BLF8G24L-200P,118

BLF8G24L-200P; BLF8G24LS-200P Power LDMOS transistor Rev. 4 — 1 September 2015 Product data sheet 1. Product profile 1.1 General description 200 W LDMOS power transistor for base station applications at frequencies from 2300 MHz to 2400 MHz. Table 1. Typical performance Typical RF performance at Tcase = 25 C in a common source class-AB production test circuit. Test signal 1-carrier W-CDMA [1] f IDq VDS PL(AV) Gp D ACPR5M (MHz) (mA) (V) (W) (dB) (%) (dBc) 2300 to 2400 1740 28 60 17.2 32 37 [1] Test signal: 3GPP test model 1; 64 DPCH; PAR = 7.2 dB at 0.01 % probability on CCDF. 1.2 Features and benefits          Excellent ruggedness High efficiency Low Rth providing excellent thermal stability Designed for broadband operation (2300 MHz to 2400 MHz) Lower output capacitance for improved performance in Doherty applications Designed for low memory effects providing excellent pre-distortability Internally matched for ease of use Integrated ESD protection Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances (RoHS) 1.3 Applications  RF power amplifiers for base stations and multi carrier applications in the 2300 MHz to 2400 MHz frequency range BLF8G24L-200P; BLF8G24LS-200P Power LDMOS transistor 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol BLF8G24L-200P (SOT539A) 1 drain1 2 drain2 3 gate1 4 gate2 5 1 1 2 5 3 3 4 5 4 [1] source 2 sym117 BLF8G24LS-200P (SOT539B) 1 drain1 2 drain2 3 gate1 4 gate2 5 1 1 2 5 3 3 5 4 4 [1] source 2 sym117 [1] Connected to flange. 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BLF8G24L-200P - flanged balanced ceramic package; 2 mounting holes; 4 leads SOT539A BLF8G24LS-200P - earless flanged balanced ceramic package; 4 leads SOT539B 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Max Unit VDS drain-source voltage - 65 V gate-source voltage 0.5 +13 V Tstg storage temperature 65 +150 C Tj junction temperature - 200 C - 150 C [1] Product data sheet Min VGS Tcase BLF8G24L-200P_LS-200P#4 Conditions case temperature [1] Continuous use at maximum temperature will affect the MTTF. All information provided in this document is subject to legal disclaimers. Rev. 4 — 1 September 2015 © Ampleon The Netherlands B.V. 2015. All rights reserved. 2 of 13 BLF8G24L-200P; BLF8G24LS-200P Power LDMOS transistor 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-c) thermal resistance from junction to case Tcase = 80 C; PL = 60 W 0.217 K/W 6. Characteristics Table 6. DC characteristics Tj = 25 C per section, unless otherwise specified. Symbol Parameter Conditions V(BR)DSS drain-source breakdown voltage VGS = 0 V; ID = 1 mA Min Typ Max Unit 65 - - V VGS(th) gate-source threshold voltage VDS = 10 V; ID = 100 mA 1.5 1.9 2.3 V IDSS drain leakage current VGS = 0 V; VDS = 28 V - - 2.8 A IDSX drain cut-off current VGS = VGS(th) + 3.75 V; VDS = 10 V - 26.8 - A IGSS gate leakage current VGS = 11 V; VDS = 0 V - - 280 nA gfs forward transconductance VDS = 10 V; ID = 5.1 A - 1.2 - S RDS(on) drain-source on-state resistance VGS = VGS(th) + 3.75 V; ID = 5.04 A - 0.1 -  Table 7. RF characteristics Test signal: 1-carrier W-CDMA, PAR = 7.2 dB at 0.01 % probability on the CCDF, 3GPP test model 1; 64 DPCH; f1 = 2300 MHz; f2 = 2400 MHz; RF performance at VDS = 28 V; IDq = 1740 mA; Tcase = 25 C; unless otherwise specified; in a class-AB production test circuit. Symbol Parameter Min Typ Max Unit PL(AV) average output power Conditions - 60 - W Gp power gain 15.8 17.2 - dB RLin input return loss - 11 8 dB D drain efficiency 27 32 - % ACPR5M adjacent channel power ratio (5 MHz) - 37 33 dBc 7. Test information 7.1 Ruggedness in class-AB operation The BLF8G24L-200P and BLF8G24LS-200P are capable of withstanding a load mismatch corresponding to VSWR = 10 : 1 through all phases under the following conditions: VDS = 28 V; IDq = 1740 mA; PL = 200 W (CW); f = 2300 MHz. BLF8G24L-200P_LS-200P#4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 1 September 2015 © Ampleon The Netherlands B.V. 2015. All rights reserved. 3 of 13 BLF8G24L-200P; BLF8G24LS-200P Power LDMOS transistor 7.2 Impedance information Table 8. Typical impedance Measured load-pull data half section; VDS = 28 V; IDq = 860 mA; typical values unless otherwise specified. f ZS[1] ZL[1] (MHz) () () 2300 4.24  j6.5 1.5  j5.4 2400 7.47  j6.07 1.5  j5.5 [1] ZS and ZL defined in Figure 1. drain ZL gate ZS 001aaf059 Fig 1. Definition of transistor impedance 7.3 Test circuit 50 mm C3 50 mm R1 C1 C9 C11 C13 C7 C15 60 mm C16 R2 C4 C2 C10 C12 C14 C6 aaa-005517 See Table 9 for list of components. Fig 2. BLF8G24L-200P_LS-200P#4 Product data sheet Component layout All information provided in this document is subject to legal disclaimers. Rev. 4 — 1 September 2015 © Ampleon The Netherlands B.V. 2015. All rights reserved. 4 of 13 BLF8G24L-200P; BLF8G24LS-200P Power LDMOS transistor Table 9. List of components See Figure 2 for component layout. The used PCB material is Rogers RO4350B with a thickness of 0.76 mm. Component Description Value C1, C2, C9, C10 multilayer ceramic chip capacitor 6.8 F [1] C3, C4, C6, C7 multilayer ceramic chip capacitor 1 F [2] C5, C8 multilayer ceramic chip capacitor 33 pF [1] C11, C12, C13, C14 multilayer ceramic chip capacitor 0.1 F [2] C15, C16 electrolytic capacitor 1000 F; 50 V R1, R2 chip resistor 5.1  [1] American Technical Ceramics type 100B or capacitor of same quality. [2] Murata or capacitor of same quality. [3] Vishay Dale or resistor of same quality. Remarks [3] 7.4 Graphical data 7.4.1 1-Tone CW aaa-005518 19 60 Gp (dB) ηD (%) 18 50 (1) (2) Gp 17 40 16 (1) (2) ηD 30 15 20 14 10 13 0 42 44 46 48 50 52 54 PL (dBm) 56 VDS = 28 V; IDq = 1740 mA. (1) f = 2300 MHz (2) f = 2400 MHz Fig 3. BLF8G24L-200P_LS-200P#4 Product data sheet Power gain and drain efficiency as function of load power; typical values All information provided in this document is subject to legal disclaimers. Rev. 4 — 1 September 2015 © Ampleon The Netherlands B.V. 2015. All rights reserved. 5 of 13 BLF8G24L-200P; BLF8G24LS-200P Power LDMOS transistor 7.4.2 1-Tone CW pulsed aaa-005519 19 60 Gp (dB) ηD (%) 18 50 (1) (2) Gp 17 40 (1) (2) 16 ηD 30 15 20 14 10 13 0 42 44 46 48 50 52 54 PL (dBm) 56 VDS = 28 V; IDq = 1740 mA. (1) f = 2300 MHz (2) f = 2400 MHz Fig 4. Power gain and drain efficiency as function of load power; typical values 7.4.3 1-Carrier W-CDMA aaa-005685 19 60 Gp (dB) 50 ACPR5M (dBc) -30 40 -35 ηD (%) 18 aaa-005686 -25 Gp 17 (1) (2) 16 30 -40 15 20 -45 14 10 -50 0 -55 ηD (1) (2) 13 42 44 (2) (1) 46 48 50 PL (dBm) 52 42 VDS = 28 V; IDq = 1740 mA. 44 (1) f = 2300 MHz (2) f = 2400 MHz (2) f = 2400 MHz Power gain and drain efficiency as function of load power; typical values BLF8G24L-200P_LS-200P#4 Product data sheet 48 50 PL (dBm) 52 VDS = 28 V; IDq = 1740 mA. (1) f = 2300 MHz Fig 5. 46 Fig 6. Adjacent power channel ratio (5 MHz) as a function of load power; typical values All information provided in this document is subject to legal disclaimers. Rev. 4 — 1 September 2015 © Ampleon The Netherlands B.V. 2015. All rights reserved. 6 of 13 BLF8G24L-200P; BLF8G24LS-200P Power LDMOS transistor aaa-005745 8 PAR (dB) 7 6 (1) (2) 5 4 3 42 44 46 48 50 PL (dBm) 52 VDS = 28 V; IDq = 1740 mA. (1) f = 2300 MHz (2) f = 2400 MHz Fig 7. BLF8G24L-200P_LS-200P#4 Product data sheet Peak-to-average power ratio as a function of load power; typical values All information provided in this document is subject to legal disclaimers. Rev. 4 — 1 September 2015 © Ampleon The Netherlands B.V. 2015. All rights reserved. 7 of 13 BLF8G24L-200P; BLF8G24LS-200P Power LDMOS transistor 8. Package outline Flanged balanced ceramic package; 2 mounting holes; 4 leads SOT539A D A F D1 U1 B q C w2 M C M H1 1 c 2 E1 p H U2 5 L 3 A E w1 M A M B M 4 w3 M b Q e 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A mm 4.7 4.2 inches b c D D1 e E E1 11.81 0.18 31.55 31.52 9.50 13.72 11.56 0.10 30.94 30.96 9.30 9.53 9.27 F H H1 L 1.75 17.12 25.53 3.48 1.50 16.10 25.27 2.97 p Q q U1 3.30 3.05 2.26 2.01 35.56 U2 w1 41.28 10.29 0.25 41.02 10.03 w2 w3 0.51 0.25 0.185 0.465 0.007 1.242 1.241 0.374 0.375 0.069 0.674 1.005 0.137 0.130 0.089 1.625 0.405 1.400 0.010 0.020 0.010 0.540 0.165 0.455 0.004 1.218 1.219 0.366 0.365 0.059 0.634 0.995 0.117 0.120 0.079 1.615 0.395 Note 1. millimeter dimensions are derived from the original inch dimensions. 2. recommended screw pitch dimension of 1.52 inch (38.6 mm) based on M3 screw. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 10-02-02 12-05-02 SOT539A Fig 8. EUROPEAN PROJECTION Package outline SOT539A BLF8G24L-200P_LS-200P#4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 1 September 2015 © Ampleon The Netherlands B.V. 2015. All rights reserved. 8 of 13 BLF8G24L-200P; BLF8G24LS-200P Power LDMOS transistor Earless flanged balanced ceramic package; 4 leads SOT539B D A F 5 D1 D U1 H1 w2 1 c D 2 E1 U2 H E L 3 4 w3 b Q e 0 5 10 mm scale Dimensions Unit(1) w2 w3 0.25 0.25 max 0.185 0.465 0.007 1.242 1.241 0.374 0.375 0.069 0.674 1.005 0.137 0.089 1.275 0.405 inches nom 0.01 0.54 min 0.165 0.455 0.004 1.218 1.219 0.366 0.365 0.059 0.634 0.995 0.117 0.079 1.265 0.395 0.01 mm max nom min A b 4.7 11.81 c D D1 0.18 31.55 31.52 E E1 9.5 9.53 e F H H1 L Q U1 U2 1.75 17.12 25.53 3.48 2.26 32.39 10.29 1.50 16.10 25.27 2.97 2.01 32.13 10.03 13.72 4.2 11.56 0.10 30.94 30.96 9.3 9.27 Note 1. millimeter dimensions are derived from the original inch dimensions. Outline version References IEC JEDEC JEITA European projection Issue date 12-05-02 13-05-24 SOT539B Fig 9. sot539b_po Package outline SOT539B BLF8G24L-200P_LS-200P#4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 1 September 2015 © Ampleon The Netherlands B.V. 2015. All rights reserved. 9 of 13 BLF8G24L-200P; BLF8G24LS-200P Power LDMOS transistor 9. Handling information CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling electrostatic sensitive devices. Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or equivalent standards. 10. Abbreviations Table 10. Abbreviations Acronym Description 3GPP 3rd Generation Partnership Project CCDF Complementary Cumulative Distribution Function DPCH Dedicated Physical Channel CW Continuous Wave ESD ElectroStatic Discharge LDMOS Laterally Diffused Metal Oxide Semiconductor MTTF Mean Time To Failure PAR Peak-to-Average Ratio VSWR Voltage Standing Wave Ratio W-CDMA Wideband Code Division Multiple Access 11. Revision history Table 11. Revision history Document ID Release date Data sheet status BLF8G24L-200P_LS-200P v.4 20150901 Modifications: Change notice Supersedes Product data sheet BLF8G24L-200P_LS-200P v.3 • The format of this document has been redesigned to comply with the new identity guidelines of Ampleon. • Legal texts have been adapted to the new company name where appropriate. BLF8G24L-200P_LS-200P v.3 20130712 Product data sheet - BLF8G24L-200P_LS-200P v.2 BLF8G24L-200P_LS-200P v.2 20121203 Product data sheet - BLF8G24L-200P_LS-200P v.1.1 Objective data sheet - - BLF8G24L-200P_LS-200P v.1.1 20120220 BLF8G24L-200P_LS-200P#4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 1 September 2015 © Ampleon The Netherlands B.V. 2015. All rights reserved. 10 of 13 BLF8G24L-200P; BLF8G24LS-200P Power LDMOS transistor 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. Definition [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.ampleon.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Ampleon does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Ampleon sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between Ampleon and its customer, unless Ampleon and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the Ampleon product is deemed to offer functions and qualities beyond those described in the Product data sheet. 12.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon takes no responsibility for the content in this document if provided by an information source outside of Ampleon. In no event shall Ampleon be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, Ampleon’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of Ampleon. Right to make changes — Ampleon reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — Ampleon products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an BLF8G24L-200P_LS-200P#4 Product data sheet Ampleon product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Ampleon and its suppliers accept no liability for inclusion and/or use of Ampleon products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. Ampleon makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using Ampleon products, and Ampleon accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the Ampleon product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. Ampleon does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using Ampleon products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). Ampleon does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — Ampleon products are sold subject to the general terms and conditions of commercial sale, as published at http://www.ampleon.com/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. Ampleon hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of Ampleon products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. All information provided in this document is subject to legal disclaimers. Rev. 4 — 1 September 2015 © Ampleon The Netherlands B.V. 2015. All rights reserved. 11 of 13 BLF8G24L-200P; BLF8G24LS-200P Power LDMOS transistor Non-automotive qualified products — Unless this data sheet expressly states that this specific Ampleon product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. Ampleon accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without Ampleon’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond Ampleon’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies Ampleon for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond Ampleon’ standard warranty and Ampleon’ product specifications. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Any reference or use of any ‘NXP’ trademark in this document or in or on the surface of Ampleon products does not result in any claim, liability or entitlement vis-à-vis the owner of this trademark. Ampleon is no longer part of the NXP group of companies and any reference to or use of the ‘NXP’ trademarks will be replaced by reference to or use of Ampleon’s own Any reference or use of any ‘NXP’ trademark in this document or in or on the surface of Ampleon products does not result in any claim, liability or entitlement vis-à-vis the owner of this trademark. Ampleon is no longer part of the NXP group of companies and any reference to or use of the ‘NXP’ trademarks will be replaced by reference to or use of Ampleon’s own trademarks. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 13. Contact information For more information, please visit: http://www.ampleon.com BLF8G24L-200P_LS-200P#4 Product data sheet For sales office addresses, please visit: http://www.ampleon.com/sales All information provided in this document is subject to legal disclaimers. Rev. 4 — 1 September 2015 © Ampleon The Netherlands B.V. 2015. All rights reserved. 12 of 13 BLF8G24L-200P; BLF8G24LS-200P Power LDMOS transistor 14. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 7.1 7.2 7.3 7.4 7.4.1 7.4.2 7.4.3 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 3 Ruggedness in class-AB operation . . . . . . . . . 3 Impedance information . . . . . . . . . . . . . . . . . . . 4 Test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Graphical data . . . . . . . . . . . . . . . . . . . . . . . . . 5 1-Tone CW . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1-Tone CW pulsed . . . . . . . . . . . . . . . . . . . . . . 6 1-Carrier W-CDMA . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Handling information. . . . . . . . . . . . . . . . . . . . 10 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © Ampleon The Netherlands B.V. 2015. All rights reserved. For more information, please visit: http://www.ampleon.com For sales office addresses, please visit: http://www.ampleon.com/sales Date of release: 1 September 2015 Document identifier: BLF8G24L-200P_LS-200P#4