Approval sheet
MR12, MR10, MR08, MR06, MR04
1%, 5%
Thick film General Purpose Chip Resistors
Size 1206, 1210, 0805, 0603, 0402
Automotive & Military Qualified
*Contents in this sheet are subject to change without prior notice.
Page 1 of 9
ASC_MR_V08
DEC 2016
Approval sheet
FEATURE
1. High reliability and stability ±1%
2. Sulfuration resistant
3. Automotive AEC Q-200 & Military MIL-STD qualified
4. 100% CCD inspection
5. RoHS 2 compliant and Halogen free products
APPLICATION
Automotive application
Consumer electrical equipment
EDP, Computer application
Telecom application
DESCRIPTION
The resistors are constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are
added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The
composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to
within tolerance by laser cutting of this resistive layer.
The resistive layer is covered with a protective coat. Finally, the two external end terminations are added. For
ease of soldering the outer layer of these end terminations is a Tin (lead free) alloy.
Fig 1. Construction of a Chip-R
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ASC_MR_V08
DEC 2016
Approval sheet
QUICK REFERENCE DATA
Item
General Specification
Series No.
MR10
MR12
MR08
MR06
MR04
Size code
1210(3225)
1206(3216)
0805(2012)
0603(1608)
0402(1005)
Resistance
Range
1~10M (5% tolerance), Jumper
1~10M (1% tolerance)
Resistance
Tolerance
1%
5%
1%
5%
1%
5%
1%
5%
1%
5%
E96/E24
E24
E96/E24
E24
E96/E24
E24
E96/E24
E24
E96/E24
E24
TCR (ppm/C)
R > 1M
200
200
200
200
200
10 < R ≦ 1M
100
100
100
100
100
-200~+400
-200~+400
-200~+400
-200~+400
-200~+400
Max. dissipation
@ Tamb=70C
1/2 W
1/4 W
1/4 W
1/8 W
1/10 W
Max. Operation
Voltage (DC or
RMS)
200V
200V
150V
75V
50V
Max. Overload
Voltage (DC or
RMS)*1
400V
400V
300V
150V
100V
R ≦ 10
Operation
temperature
-55 ~ +155C
Storage temp.
5 ~ 40C
Note : *1 max. 5 sec
1.
This is the maximum voltage that may be continuously supplied to the resistor element, see “IEC publication
60115-8”
2.
Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined by
RCWV RatedPower Resistance Value or Max. RCWV listed above, whichever is lower.
3.
The resistance of Jumper is defined 1M
P : Jumper
: 7” Reeled taping
L
Termination
code
L = Sn base
(lead free)
Q : 10” Reeled taping
G : 13” Reeled taping
Resistance code
1%, E24+E96: 3 significant
digits followed by no. of
zeros
B
: Bulk
E96: 37.4K = 3742
E24: 220 = 2200
* Anti-Sulfuration test conditions: ASTM B-809-95 60’C, RH 90%, 500hrs, criteria: +/-1% !
MR10, MR12,MR08,MR06:
1.
Reeled tape packaging : 8mm width paper taping 5000pcs per 7” reel, 10kpcs per 10” reel, 20kpcs per 13” reel.
2.
Bulk packaging
: 5000pcs per poly-bag
MR04:
1.
2.
Reeled tape packaging : 8mm width paper taping 10,000pcs per reel,
Bulk packaging
Page 6 of 9
: 10,000pcs per poly-bag
ASC_MR_V08
DEC 2016
Approval sheet
TEST AND REQUIREMENTS
Essentially all tests are carried out according to the schedule of IEC publication 115-8, category
LCT/UCT/56(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp
heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.
The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical
robustness testing procedure for electronic components" and under standard atmospheric conditions according
to IEC 60068-1, sub-clause 5.3. Unless otherwise specified, the following value supplied :
Temperature: 15°C to 35°C.
Relative humidity: 45% to 75%.
Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).
All soldering tests are performed with midly activated flux.
TEST
PROCEDURE / TEST METHOD
Electrical Characteristics - DC resistance values measurement
- Temperature Coefficient of Resistance (T.C.R)
JISC5201-1: 1998
Clause 4.8
REQUIREMENTS
Resistance
0
Within the specified tolerance
Refer to “QUICK REFERENCE DATA”
Natural resistance change per change in degree centigrade.
R2 R1
106
R1 t2 t1
(ppm/C)
t1 : 20°C+5°C-1°C
R1 : Resistance at reference temperature
R2 : Resistance at test temperature
Resistance to soldering
heat (R.S.H)
Un-mounted chips completely immersed for 10±1second in a R/R max. (0.5%+0.05)
SAC solder bath at 270℃±5ºC
No visible damage
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