3.0 + j1.7 35.9 47.3 53.4 2.5 4.4 + j5.0 37.8 45.4 64.6 1.0 740 3.0 + j1.7 35.8 47.4 54.8 3.0 4.2 + j4.5 37.5 45.7 64.7 0.2 760 3.0 + j1.3 35.4 47.4 53.5 3.0 4.1 + j4.8 37.2 45.4 64.3 0.9 780 3.3 + j1.3 35.3 47.5 55.0 2.4 4.0 + j4.4 37.0 45.7 63.7 1.3 800 3.2 + j0.9 35.2 47.5 53.8 3.1 3.9 + j4.2 37.0 45.8 64.0 1.0 820 3.3 + j1.0 35.0 47.5 54.9 2.4 4.1 + j3.8 36.7 46.0 63.6 0.1 840 3.4 + j0.5 34.8 47.5 53.2 2.3 3.8 + j4.0 36.8 45.7 63.4 1.3 860 3.5 + j0.5 34.7 47.5 53.8 2.1 3.8 + j3.8 36.7 45.7 63.1 1.2 880 3.4 + j0.4 34.8 47.4 53.2 1.8 4.0 + j3.5 36.7 45.9 63.1 0.3 900 3.4 + j0.3 34.7 47.4 53.4 2.1 3.7 + j3.6 36.8 45.7 63.0 0.9 920 3.4 + j0.4 34.7 47.4 54.4 1.4 3.8 + j3.7 36.8 45.5 63.0 0.5 940 3.5 + j0.0 34.5 47.3 52.9 1.1 3.5 + j3.2 36.6 45.7 62.3 0.5 960 3.5  j0.1 34.2 47.3 52.7 1.3 3.5 + j3.1 36.4 45.7 62.0 0.3 980 3.5  j0.1 34.2 47.3 53.9 0.4 3.4 + j2.8 36.2 45.8 62.2 1.0 BLM8G0710S−60PBG BLM8G0710S-60PB_S-60PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 3 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 9 of 21 BLM8G0710S-60PB(G) LDMOS 2-stage power MMIC Table 9. Typical impedance tuned for maximum output power …continued Measured load-pull data per section; test signal: pulsed CW; Tcase = 25 °C; VDS = 28 V; IDq1 = 60 mA; IDq2 = 240 mA; tp = 100 μs; δ = 10 %; ZS = 50 Ω. Typical values unless otherwise specified. tuned for maximum output power tuned for maximum power added efficiency f ZL Gp(max) PL ηadd AM-PM ZL conversion Gp(max) PL ηadd AM-PM conversion (MHz) (Ω) (dB) (dBm) (%) (deg) (Ω) (dB) (dBm) (%) (deg) 700 3.0 + j0.6 36.3 47.5 55.1 0.3 4.5 + j3.6 37.7 45.8 66.1 3.2 720 3.0 + j0.6 36.4 47.5 55.6 0.6 4.4 + j3.1 37.7 46.1 65.7 2.2 740 2.9 + j0.3 35.9 47.6 54.6 1.9 4.1 + j3.4 37.3 45.8 65.4 2.0 760 3.0 + j0.2 35.6 47.7 56.0 0.6 4.4 + j2.8 37.0 46.1 65.1 2.2 780 3.3  j0.1 35.5 47.7 55.9 0.9 4.3 + j2.9 37.0 46.0 64.7 2.9 800 3.3  j0.5 35.4 47.7 54.4 0.8 3.9 + j2.6 37.0 46.1 64.4 3.2 820 3.3  j0.5 35.8 47.7 55.2 1.3 4.1 + j2.3 37.3 46.2 64.0 1.8 840 3.3  j0.5 35.5 47.6 55.4 1.3 4.1 + j2.1 36.6 46.3 63.7 1.3 860 3.5  j0.9 34.5 47.7 54.9 0.6 3.8 + j2.0 35.9 46.3 63.7 2.5 880 3.4  j1.0 34.7 47.6 54.2 0.1 3.6 + j2.0 36.4 46.1 63.1 3.2 900 3.4  j1.2 34.8 47.6 54.2 0.0 3.7 + j1.8 36.5 46.1 63.3 2.7 920 3.4  j1.1 35 47.6 55.4 0.4 3.7 + j1.8 36.6 45.9 63.2 1.9 940 3.5  j1.4 34.7 47.5 54.7 0.3 3.8 + j1.6 36.4 46.0 62.8 1.2 960 3.5  j1.6 34.4 47.5 54.9 0.4 3.5 + j1.3 36.1 46.0 62.8 2.2 8.4 Graphs amp00008 40 Gp (dB) (1) 30 0 amp00009 38 RLin (dB) RLin (dB) -10 36 (1) -6 20 -20 34 (2) -12 10 -30 32 (2) 0 200 400 600 800 1000 f (MHz) -40 1200 Tcase = 25 C; VDS = 28 V; IDq1 = 60 mA; IDq2 = 240 mA; PL = 2 W. Per section. -18 30 700 750 800 (1) magnitude of Gp (2) magnitude of RLin (2) magnitude of RLin Wideband power gain and input return loss as function of frequency; typical values 850 900 950 f (MHz) -24 1000 Tcase = 25 C; VDS = 28 V; IDq1 = 60 mA; IDq2 = 240 mA; PL = 2 W. Per section. (1) magnitude of Gp Fig 9. 0 Gp (dB) Fig 10. In-band power gain and input return loss as function of frequency; typical values BLM8G0710S-60PB_S-60PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 3 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 10 of 21 BLM8G0710S-60PB(G) LDMOS 2-stage power MMIC amp00010 40 80 Gp (dB) ηD (%) 38 amp00011 (1) (2) (3) (4) 8 ____ φs21/φs21(norm) (deg) 60 4 40 0 20 -4 0 -8 Gp 36 (1) (1) (2) (2) (3) (3) (4) (4) 34 ηD 32 25 30 35 40 45 PL (dBm) 50 25 Tcase = 25 C; VDS = 28 V; IDq1 = 60 mA; IDq2 = 240 mA. Per section. 30 40 45 PL (dBm) 50 Normalized at PL = 22 dBm; Tcase = 25 C; VDS = 28 V; IDq1 = 60 mA; IDq2 = 240 mA. Per section. (1) f = 700 MHz (1) f = 700 MHz (2) f = 800 MHz (2) f = 800 MHz (3) f = 900 MHz (3) f = 900 MHz (4) f = 1000 MHz (4) f = 1000 MHz Fig 11. Power gain and drain efficiency as function of output power; typical values 35 Fig 12. Normalized phase response as a function of output power; typical values amp00012 -10 IMD (dBc) (1) (2) IMD3 -30 IMD5 (1) (2) IMD7 (1) (2) -50 -70 -90 1 10 102 tone spacing (MHz) 103 Tcase = 25 C; VDS = 28 V; IDq1 = 60 mA; IDq2 = 240 mA; f = 881.5 MHz; 2-tone CW, PL = 20 W. Per section. (1) IMD low (2) IMD high Fig 13. Intermodulation distortion as a function of tone spacing; typical values BLM8G0710S-60PB_S-60PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 3 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 11 of 21 BLM8G0710S-60PB(G) LDMOS 2-stage power MMIC amp00013 -20 ACPR (dBc) 50 ηD (%) -30 -40 ACPR5M -50 amp00014 60 |s12|2 (dB) 40 48 30 36 20 24 10 12 ηD ACPR10M -60 -70 0 30 32.5 35 37.5 40 42.5 PL (dBm) 45 Tcase = 25 C; VDS = 28 V; IDq1 = 60 mA; IDq2 = 240 mA: f = 900 MHz; 1-carrier W-CDMA; test model 1; PAR = 9.9 dB at 0.01% probability on CCDF. Per section Fig 14. Adjacent channel power ratio and drain efficiency as function of output power; typical values 0 500 600 700 800 900 1000 1100 f (MHz) 1200 Tcase = 25 C; VDS = 28 V; IDq1 = 40 mA; IDq2 = 260 mA, measured on evaluation board. Fig 15. Section A to B isolation as a function of frequency; typical values BLM8G0710S-60PB_S-60PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 3 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 12 of 21 BLM8G0710S-60PB(G) LDMOS 2-stage power MMIC 9. Package outline SOT1211-3 (18.01) (2.15) (15.44) (0.75) 7.45 15 16 A L 0.05 A R1.38 9.96(1) 16.00 9.78 15.96 B0.20 (7.04) (4.47) E 0.10 (4) P2.00 0.1Z R0.16 max. 1 14 1.50 1.00 (12x) 0.35 (14x) (3) 20.75(1) R1.00 0.10 metal protrusion 4x (ground) in corners (2) 1.57 (5) 0.22 B0.05 L 0.25 B +0.08 3.92 - 0.03 L 0.05 B R0.32 B 20.57 Min. 5.5 Min. 7.8 (0.20) molding compound around the perimeter of the heatsink R0.60(4x) pin 17 (6) L 0.25 B 5.50 (3) Min. 15.5 Min. 18.5 Package outline drawing: units in mm. Tolerances unless otherwise stated: Revision: Angle: B 1° Revision date: Dimension: B 0.05 SOT1211-3 Third angle projection 1 7/26/2018 Sheet 1 of 2 Fig 16. Package outline SOT1211-3 (sheet 1 of 2) BLM8G0710S-60PB_S-60PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 3 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 13 of 21 BLM8G0710S-60PB(G) LDMOS 2-stage power MMIC SOT1211-3 Drawing Notes Description Items Dimensions are excluding mold protrusion. Areas located adjacent to the leads have a maximum mold protrusion of 0.25 (1) mm (per side) and 0.62 mm max. in length. In between the 14 leads the protrusion is 0.25 mm. max. At all other areas the (2) The metal protrusion (tie bars) in the corner will not stick out of the molding compound protrusions (detail A). (3) The lead dambar (metal) protrusions are not included. Add 0.14 mm max to the total lead dimension at the dambar location. (4) The lead coplanarity over all leads is 0.1 mm maximum. (5) Dimension is measured 0.5 mm from the edge of the top package body. (6) The hatched area indicates the exposed metal heatsink. (7) The leads and exposed heatsink are plated with matte Tin (Sn). mold protrusion is maximum 0.15 mm per side. See also detail B. location of metal protrusion (2) DETAIL A SCALE 25:1 B A 0 .2 a 5m x. ( 1) lead dambar location 0 0 .6 2m 5 0.1 ax ma x. m .2 5 ax . (1 ) (1) (1) DETAIL B SCALE 50:1 Package outline drawing: units in mm. Tolerances unless otherwise stated: Revision: Angle: B 1° Revision date: Dimension: B 0.05 SOT1211-3 Third angle projection 1 7/26/2018 Sheet 2 of 2 Fig 17. Package outline SOT1211-3 (sheet 2 of 2) BLM8G0710S-60PB_S-60PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 3 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 14 of 21 BLM8G0710S-60PB(G) LDMOS 2-stage power MMIC SOT1212-3 (18.01) 0.22 B0.05 (15.44) (2.15) 7.45 A (0.75) 16 L 0.05 A 15 9.78 9.96(1) (4.47) (7.04) 16 13.2 B.30 R1.38 P2 0.1Z C metal protrusion 4x (ground) in corners (2) 1.5 1 (12x) R0.16 max. 14 1 0.35 (14x) (3) L 0.25 B 20.75 (1) L 0.05 B 3.92 R1 DETAIL C SCALE 25:1 +.08 - .03 R0.32 B 20.57 0.10 0.95 B0.15 H 3.0° Min. 5.5 Min. 7.8 (0.20) compound rim all around the perimeter of the heatsink +4° - 3° 0.00 +- 0.06 0.02 (6) pin 17 (4) Gage plane 0.35 (7) Seating plane R0.60 (4x) L 0.25 B 5.5 (3) Min. 15.5 Min. 18.5 Package outline drawing: units in mm. Tolerances unless otherwise stated: Revision: Angle: B 1° Revision date: Dimension: B 0.05 SOT1212-3 Third angle projection 1 7/26/2018 Sheet 1 of 2 Fig 18. Package outline SOT1212-3 (sheet 1 of 2) BLM8G0710S-60PB_S-60PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 3 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 15 of 21 BLM8G0710S-60PB(G) LDMOS 2-stage power MMIC SOT1212-3 Drawing Notes Description Items Dimensions are excluding mold protrusion. Areas located adjacent to the leads have a maximum mold protrusion of 0.25 (1) mm (per side) and 0.62 mm max. in length. In between the 14 leads the protrusion is 0.25 mm max. At all other areas the (2) The metal protrusion (tie bars) in the corner will not stick out of the molding compound protrusions (detail A). mold protrusion is maximum 0.15 mm per side. See also detail B. (3) The lead dambar (metal) protrusions are not included. Add 0.14 mm max to the total lead dimension at the dambar location. (4) The hatched area indicated the exposed heatsink. (5) The leads and exposed heatsink are plated with matte Tin (Sn). Dimension is measured with respect to the bottom of the heatsink Datum H. Positive value means that the bottom of the (6) heatsink is higher than the bottom of the lead. (7) Gage plane (foot length) to be measured from the seating plane. location of metal protrusion (2) B DETAIL A SCALE 25:1 A 0 .6 2m ax . (1) lead dambar location 5 0.2 x ma ) .(1 5 0.1 x ma . (1 ) DETAIL B SCALE 50:1 Package outline drawing: units in mm. Tolerances unless otherwise stated: Revision: Angle: B 1° Revision date: Dimension: B 0.05 SOT1212-3 Third angle projection 1 7/26/2018 Sheet 2 of 2 Fig 19. Package outline SOT1212-3 (sheet 2 of 2) BLM8G0710S-60PB_S-60PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 3 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 16 of 21 BLM8G0710S-60PB(G) LDMOS 2-stage power MMIC 10. Handling information CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling electrostatic sensitive devices. Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or equivalent standards. Table 10. ESD sensitivity ESD model Class Charged Device Model (CDM); According to ANSI/ESDA/JEDEC standard JS-002 C1 [1] Human Body Model (HBM); According to ANSI/ESDA/JEDEC standard JS-001 1B [2] [1] CDM classification C1 is granted to any part that passes after exposure to an ESD pulse of 250 V. [2] HBM classification 1B is granted to any part that passes after exposure to an ESD pulse of 500 V. 11. Abbreviations Table 11. Abbreviations Acronym Description AM Amplitude Modulation 3GPP 3rd Generation Partnership Project CCDF Complementary Cumulative Distribution Function CW Continuous Wave DPCH Dedicated Physical CHannel ESD ElectroStatic Discharge GEN8 Eighth Generation LDMOS Laterally Diffused Metal Oxide Semiconductor MMIC Monolithic Microwave Integrated Circuit MTF Median Time to Failure PAR Peak-to-Average Ratio PM Phase Modulation RoHS Restriction of Hazardous Substances VSWR Voltage Standing Wave Ratio W-CDMA Wideband Code Division Multiple Access BLM8G0710S-60PB_S-60PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 3 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 17 of 21 BLM8G0710S-60PB(G) LDMOS 2-stage power MMIC 12. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes BLM8G0710S-60PB_S-60PBG v.3 20180913 Product data sheet - BLM8G0710S-60PB_ S-60PBG v.2 Modifications • • Figure 1 on page 2: figure updated Table 3 on page 3: package outline versions changed to SOT1211-3 and SOT1212-3 • • • • • • • Figure 3 on page 6: figure updated • Table 10 on page 17: added table Figure 5 on page 8: figure updated Figure 6 on page 8: figure updated Figure 7 on page 8: figure updated Figure 8 on page 9: figure updated Table 9 on page 9: typo corrected Section 9 on page 13: package outline versions changed from SOT1211-2 and SOT1212-2 to SOT1211-3 and SOT1212-3 BLM8G0710S-60PB_S-60PBG v.2 20160322 Product data sheet - BLM8G0710S-60PB_ S-60PBG v.1 BLM8G0710S-60PB_S-60PBG v.1 20160225 Product data sheet - - BLM8G0710S-60PB_S-60PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 3 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 18 of 21 BLM8G0710S-60PB(G) LDMOS 2-stage power MMIC 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.ampleon.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Ampleon does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Ampleon sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between Ampleon and its customer, unless Ampleon and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the Ampleon product is deemed to offer functions and qualities beyond those described in the Product data sheet. 13.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon takes no responsibility for the content in this document if provided by an information source outside of Ampleon. In no event shall Ampleon be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, Ampleon’s aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of Ampleon. Right to make changes — Ampleon reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — Ampleon products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an Ampleon product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Ampleon and its suppliers accept no liability for inclusion and/or use of Ampleon products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. Ampleon makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using Ampleon products, and Ampleon accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the Ampleon product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. Ampleon does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using Ampleon products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). Ampleon does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — Ampleon products are sold subject to the general terms and conditions of commercial sale, as published at http://www.ampleon.com/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. Ampleon hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of Ampleon products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. BLM8G0710S-60PB_S-60PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 3 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 19 of 21 BLM8G0710S-60PB(G) LDMOS 2-stage power MMIC Non-automotive qualified products — Unless this data sheet expressly states that this specific Ampleon product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. Ampleon accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without Ampleon’s warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond Ampleon’s specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies Ampleon for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond Ampleon’s standard warranty and Ampleon’s product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Any reference or use of any ‘NXP’ trademark in this document or in or on the surface of Ampleon products does not result in any claim, liability or entitlement vis-à-vis the owner of this trademark. Ampleon is no longer part of the NXP group of companies and any reference to or use of the ‘NXP’ trademarks will be replaced by reference to or use of Ampleon’s own trademarks. 14. Contact information For more information, please visit: http://www.ampleon.com For sales office addresses, please visit: http://www.ampleon.com/sales BLM8G0710S-60PB_S-60PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 3 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 20 of 21 BLM8G0710S-60PB(G) LDMOS 2-stage power MMIC 15. Contents 1 1.1 1.2 1.3 2 2.1 2.2 3 4 5 6 7 8 8.1 8.2 8.3 8.4 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 5 Possible circuit topologies . . . . . . . . . . . . . . . . 8 Ruggedness in class-AB operation. . . . . . . . . . 9 Impedance information . . . . . . . . . . . . . . . . . . . 9 Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 Handling information. . . . . . . . . . . . . . . . . . . . 17 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 19 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Contact information. . . . . . . . . . . . . . . . . . . . . 20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © Ampleon Netherlands B.V. 2018. All rights reserved. For more information, please visit: http://www.ampleon.com For sales office addresses, please visit: http://www.ampleon.com/sales Date of release: 13 September 2018 Document identifier: BLM8G0710S-60PB_S-60PBG
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