ULG107M1EE08CB

X-CON C O N D U C T I V E P O LY M E R A L U M I N U M S O L I D C A PA C I T O R S 2016-2017 Index 產品一覽表 Series Table P.3 產品體系圖 Series Chart P.3 應用指引 Application Guidelines P.4 產品編碼 Part Number System P.8 編帶產品規格 Taping Specifications P.9 成型產品規格 Lead Forming Specifications P.9 貼片產品包裝規格 Specifications for SMD Type Packing P.10 最少訂單量 Minimum Order Quantity P.10 引線式導電高分子鋁質固態電容器 Radial Leaded Type Aluminum Solid Capacitors P.11 貼片式導電高分子鋁質固態電容器 V-Chip Type Aluminum Solid Capacitors P.27 Index 目錄 Contents Index Features Low ESR obtained by using conductive polymer electrolyte • Suitable as a decoupling capacitor, because its impedance has ideal frequency characteristics. • Suitable as a smoothing capacitor, enabling miniaturizing switching power supplies, because it allows large ripple current. • Suitable as a backup capacitor for the circuits that consume large current at a high speed. Pb-free compliant • All the models are completely Pb-free and RoHS compliant products. Long life • Some special series can be expected 50,000 hours life at 85˚C suitable for long-operating equipments. Superior temperature characteristics • Its ESR has stable characteristics at a temperature from -55˚C to 105˚C (partly 125˚C), suitable for applications used at low temperatures (under 0˚C). Wide capacitance range from 1μF to 2700μF • An array of various series covers wide capacitance range. High voltage • High reliability products have achieved the highest rated voltage 200V. Applications Use as a smoothing, backup and bypass capacitor used in various fields such as digital equipments, household appliances, computer-related hardware and industrial equipment. -2- Index Series Table 產品一覽表 Series Features（特點） Temp (˚C) Voltage (VDC) Cap. (μF) Load Life Appearance Page 引線式 Radial Lead Type ULG +105˚C, High Ripple Current, Low ESR （高紋波, 低阻抗） -55 ~ +105˚C 2.5 to 35 10 to 1500 2,000 hours Low ESR P.11 ULR +105˚C, Higher Ripple Current, Lower ESR than ULG （高紋波, 比ULG更低阻抗） -55 ~ +105˚C 2.5 to 35 22 to 2700 2,000 hours Lower ESR P.14 UER +105˚C, Higher Ripple Current, Long Life 5,000 Hours （高紋波, 長壽命） -55 ~ +105˚C 2.5 to 35 100 to 2500 5,000 hours Long Life P.19 +105˚C, High Voltage, Low ESR -55 ~ +105˚C (高電壓, 低阻抗） 50 to 200 1 to 120 2.5 to 100 10 to 1200 UPG UBR +125˚C, High Temperature, Low ESR （高溫度, 低阻抗) USR -55 ~ +125˚C Discontinued Item 2,000 hours High Voltage P.22 High Temperature P.25 1,000 hours ** End of life series, replaced by ULR series. 停產系列，以ULR系列取代。 貼片式 V-Chip Type UVG +105˚C, Surface Mount Type, -55 ~ +105˚C Low ESR（貼片標準品, 低阻抗） 2.5 to 25 10 to 820 2,000 hours Low ESR V-Chip P.27 UVR +105˚C, Surface Mount Type, Lower ESR than UVG -55 ~ +105˚C （貼片標準品, 比UVG更低阻抗） 2.5 to 16 39 to 2200 2,000 hours Lower ESR V-Chip P.30 Series Chart 產品體系圖 Radial Lead Type V-Chip Type LONG LIFE UER LOW ESR ULG -55~+105˚C 2,000 hours Low ESR -55~+105˚C 5,000 hours Long Life High Voltage UVR -55~+105˚C 2,000 hours Lower ESR V-Chip UPG -55~+105˚C 2,000 hours High Voltage UVG High Temperature -55~+105˚C 2,000 hours Low ESR V-Chip UBR -55~+125˚C 1,000 hours High Temperature -3- LOW ESR ULR -55~+105˚C 2,000 hours Lower ESR Index Application Guildelines 應用指引 X-CON should be used in compliance with the following guidelines. 1. 2. Circuit Design 1.1 Prohibited Circuits Do not use the capacitors in the following circuits, because leakage current may increase. 1) Time constant circuits 2) Coupling circuits 3) Circuits which are greatly affected by leakage current 4) High impedance voltage retention circuits 1.2 Polarity X-CON is a polarized solid aluminum electrolytic capacitor with positive and negative electrodes. Do not apply reverse voltage on the capacitors, otherwise it may cause leakage current increase or life span decreased. 1.3 Voltage Applied The applied voltage is equal to the voltage value including the peak value of the transitional instantaneous voltage and that of ripple voltage, not just steady line voltage. 1) Do not apply over-rated voltage or reverse voltage as it may lead to the increase in leakage current and short circuit. 2) When DC voltage is low, a negative ripple voltage peak value must not become a reverse voltage that exceeds 10% of the rated voltage. 1.4 Restriction on Sudden Charge or Discharge Sudden charge and discharge may result in short circuits or larger leakage current. Therefore, protection circuits are suggested to build in when one of the following conditions are anticipated. 1) The rush current exceeding 10A 2) The rush current exceeding 10 times of rated ripple current of X-CON A protection resistor (1KΩ) must be inserted to the circuit during the charge and discharge when measuring the leakage current. 1.5 Ripple Current Use the capacitors within the rated ripple current. When excessive ripple current is applied to the capacitor, it may causes the increase in leakage current and short circuits due to self-heating. 1.6 Leakage Current There is a risk of leakage current increasing even if the following usage environments are within the suggested range. Owing to the self-correction mechanism, the leakage current returns to a small value in most cases after the application of voltage. 1) After soldering or re-flow 2) High temperature under no loading 3) High humidity under no loading 4) Sudden temperature changes 1.7 Capacitor Insulation 1) Insulation of the marked sleeve is not guaranteed. Be aware that the space between the case and the negative electrode terminal is not insulated and has some resistance. 2) Completely separate the case, negative lead terminal, positive lead terminal and PCB patterns with each other. 1.8 Precautions for Using Capacitors X-CON capacitors should not be used in the following environments. 1) Direct contact with salt water, oil & chemically active gases 2) Exposure direct under sunlight 3) High temperature owing to heat generating components around the X-CON and on the underside of the PCB 4) High humidity where condensation can form on the surface of the capacitor 5) Acid or alkaline environments 6) High-frequency induction 7) Excessive vibration and shock Failure and Life-span The failure rate is 0.5% / 1,000 hours (with a 60% reliability standard) based on JIS-C-5003. The mainly failure modes are as follows. 2.1 Contingency Failure The main causes of failure are thermal stresses cause by the soldering or thermal use environment, along with heat stresses, electrical stresses or mechanical stresses. The most common failure mode is a short circuit. -4- Index Application Guildelines 應用指引 a) b) 2.2 3. Phenomenon after a short circuit 1) If the pass-through current is 1A or less on Φ10, 0.5A or less on Φ8 and 0.2A or less on Φ6.3 in case of a short circuit, the X-CON will become heated, but no effects are visible even when the current is continuously carried. 2) If the short circuit currents exceed the mentioned value above, the temperature inside the X-CON will increase. The rubber sealing will be turned over and odorous gas will be released. In this case, keep your face and hands away from the area. In case a short circuit occurs, ensure safety by fully considering the followings. 1) If odorous gas is released, turn off the main power of the equipment. 2) If the gas comes in contact with eyes, rinse immediately. If the gas is inhaled, gargle immediately. 3) Do not lick the electrolyte. If the electrolyte comes in contact with skin, wash it off with soap immediately. 4) X-CON contains combustible substances. In case a large current continues to flow after a short circuit, in the worst case, the shorted-out section may ignite. For safety, install a redundant circuit or a protective circuit, etc. Wear-out Failure (Life-span) When life span exceeded the specified guarantee time of Endurance and Damp heat, electrolyte might insulate and cause electric characteristic changed. This is called an open circuit. The electric characteristics of capacitance and ESR may possibly change within the specified range in specifications when it is used under the condition of the rated voltage, electric and mechanical performance. Please note it when design. Mounting Precautions Phases Before mounting Things to be noted 1) Check the marking on the body Don’t use products without marked polar, capacitance and rated voltage. 2) Check the pitch between lead terminal and PCB Use X-CON only when the said pitch is matched. 3) Find the leakage current increased after long storage Apply the capacitor with rated voltage in series with 1KΩ resistance for 1 hour at the range between 60 and 70˚C. 4) Drop to the floor Don’t use 5) Handling Use X-CON with lead terminal and body not subject to any stress. 6) Adopt a used X-CON No re-used 1) Soldering with a soldering iron • Meet the temperature and duration requirements of out-going specification; • Not allow any stress during mounting; • Don’t let the tip of the soldering iron touch X-CON. 2) Flow soldering (for radial type) • Don’t submerge X-CON body in melted solder; • Meet the temperature and duration requirements of out-going specification; • Not allow the flux to adhere to anywhere except the lead terminal. The details for flow soldering are as follows: Mounting After mounting Disposition Temperature Duration Flow times Preheating ≤120˚C (ambient temp.) ≤120sec. 1 Soldering conditions ≤(260±5)˚C ≤(10±1)sec. ≤2 3) Reflow soldering (for SMD type) Allow for UVG, UVR series. (see page 7 for details) 1) Handling • Do not tilt, bend, twist X-CON; • Do not allow other things touching X-CON. 2) Wash the PCB (Suggested cleaning agents • High quality alcohol-based cleaning fluids such as st-100s, 750L, 750M; • Detergents including substitute freon such as AK-225AES and IPA) • Use immersion or ultrasonic waves to clean for a total of less than 5 minutes and adjust the temperature of the agents not higher than 60˚C; • Observe the contamination of the agents (conductivity, pH, specific gravity, water cleaning and etc.); • Dry X-CON in hot air with the air temperature less than the maximum operating temperature. -5- Index Application Guildelines 應用指引 4. Reflow Soldering Conditions Item Recommended Condition 1 Recommended Condition 2 Peak Temperature 260˚C or less 250˚C or less Preheating 150˚C to 180˚C 90 seconds 150˚C to 180˚C 90 seconds A 200˚C and higher Within 60 seconds 200˚C and higher Within 60 seconds B 230˚C and higher Within 40 seconds 230˚C and higher Within 40 seconds The number of reflow Only 1 time Twice or less All temperatures are measured on the topside of the AI-can and terminal surface. Attention: Reflow soldering may reduce the capacitance of products before or after soldering even if meeting soldering conditions per Recommended Reflow Condition. Soldering considerably deviating from these conditions will cause problems such as a 50% reduction in capacitance, and a considerable increase in leakage current. Thus, the peak temperature at the top of AIcase/Electrode terminals and the duration of the reflow over 200˚C should not exceed the specifications. 5. Emergency Procedure If the capacitor is overheated, the resin case may emit smoke. If this occurs, immediately switch off the unit’s main power supply to stop operation. Keep your body away from the capacitor as the temperature may be high enough to cause the capacitor to ignite and burn. 6. Disposal and Storage Conditions 6.1 Disposal Since capacitors are composed of various metals and resins, dispose them as industrial waste. 6.2 Storage Conditions 1) Do not store the X-CONs in the environment of high temperature and high humidity, or in the location subject to direct sunlight. The X-CONs should be stored under the conditions within 5˚C ~ 35˚C and relative humidity below 75%; 2) Store the X-CONs in the condition as they are shipped to keep good solder ability. SMD types (UVR and UVG series) should be sealed in specifically designed aluminum laminate bags to avoid deterioration in characteristics and solder ability before and after reflows, which results from moisture absorption; 3) Store the X-CONs in sealed package bags after delivery per the table below; 4) 5) 6) X-CON type Before unsealing After unsealing Radial lead type packed in bags Must be used within 24 months after delivery (unsealed status) Must be used within a week (opened status) Radial lead type packed in taping method Must be used within 24 months after delivery (unsealed status) Must be used within a week (opened status) SMD type Must be used within 24 months after delivery (unsealed status) Must be used within a week (opened status) Don’t open package bags until mounting, and use up all products once open. In case of leftovers, pack radial lead types in bags, return SMD types and unpackaged ones back into special storage bags (designed aluminum laminate bags for SMD types), and seal up the opening. Put radial lead types with taping in plastic bags as they are put into storage boxes and seal up the opening, too. Regarding leftover storage, please follow the storage instructions as shown in above table; Don’t store X-CONs in damp conditions or as stated in Item 1.8; Don’t store X-CONs in places filled with toxic gases or susceptible to ozone, ultraviolet ray and radiation. -6- Index Application Guildelines 應用指引 7. Compliance with RoHS Directive Our company is committed to comply with the European Union Restriction of Hazardous Substance (RoHS) Directive. We hereby guarantee that our products do not contain the following materials exceeding the content regulated in RoHS Directive. 8. ≤1000ppm ≤1000ppm Cadmium (Cd) ≤100ppm Hexavalent Chromium, Cr6+ ≤1000ppm Polybrominated Biphenyls (PBBs) ≤1000ppm Polybrominated Diphenyl Ethers (PBDEs) ≤1000ppm Halogen Free Compliant The products identified in the catalogue, and their homogeneous subcomponents, do not contain any of the following substances in concentrations greater than the listed maximum limits. 9. Lead (Pb) Mercury (Hg) Substance Maximum Limit (ppm) Bromine (Br) 900 ppm (0.09%) Chlorine (CI) 900 ppm (0.09%) Total concentration of Chlorine (CI) + Bromine (Br) 1500 ppm (0.15%) Reliability Presumption of Life Lx: Life expectance (Hours) in actual use (Tx) L0: Guaranteed (Hours) at maximum temperature (T0) T0: Maximum operating temperature (˚C) Tx: Temperature in actual use (Ambient temperature of X-CON) (˚C) Owing to the excellent heat-proof characteristics of conductive polymer, the estimated life expectancy can be calculated without consideration of self-heating under application of the ripple current. 10. General Electrical Characteristics of X-CON -7- Index Part Number System 產品編碼 1 2 3 4 5 6 7 8 9 10 11 12 13 14 ULR 567 M 0G F 08 RR Series Capacitance Tolerance Voltage Case Dia. Case Length Type Series Cap. (μF) Code Tol. (%) Code Vol. (V) Code Dia. (mm) Code Len. (mm) Code Feature Code ULG 3.3 335 ±20 M 2.5 0E 4 C 4.2 42 Bulk RR ULR 10 106 4 0G 5 D 4.5 45 UER 22 226 6.3 0J 5.5 X 5 05 Lead Cut & Form CB UPG 33 336 6.8 06 6.3 E 5.5 55 UBR 47 476 7 0S 8 F 6 06 Taping F=2.0mm TT UVG 68 686 7.5 07 10 G 6.5 65 UVR 100 107 10 1A 7 07 Taping F=2.5mm TU 150 157 12 10 7.5 75 180 187 14 14 8 08 Taping F=3.5mm TV 220 227 16 1C 8.5 85 270 277 20 1D 9 09 Taping F=5.0mm TC 330 337 25 1E 10 10 Tape & Reel TR 390 397 35 1V 10.2 T2 470 477 50 1H 10.5 1K 560 567 63 1J 11 11 680 687 80 1K 11.5 1A 820 827 100 2A 12 12 1000 108 200 2D 12.5 1B 1200 128 16 16 1500 158 1800 188 2200 228 2500 258 2700 278 -8- Index Taping Specifications 編帶產品規格 Specifications Item Dimensions (mm) Reference Figure Fig. 1 Fig. 2 Diameter D 4 5 6.3 8 10 Height A 5~11 7~11 8~11 8~11.5 12.5 Lead Diameter d±0.05 0.45~0.6 0.45~0.6 0.45~0.6 0.6 0.6 Component Spacing P±1.0 12.7 12.7 12.7 12.7 12.7 Pitch of sprocket holes P0±0.2 12.7 12.7 12.7 12.7 12.7 Distance between centers of terminal and the sprocket holes P1±0.5 5.35 5.35 5.1 4.6 3.85 Distance between centers of the component and the sprocket holes P2±1.0 6.35 6.35 6.35 6.35 6.35 F--0.5 2.0 2.0 2.5 3.5 5.0 W±0.5 18.0 18.0 18.0 18.0 18.0 Distance between centers of component leads Carrier tape width Hold down tape width +0.8 W0 7.0min 7.0min 7.0min 7.0min 7.0min Distance between the center of upper edge of carrier tape and sprocket hole W1±0.5 9.0 9.0 9.0 9.0 9.0 Distance between the upper edges of the carrier tape and the hold down tape W2 3max 3max 3max 3max 3max 18.5 18.5 18.5 18.5 18.5 Distance between the abscissa and the bottom of the components body +0.75 --0.5 H Distance between the abscissa and the reference plane of the components with crimped leads H0±0.5 – – – – – Max. lateral deviation of the component body vertical to the tape plane △h±1.0 0 0 0 0 0 Lead Forming Specifications 成型產品規格 CB Type Shape Code CB ΦD 5 6.3 8 (Unit: mm) 10 F 2.0 2.5 3.5 5.0 H 3.2 3.2 3.2 3.2 Φd±0.05 -9- L