1XXD38400MLC

Serial No. : 2017-0838 DATE : 2017/10/03 HONHEVER(HK)LIMITED CRYSTAL OSCILLATOR ITEM : DSB211SDN TYPE : --------------------------------------------------------------------------------------------------------------------------------- 38.400MHz NOMINAL FREQUENCY : -------------------------------------------------------------------------------------------------------------------------------- 1XXD38400MLC SPEC No. : --------------------------------------------------------------------------------------------------------------------------------- --------------------------------------------------------------------------------------------------------------------------------- If there is a change in this specifications, the specification number may be changed. RECEIPT DATE RECEIVED (signature) (name) General Manufacture of Quartz Devices 1389 Shinzaike, Hiraoka-cho, Kakogawa, Hyogo 675-0194 Japan Phone (81)79-425-3141 Fax (81)79-425-1134 http://www.kds.info/index_en.htm C.ENG. ENG. Serial No.2017-0838 1. Device Name TCXO 2. Model Name DSB211SDN 3. Nominal Frequency 38.400 MHz 4. Mass 0.015g max. 5. Absolute Maximum Ratings 1 2 Item Supply Voltage Storage Temperature Range Symbol VCC T_STG Rating -0.3~+4.6 -55~+125 unit V C 6. Recommended Operating Conditions 1 2 3 Item Supply Voltage Load Impedance (resistance part) (parallel capacitance) Operating Temperature Range Symbol VCC LOAD_R LOAD_C T_OPR min. +2.75 9 9 -40 typ. +2.8 10 10 - max. +2.85 11 11 +85 unit V kΩ pF C 7. Electrical Characteristics (TA=-40~+85C, LOAD_R//C=10kΩ//10pF, VCC=+2.8V, unless otherwise noted) Item 1 2 3 4 5 Current Consumption Output Level Symmetry Harmonics Frequency Stability 1.Tolerance 2.vs Temperature 3.vs Slope 4.vs Supply Voltage 5.vs Load Variation 6.vs Aging 6 Frequency drift rate 7 8 Start Up Time SSB Phase Noise Conditions GND level (DC cut) After 2 times reflow Ref. to nominal frequency TA=-40~+85C Ref. to frequency (TA=+25C) TA=-40~+85C VCC=+2.8V±0.05V LOAD_R//C=(10kΩ//10pF)±10% TA=Room ambient TA=Room ambient From 0.1s to 0.5s From 0.5s to 1.5s From 1.5s onwards @90% of final Vout level Relative to f0 level offset 1kHz Relative to f0 level offset 10kHz Relative to f0 level offset 100kHz Relative to f0 level offset 1MHz min. 0.8 40/60 - Limits typ 50 - max. +2.0 60/40 -10 mA VP-P % dBc - - ±2.0 ppm - - ±0.5 ppm - - unit Notes 1 2,3 ±0.1 ppm/C ±0.2 ppm ±0.2 ppm ±1.0 ppm/year ±3.0 ppm/10years ±0.10 ppm/s ±0.015 ppm/s ±0.005 ppm/s 2.0 ms -135 dBc/Hz -149 dBc/Hz -156 dBc/Hz -156 dBc/Hz Notes 1. Clipped sine wave (DC-coupled) 2. TA=+25C 3. Please leave after reflow in 2h or more at room ambient. TITLE Remark DSB211SDN TYPE SPECIFICATION Date 2017/10/03 Spec. No. Rev. 1XXD38400MLC DAISHINKU CORP. - Page 1/13 DM-Z0002: Style-010 Ver.1 Serial No.2017-0838 8. Outline, Pin Connections Outline Pin Connections Pin No. #1 #2 #3 #4 Connection GND GND Output VCC Marking #1 Index (1) Model code BN (2) Frequency 38.4 (MHz, 3digits) (3) Logo D (4) Date code Year (1digit) +Week (2digits) 701 e.g.2017/1/1 unit: mm Dimensional Tolerance: ±0.1 (Unless otherwise noted) INDEX) 9. Measurement Circuit 1000pF T.P. mA Power Supply #3 #4 + 10000pF TCXO V - Output Vcc GND #1 GND LOAD_R #2 LOAD_C LOAD_R=10kΩ LOAD_C=10pF (Include Jig stray capacitance) TITLE Remark DSB211SDN TYPE SPECIFICATION Date 2017/10/03 Spec. No. Rev. 1XXD38400MLC DAISHINKU CORP. - Page 2/13 DM-Z0002: Style-010 Ver.1 Serial No.2017-0838 10. Mechanical Characteristics All test is performed after 3times reflow (Clause.13) except 10.10 (Resistance to soldering heat) Item 1 2 3 4 5 Drop Vibration Shock PCB bend strength Adherence nature 6 Package strength 7 Gross leak 8 Fine leak 9 Solderability 10 Resistance to soldering heat Description Requirements Natural drop (On concrete) Mounting on the set or test fixture.(Total weight 100g) Height : 150cm Direction : X,Y,Z, 6directions Test cycle : 3cycles Reference specification : EIAJ-ED-4702A Method5 Sweep range : 10~500Hz Sweep speed : 11min/cycle Amplitude : 1.5mm (10~55Hz) 2 Acceleration : 200m/s (55~500Hz) Direction : X,Y,Z, 3directions Test cycle : 10cycles Reference specification : IEC 60068-2-6 2 Acceleration : 1000m/s Direction : X,Y,Z, 6directions Duration : 6ms Test cycle : 3cycles/each directions Reference specification : IEC 60068-2-27 PWB : t=1.6mm Pressure speed : 1.0mm/s Bend width : 1 2 3mm Duration : 10±1s Reference specification : IEC 60068-2-21 Ue1 PWB : t=1.6mm Direction : X,Y, 2directions Pressure : 10N Duration : 10±1s Reference specification : IEC 60068-2-21 Ue3 Pressure : 10N Duration : 10±1s Reference specification : IEC 60068-2-77 It is immersed for 3min into +125±5C Chlorofluorocarbon (CFCs) liquid. Reference specification : IEC 60068-2-17 It shall be measured by the helium leak detector after pressurization for 60min by the pressure 5 of (3.92±0.49) x10 Pa in a helium gas atmosphere. Reference specification : IEC 60068-2-17 Solder bath temperature : +245±5C Duration : 3±0.3s Reference specification : IEC 60068-2-58 1) Solder iron method Bit size : B(φ3) Bit temperature : +350±10C Duration : 3+1/-0s /each terminal It shall be measured after 2h at room temperature, humidity. Reference specification : IEC 60068-2-20 2) Reflow In refer to temperature profile shown in clause13. Test cycle : 3cycles It shall be measured after 2h at room temperature, humidity. Reference specification : IEC 60068-2-58 TITLE df/f=