BUJ303AX,127

BUJ303AX NPN power transistor 9 October 2018 Product data sheet 1. General description High voltage, high speed, planar passivated NPN power switching transistor in a SOT186A (TO220F) "full pack" plastic package. 2. Features and benefits • • • • Fast switching Isolated package Very high voltage capability Very low switching and conduction losses 3. Applications • • • • DC-to-DC converters High frequency electronic lighting ballasts Inverters Motor control systems 4. Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit ICM peak collector current Fig. 1; Fig. 2; Fig. 3 - - 10 A Ptot total power dissipation Th ≤ 25 °C; Fig. 4 - - 32 W VCESM collector-emitter peak voltage VBE = 0 V - - 1000 V IC = 5 mA; VCE = 5 V; Th = 25 °C; Fig. 11 10 22 35 IC = 500 mA; VCE = 5 V; Th = 25 °C; Fig. 11 14 25 35 Static characteristics hFE DC current gain BUJ303AX WeEn Semiconductors NPN power transistor 5. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline 1 B base 2 C collector 3 E emitter mb n.c. mounting base; isolated Graphic symbol C mb B E sym123 1 2 3 TO-220F (SOT186A) 6. Ordering information Table 3. Ordering information Type number BUJ303AX BUJ303AX Product data sheet Package Name Description Version TO-220F plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3-lead TO-220 "full pack" SOT186A All information provided in this document is subject to legal disclaimers. 9 October 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 2 / 13 BUJ303AX WeEn Semiconductors NPN power transistor 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCESM collector-emitter peak voltage VBE = 0 V - 1000 V VCEO collector-emitter voltage IB = 0 A - 500 V IC collector current Fig. 1; Fig. 2; Fig. 3 - 5 A ICM peak collector current - 10 A IB base current - 2 A IBM peak base current - 4 A Ptot total power dissipation - 32 W Tstg storage temperature -65 150 °C Tj junction temperature - 150 °C DC Th ≤ 25 °C; Fig. 4 VCC LC IBon VBB LB 003aag028 12 VCL(CE) probe point IC (A) 8 DUT 001aab999 VCL(CE) ≤ 1000 V; VCC = 150 V; VBB = - 5 V; LB = 1 µH; LC = 200 µH 4 Fig. 1. Test circuit for reverse bias safe operating area 0 0 400 800 1200 VCEclamp (V) Tj ≤ Tj(max) °C Fig. 2. Reverse bias safe operating area BUJ303AX Product data sheet All information provided in this document is subject to legal disclaimers. 9 October 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 3 / 13 BUJ303AX WeEn Semiconductors NPN power transistor 003aag029 102 IC (A) duty cycle = 0.01 10 ICMmax ICmax II(3) tp = 10 µs (1) 100 µs 1 (2) 1 ms I(3) 10-1 10 ms DC 10-2 III(3) 1 102 10 103 VCEclamp (V) (1) Ptot maximum and Ptot peak maximum lines. (2) Second breakdown limits. (3) I = Region of permissible DC operation. II = Extension for repetitive pulse operation. III = Extension during turn-on in single transistor converters provided that RBE ≤ 100 Ω and tp ≤ 0.6 μs. Fig. 3. Forward bias safe operating area for Tmb ≤ 25 °C 03aa13 120 Pder (%) 80 40 0 0 50 100 150 Th (°C) 200 Fig. 4. Normalized total power dissipation as a function of heatsink temperature BUJ303AX Product data sheet All information provided in this document is subject to legal disclaimers. 9 October 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 4 / 13 BUJ303AX WeEn Semiconductors NPN power transistor 8. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-h) thermal resistance from junction to heatsink with heatsink compound; Fig. 5 - - 3.95 K/W Rth(j-a) thermal resistance from junction to ambient free air in free air - 55 - K/W 003aag067 10 Zth(j-h) (K/W) δ = 0.5 1 0.2 0.1 0.05 10-1 10-2 0.02 Ptot 0 δ= tp 10-3 10-6 10-5 10-4 10-3 10-2 10-1 1 tp T t T 10 tp (s) 102 Fig. 5. Transient thermal impedance from junction to heatsink as a function of pulse duration 9. Isolation characteristics Table 6. Isolation characteristics Symbol Parameter Conditions Min Typ Max Unit Visol(RMS) RMS isolation voltage 50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %; Th = 25 °C; from all terminals to external heatsink; clean and dust free - - 2500 V Cisol isolation capacitance from collector to external heatsink; f = 1 MHz; Th = 25 °C - 10 - pF BUJ303AX Product data sheet All information provided in this document is subject to legal disclaimers. 9 October 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 5 / 13 BUJ303AX WeEn Semiconductors NPN power transistor 10. Characteristics Table 7. Characteristics Symbol Parameter Conditions Min Typ Max Unit collector-emitter cut-off VBE = 0 V; VCE = 1000 V; Measured current (base shorted) with half-sine wave voltage (curve tracer) - - 1 mA - - 2 mA ICBO collector-base cut-off current (emitter open) VCB = 1000 V; IE = 0 A; Th = 25 °C; Measured with half-sine wave voltage (curve tracer) - - 1 mA ICEO collector-emitter cut-off VCE = 500 V; IB = 0 A; Th = 25 °C; current (base open) Measured with half-sine wave voltage (curve tracer) - - 0.1 mA IEBO emitter-base cut-off VEB = 9 V; IC = 0 A; Th = 25 °C current (collector open) - - 0.1 mA VCEOsus collector-emitter sustaining voltage (base open) IB = 0 A; IC = 100 mA; LC = 25 mH; Th = 25 °C; Fig. 6; Fig. 7 500 - - V VCEsat collector-emitter saturation voltage IC = 3 A; IB = 0.6 A; Th = 25 °C; Fig. 8; Fig. 9 - 0.35 1.5 V VBEsat base-emitter saturation IC = 3 A; IB = 0.6 A; Th = 25 °C; Fig. 10 voltage - 1.01 1.3 V hFE DC current gain IC = 5 mA; VCE = 5 V; Th = 25 °C; Fig. 11 10 22 35 IC = 500 mA; VCE = 5 V; Th = 25 °C; Fig. 11 14 25 35 IC = 2.5 A; VCE = 5 V; Th = 25 °C; Fig. 11 10 13.5 17 IC = 3 A; VCE = 5 V; Th = 25 °C; Fig. 11 - 11 - - 3.3 4 µs - 0.33 0.45 µs IC = 2.5 A; IBon = 0.5 A; VBB = -5 V; LB = 1 µH; Th = 25 °C; Fig. 14; Fig. 15 - 1.4 1.6 µs IC = 2.5 A; IBon = 0.5 A; VBB = -5 V; LB = 1 µH; Th = 100 °C; Fig. 14; Fig. 15 - 1.7 1.9 µs IC = 2.5 A; IBon = 0.5 A; VBB = -5 V; LB = 1 µH; Th = 25 °C; Fig. 14; Fig. 15 - 145 160 ns IC = 2.5 A; IBon = 0.5 A; VBB = -5 V; LB = 1 µH; Th = 100 °C; Fig. 14; Fig. 15 - 160 200 ns Static characteristics ICES hFEsat DC saturation current gain Dynamic characteristics (switching times - resistive load) ts turn-off delay time tf fall time IC = 2.5 A; IBon = 0.5 A; IBoff = -0.5 A; RL = 75 Ω; Th = 25 °C; Fig. 12; Fig. 13 Dynamic characteristics (switching times - inductive load) ts tr turn-off delay time rise time BUJ303AX Product data sheet All information provided in this document is subject to legal disclaimers. 9 October 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 6 / 13 BUJ303AX WeEn Semiconductors NPN power transistor IC (mA) 50 V 100 Ω to 200 Ω horizontal oscilloscope 250 vertical 6V 300 Ω 1Ω 100 30 Hz to 60 Hz 001aab987 10 0 Fig. 6. Test circuit for collector-emitter sustaining voltage min VCE (V) VCEOsus 001aab988 Fig. 7. Oscilloscope display for collector-emitter sustaining voltage test waveform 003aag032 003aag031 2.0 VCEsat (V) 1.6 0.5 VCEsat (V) IC = 1 A 2A 3A 4A 0.4 1.2 0.3 0.8 0.2 0.4 0.1 0 10-1 1 IC (A) 0 10-2 10 Fig. 8. Collector-emitter saturation voltage as a function of collector current; typical values Product data sheet 1 Tj = 25 °C IC / IB = 4 BUJ303AX 10-1 IB (A) 10 Fig. 9. Collector-emitter saturation voltage as a function of base current; typical values All information provided in this document is subject to legal disclaimers. 9 October 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 7 / 13 BUJ303AX WeEn Semiconductors NPN power transistor 003aag033 1.4 VBEsat (V) 1.2 003aag034 102 hFE VCE = 5 V 1.0 0.8 10 0.6 0.4 1V 0.2 0 10-1 1 IC (A) 1 10-2 10 Fig. 10. Base-emitter saturation voltage as a function of collector current; typical values 10 IC (A) Fig. 11. DC current gain as a function of collector current; typical values IC VCC ICon 90 % 90 % RL RB 1 Tj = 25 °C IC / IB = 4 VIM 0 10-1 DUT 10 % tp T 001aab989 IB ts ton t toff IBon VIM= - 6 to + 8 V; VCC = 250 V; tp = 20 us; δ = tp/T = 0.01 RB and RL calculated from ICon and IBon requirements. tf 10 % t Fig. 12. Test circuit for resistive load switching tr ≤ 30 ns - IBoff 001aab990 Fig. 13. Switching times waveforms for resistive load BUJ303AX Product data sheet All information provided in this document is subject to legal disclaimers. 9 October 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 8 / 13 BUJ303AX WeEn Semiconductors NPN power transistor VCC IC ICon 90 % LC IBon VBB LB DUT 001aab991 10 % VCC = 300 V; VBB = - 5 V; LC = 200 μH; LB = 1 μH IB Fig. 14. Test circuit for inductive load switching tf ts toff t IBon t - IBoff 001aab992 Fig. 15. Switching times waveforms for inductive load BUJ303AX Product data sheet All information provided in this document is subject to legal disclaimers. 9 October 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 9 / 13 BUJ303AX WeEn Semiconductors NPN power transistor 11. Package outline Fig. 16. Package outline TO-220F (SOT186A) BUJ303AX Product data sheet All information provided in this document is subject to legal disclaimers. 9 October 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 10 / 13 BUJ303AX WeEn Semiconductors NPN power transistor Right to make changes — WeEn Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. 12. Legal information Suitability for use — WeEn Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an WeEn Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. WeEn Semiconductors and its suppliers accept no liability for inclusion and/or use of WeEn Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Data sheet status Document status [1][2] Product status [3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] [2] [3] Definition Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. WeEn Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Please consult the most recently issued document before initiating or completing a design. The term 'short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.ween-semi.com. Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local WeEn Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between WeEn Semiconductors and its customer, unless WeEn Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the WeEn Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, WeEn Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. WeEn Semiconductors takes no responsibility for the content in this document if provided by an information source outside of WeEn Semiconductors. In no event shall WeEn Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, WeEn Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of WeEn Semiconductors. BUJ303AX Product data sheet Customers are responsible for the design and operation of their applications and products using WeEn Semiconductors products, and WeEn Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the WeEn Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. WeEn Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using WeEn Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). WeEn does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific WeEn Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. WeEn Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without WeEn Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond WeEn Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies WeEn Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond WeEn Semiconductors’ standard warranty and WeEn Semiconductors’ product specifications. All information provided in this document is subject to legal disclaimers. 9 October 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 11 / 13 BUJ303AX WeEn Semiconductors NPN power transistor Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. BUJ303AX Product data sheet All information provided in this document is subject to legal disclaimers. 9 October 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 12 / 13 BUJ303AX WeEn Semiconductors NPN power transistor 13. Contents 1. General description......................................................1 2. Features and benefits.................................................. 1 3. Applications.................................................................. 1 4. Quick reference data....................................................1 5. Pinning information......................................................2 6. Ordering information....................................................2 7. Limiting values............................................................. 3 8. Thermal characteristics............................................... 5 9. Isolation characteristics...............................................5 10. Characteristics............................................................ 6 11. Package outline........................................................ 10 12. Legal information..................................................... 11 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved For more information, please visit: http://www.ween-semi.com For sales office addresses, please send an email to: salesaddresses@ween-semi.com Date of release: 9 October 2018 BUJ303AX Product data sheet All information provided in this document is subject to legal disclaimers. 9 October 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 13 / 13